Terrence W. Simon

Bio: Terrence W. Simon is an academic researcher from University of Minnesota. The author has contributed to research in topics: Heat transfer & Turbulence. The author has an hindex of 37, co-authored 305 publications receiving 5025 citations. Previous affiliations of Terrence W. Simon include Motorola & DuPont.

Heat transfer and fluid mechanics measurements in transitional boundary layers on convex-curved surfaces.

Abstract: The test section of the present experiment to ascertain the effects of convex curvature and freestream turbulence on boundary layer momentum and heat transfer during natural transition provided a two-dimensional boundary layer flow on a uniformly heated curved surface, with bending to various curvature radii, R. Attention is given to results for the cases of R = infinity, 180 cm, and 90 cm, each with two freestream turbulence intensity levels. While the mild convex curvature of R = 180 cm delays transition, further bending to R = 90 cm leads to no signifucant further delay of transition. Cases with both curvature and higher freestream disturbance effects exhibit the latter's pronounced dominance. These data are pertinent to the development of transition prediction models for gas turbine blade design.

Boundary Layer Theory

Abstract: The boundary layer equations for plane, incompressible, and steady flow are $$\matrix{ {u{{\partial u} \over {\partial x}} + v{{\partial u} \over {\partial y}} = - {1 \over \varrho }{{\partial p} \over {\partial x}} + v{{{\partial ^2}u} \over {\partial {y^2}}},} \cr {0 = {{\partial p} \over {\partial y}},} \cr {{{\partial u} \over {\partial x}} + {{\partial v} \over {\partial y}} = 0.} \cr }$$

Numerical Heat Transfer And Fluid Flow

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Assessment of high-heat-flux thermal management schemes

Abstract: This paper explores the recent research developments in high-heat-flux thermal management. Cooling schemes such as pool boiling, detachable heat sinks, channel flow boiling, microchannel and mini-channel heat sinks, jet-impingement, and sprays, are discussed and compared relative to heat dissipation potential, reliability, and packaging concerns. It is demonstrated that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme. It is also shown that extensive fundamental electronic cooling knowledge has been amassed over the past two decades. Yet there is now a growing need for hardware innovations rather than perturbations to those fundamental studies. An example of these innovations is the cooling of military avionics, where research findings from the electronic cooling literature have made possible the development of a new generation of cooling hardware which promise order of magnitude increases in heat dissipation compared to today's cutting edge avionics cooling schemes.