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Takahiro Shirakashi

Researcher at Tokyo Denki University

Publications -  71
Citations -  1286

Takahiro Shirakashi is an academic researcher from Tokyo Denki University. The author has contributed to research in topics: Machining & Finite element method. The author has an hindex of 16, co-authored 71 publications receiving 1170 citations. Previous affiliations of Takahiro Shirakashi include Tokyo Institute of Technology.

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Analytical prediction of cutting tool wear

TL;DR: In this paper, an analytical method is presented which enables the crater and flank wear of tungsten carbide tools to be predicted for a wide variety of tool shapes and cutting conditions in practical turning operations based on orthogonal cutting data from machining and two wear characteristic constants.
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Analytical Prediction of Three Dimensional Cutting Process—Part 3: Cutting Temperature and Crater Wear of Carbide Tool

TL;DR: In this paper, the authors proposed an energy-based method to predict chip formation and cutting force for a single point tool of arbitrary geometry, using the predicted results together with an assumption made on the stress distribution on the tool face, the temperature distribution within chip and tool is obtained through a numerical analysis.
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FEM analysis of cutting sequence effect on mechanical characteristics in machined layer

TL;DR: In this paper, the residual stress and strain after machining in the workpiece are affected by the flow stress characteristic of the work piece and the cutting conditions, like tool geometry and cutting speed.
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Prediction model of surface residual stress within a machined surface by combining two orthogonal plane models

TL;DR: In this paper, a process model using the finite element method is proposed and the mechanical effects of the tool's corner radius and feed rate on a machined surface were discussed and the simulated results show quantitative agreement with the residual stress measured experimentally.
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Some experiments on the scratching of silicon:: In situ scratching inside an SEM and scratching under high external hydrostatic pressures

TL;DR: In this paper, in situ scratching of silicon with a diamond stylus inside a scanning electron microscope (SEM) using a specially designed tribometer and scratching under zero and high (400 MPa) external hydrostatic pressures was conducted.