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Terrence W. Simon

Other affiliations: Motorola, DuPont, University of Texas at Arlington  ...read more
Bio: Terrence W. Simon is an academic researcher from University of Minnesota. The author has contributed to research in topics: Heat transfer & Turbulence. The author has an hindex of 37, co-authored 305 publications receiving 5025 citations. Previous affiliations of Terrence W. Simon include Motorola & DuPont.


Papers
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Journal ArticleDOI
TL;DR: In this article, a hybrid physical-chemical deposition process of planar perovskite films is discussed, where an optimized mass flow configuration with a flow resistance imposed by a porous screen is shown to give a uniform distribution of the methylammonium iodide vapor precursor.
Abstract: Applications of metal halide perovskite have been rapidly developing in recent years. However, very little research focusing on basic growth kinetics of perovskite films can be found in the literature. This paper discusses a hybrid physical-chemical deposition process of planar perovskite films. A 2-D ANSYS Fluent simulation is presented to calculate the heat and mass transfer during the deposition process. An optimized mass flow configuration with a flow resistance imposed by a porous screen is shown to give a uniform distribution of the methylammonium iodide vapor precursor and an even surface deposition rate of perovskite films. Both steady and transient calculations indicate that increasing operating temperature or vessel pressure within certain limits can boost the surface deposition rate of perovskite. Limitations on working pressure are presented for preventing reverse flow into the chamber and associated deterioration of deposition uniformity of the perovskite films.

5 citations


Cited by
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Journal ArticleDOI
TL;DR: In this paper, a review of the history of thermal energy storage with solid-liquid phase change has been carried out and three aspects have been the focus of this review: materials, heat transfer and applications.

4,019 citations

Book ChapterDOI
01 Jan 1997
TL;DR: The boundary layer equations for plane, incompressible, and steady flow are described in this paper, where the boundary layer equation for plane incompressibility is defined in terms of boundary layers.
Abstract: The boundary layer equations for plane, incompressible, and steady flow are $$\matrix{ {u{{\partial u} \over {\partial x}} + v{{\partial u} \over {\partial y}} = - {1 \over \varrho }{{\partial p} \over {\partial x}} + v{{{\partial ^2}u} \over {\partial {y^2}}},} \cr {0 = {{\partial p} \over {\partial y}},} \cr {{{\partial u} \over {\partial x}} + {{\partial v} \over {\partial y}} = 0.} \cr }$$

2,598 citations

01 Jan 2007

1,932 citations

01 Jan 2016
TL;DR: The numerical heat transfer and fluid flow is universally compatible with any devices to read and is available in the authors' digital library an online access to it is set as public so you can get it instantly.
Abstract: Thank you for reading numerical heat transfer and fluid flow. Maybe you have knowledge that, people have search numerous times for their favorite books like this numerical heat transfer and fluid flow, but end up in infectious downloads. Rather than reading a good book with a cup of coffee in the afternoon, instead they cope with some malicious virus inside their computer. numerical heat transfer and fluid flow is available in our digital library an online access to it is set as public so you can get it instantly. Our books collection spans in multiple countries, allowing you to get the most less latency time to download any of our books like this one. Merely said, the numerical heat transfer and fluid flow is universally compatible with any devices to read.

1,531 citations

Journal ArticleDOI
Issam Mudawar1
TL;DR: This paper explores the recent research developments in high-heat-flux thermal management and demonstrates that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme.
Abstract: This paper explores the recent research developments in high-heat-flux thermal management. Cooling schemes such as pool boiling, detachable heat sinks, channel flow boiling, microchannel and mini-channel heat sinks, jet-impingement, and sprays, are discussed and compared relative to heat dissipation potential, reliability, and packaging concerns. It is demonstrated that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme. It is also shown that extensive fundamental electronic cooling knowledge has been amassed over the past two decades. Yet there is now a growing need for hardware innovations rather than perturbations to those fundamental studies. An example of these innovations is the cooling of military avionics, where research findings from the electronic cooling literature have made possible the development of a new generation of cooling hardware which promise order of magnitude increases in heat dissipation compared to today's cutting edge avionics cooling schemes.

824 citations