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T.P. Van Doren

Bio: T.P. Van Doren is an academic researcher from Missouri University of Science and Technology. The author has contributed to research in topics: Electromagnetic interference & Printed circuit board. The author has an hindex of 27, co-authored 69 publications receiving 2402 citations. Previous affiliations of T.P. Van Doren include University of Missouri & Hewlett-Packard.


Papers
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Journal ArticleDOI
TL;DR: In this paper, two EMI source mechanisms have been identified: one associated with a differential-mode voltage and another associated with differential mode current, both of which result in a common-mode current on an attached cable.
Abstract: Fundamental EMI source mechanisms leading to common-mode radiation from printed circuit boards with attached cables are presented in this paper. Two primary EMI source mechanisms have been identified: one associated with a differential-mode voltage and another associated with a differential-mode current, both of which result in a common-mode current on an attached cable. These mechanisms can he used to relate printed circuit layout geometries to EMI sources. The two mechanisms are demonstrated through numerical and experimental results, and an example from a production printed-circuit design is presented.

246 citations

Journal ArticleDOI
TL;DR: In this article, a decoupling strategy for multilayer boards must account for the low inductance and relatively high capacitance of the power bus, which is not appropriate for one-sided or two-sided printed circuit boards.
Abstract: Guidelines for the selection and placement of decoupling capacitors that work well for one-sided or two-sided printed circuit boards are not appropriate for multilayer boards with power and ground planes. Boards without internal planes take advantage of the power bus inductance to help decouple components at the higher frequencies. An effective decoupling strategy for multilayer boards must account for the low inductance and relatively high capacitance of the power bus. >

200 citations

Journal ArticleDOI
TL;DR: In this paper, the FDTD model was used to investigate the EMI from a test enclosure with slots and apertures excited by interior sources in a rectangular test enclosure, and the results indicated that radiation at cavity mode resonances through slots and aperture modes of nonresonant dimensions can be as significant as radiation at aperture or slot resonances.
Abstract: Electromagnetic interference (EMI) from slots and apertures resulting from coupling of interior sources through enclosure cavity modes in a rectangular test enclosure is reported. EMI from a specially designed test enclosure with slots or apertures excited by interior sources was studied experimentally and with finite-difference time-domain (FDTD) modeling. The measurements and FDTD modeling agree well. The results indicate that radiation at cavity mode resonances through slots and apertures of nonresonant dimensions can be as significant as the radiation at aperture or slot resonances. The agreement between the FDTD modeling and measurements demonstrates the usefulness of FDTD for investigating aspects of shielding enclosure design such as coupling to slots and apertures and slot interactions.

165 citations

Journal ArticleDOI
TL;DR: In this article, the authors investigated the effect of placing SMT capacitors in proximity to ICs in multilayer PCB designs and demonstrated that local decoupling can provide high-frequency benefits for certain PCB geometries through mutual inductive coupling between closely spaced vias.
Abstract: Noise on a dc power-bus that results from device switching, as well as other potential mechanisms, is a primary source of many signal integrity (SI) and electromagnetic interference (EMI) problems. Surface mount technology (SMT) decoupling capacitors are commonly used to mitigate this power-bus noise. A critical design issue associated with this common practice in high-speed digital designs is placement of the capacitors with respect to the integrated circuits (ICs). Local decoupling, namely, placing SMT capacitors in proximity to ICs, is investigated in this study. Multilayer PCB designs that employ entire layers or area fills for power and ground in a parallel plate structure are considered. The results demonstrate that local decoupling can provide high-frequency benefits for certain PCB geometries through mutual inductive coupling between closely spaced vias. The associated magnetic flux linkage is between the power and ground layers. Numerical modeling using an integral equation formulation with circuit extraction is used to quantify the local decoupling phenomenon. Local decoupling can effectively reduce high-frequency power-bus noise, though placing capacitors adjacent to ICs may limit routing flexibility, and tradeoffs need to be made based on design requirements. Design curves are generated as a function of power-bus layer thickness and SMT capacitor/IC spacing using the modeling approach to quantify the power-bus noise reduction for decoupling capacitors located adjacent to devices. Measurement data is provided to corroborate the modeling approach.

135 citations

Journal ArticleDOI
TL;DR: In this paper, the discharge current and the transient fields of an ESD generator in the contact mode are numerically simulated using the finite-difference time-domain method, and the simulated data are used to study the effect of design choices on the current and fields.
Abstract: The discharge current and the transient fields of an electrostatic discharge (ESD) generator in the contact mode are numerically simulated using the finite-difference time-domain method. At first the static field is established. Then the conductivity of the relay contact is changed, which initiates the discharge process. The simulated data are used to study the effect of design choices on the current and fields. They are compared to measured field and current data using a multidecade broadband field and current sensors. The model allows accurate prediction of the fields and currents of ESD generators, thus it can be used to evaluate different design choices.

130 citations


Cited by
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Journal ArticleDOI
TL;DR: In this article, the inherent relationship between the structural characteristics and the thermoelectric performance of tin selenide (SnSe) is discussed, including the thermodynamics, crystal structures, and electronic structures.

389 citations

Book
25 Jan 2011
TL;DR: This book guides the reader through the foundational theory of the FDTD method starting with the one-dimensional transmission-line problem and then progressing to the solution of Maxwell's equations in three dimensions.
Abstract: Introduction to the Finite-Difference Time-Domain (FDTD) Method for Electromagnetics provides a comprehensive tutorial of the most widely used method for solving Maxwell's equations -- the Finite Difference Time-Domain Method. This book is an essential guide for students, researchers, and professional engineers who want to gain a fundamental knowledge of the FDTD method. It can accompany an undergraduate or entry-level graduate course or be used for self-study. The book provides all the background required to either research or apply the FDTD method for the solution of Maxwell's equations to practical problems in engineering and science. Introduction to the Finite-Difference Time-Domain (FDTD) Method for Electromagnetics guides the reader through the foundational theory of the FDTD method starting with the one-dimensional transmission-line problem and then progressing to the solution of Maxwell's equations in three dimensions. It also provides step by step guides to modeling physical sources, lumped-circuit components, absorbing boundary conditions, perfectly matched layer absorbers, and sub-cell structures. Post processing methods such as network parameter extraction and far-field transformations are also detailed. Efficient implementations of the FDTD method in a high level language are also provided. Table of Contents: Introduction / 1D FDTD Modeling of the Transmission Line Equations / Yee Algorithm for Maxwell's Equations / Source Excitations / Absorbing Boundary Conditions / The Perfectly Matched Layer (PML) Absorbing Medium / Subcell Modeling / Post Processing

288 citations

Journal ArticleDOI
TL;DR: In this paper, two EMI source mechanisms have been identified: one associated with a differential-mode voltage and another associated with differential mode current, both of which result in a common-mode current on an attached cable.
Abstract: Fundamental EMI source mechanisms leading to common-mode radiation from printed circuit boards with attached cables are presented in this paper. Two primary EMI source mechanisms have been identified: one associated with a differential-mode voltage and another associated with a differential-mode current, both of which result in a common-mode current on an attached cable. These mechanisms can he used to relate printed circuit layout geometries to EMI sources. The two mechanisms are demonstrated through numerical and experimental results, and an example from a production printed-circuit design is presented.

246 citations