Terrence W. Simon

Bio: Terrence W. Simon is an academic researcher from University of Minnesota. The author has contributed to research in topics: Heat transfer & Turbulence. The author has an hindex of 37, co-authored 305 publications receiving 5025 citations. Previous affiliations of Terrence W. Simon include Motorola & DuPont.

Enhanced brightness x‐ray source

Abstract: An improved source for x‐ray lithography is described which is capable of significantly enhanced brightness through an improved cooling system. In the normal Gaines source which has an inverted cone shaped anode, the cone walls are straight, and the water flows in a narrow channel coaxial with the anode. Anode cooling occurs with water in the nucleate boiling regime, and maximum heat flux is set by the critical density of vapor bubbles at which coalescence occurs. By providing the flow of water around the anode with a concave upstream curvature, huge inertial forces create instantaneous phase separation. As a result the power density at which burnout occurs is substantially increased and moreover, significantly stabilized. In addition the use of a shaped anode allows for a self‐guiding jet with no channel, which eases the mechanical design considerably. Measurements of the anode temperature excursion indicate a temperature rise of 450 °C with 6.2 kW in a 3 mm spot (25 kW/cm2). It is anticipated that fluxe...

Hot embossing at viscous state to enhance filling process for complex polymer structures

Abstract: In this paper, a new hot embossing process, molding at the viscous state, for fabrication of complex polymer structures at the micro and millimeter scale is presented. Polymer deformability is enhanced due to its low viscosity and is increased by an inner pressure from confinement of the polymer flow. Various millimeter-scale polymer structures with high aspect ratios and complex features were hot embossed. In addition, typical microstructures were achieved. This new approach promises the advantages of a broad process capability and strong compatibility with conventional hot embossing processes.

Hydrodynamic and thermal measurements in a turbulent boundary layer recovering from concave curvature

Abstract: The behavior of a boundary layer on a flat wall downstream of sustained concave curvature is documented. Experiments are conducted with negligible streamwise pressure gradient and a low free-stream turbulence intensity (0.6 percent). The turbulent boundary layer has a moderate strength of curvature (δ/R = 0.024) at the entry to the recovery section. Results show that the skin friction coefficient, which increases over the concave wall, decreases rapidly at first over the recovery wall, then slowly approaches flat-wall values. Stanton number values decrease rapidly, undershooting expected flat-wall values. A discussion of this behavior, supported by profile measurements, is given. Effects include destabilization in the concave-curved flow and rapid streamline readjustment (acceleration) at the end of the curved section. Goertler vortices established on the curved wall persist onto the recovery wall; however, their effects weaken.

Boundary Layer Theory

Abstract: The boundary layer equations for plane, incompressible, and steady flow are $$\matrix{ {u{{\partial u} \over {\partial x}} + v{{\partial u} \over {\partial y}} = - {1 \over \varrho }{{\partial p} \over {\partial x}} + v{{{\partial ^2}u} \over {\partial {y^2}}},} \cr {0 = {{\partial p} \over {\partial y}},} \cr {{{\partial u} \over {\partial x}} + {{\partial v} \over {\partial y}} = 0.} \cr }$$

Numerical Heat Transfer And Fluid Flow

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Assessment of high-heat-flux thermal management schemes

Abstract: This paper explores the recent research developments in high-heat-flux thermal management. Cooling schemes such as pool boiling, detachable heat sinks, channel flow boiling, microchannel and mini-channel heat sinks, jet-impingement, and sprays, are discussed and compared relative to heat dissipation potential, reliability, and packaging concerns. It is demonstrated that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme. It is also shown that extensive fundamental electronic cooling knowledge has been amassed over the past two decades. Yet there is now a growing need for hardware innovations rather than perturbations to those fundamental studies. An example of these innovations is the cooling of military avionics, where research findings from the electronic cooling literature have made possible the development of a new generation of cooling hardware which promise order of magnitude increases in heat dissipation compared to today's cutting edge avionics cooling schemes.