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Tetsu Tanaka

Researcher at Tohoku University

Publications -  423
Citations -  11239

Tetsu Tanaka is an academic researcher from Tohoku University. The author has contributed to research in topics: Wafer & Chip. The author has an hindex of 38, co-authored 406 publications receiving 10375 citations. Previous affiliations of Tetsu Tanaka include NTT DoCoMo & Tokyo Medical and Dental University.

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Journal ArticleDOI

The complete genome sequence of the Gram-positive bacterium Bacillus subtilis

F. Kunst, +154 more
- 20 Nov 1997 - 
TL;DR: Bacillus subtilis is the best-characterized member of the Gram-positive bacteria, indicating that bacteriophage infection has played an important evolutionary role in horizontal gene transfer, in particular in the propagation of bacterial pathogenesis.
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The interleukin-6 receptor as a target for prevention of coronary heart disease: a mendelian randomisation analysis.

Daniel I. Swerdlow, +115 more
- 31 Mar 2012 - 
TL;DR: IL6R blockade could provide a novel therapeutic approach to prevention of coronary heart disease that warrants testing in suitably powered randomised trials and could help to validate and prioritise novel drug targets or to repurpose existing agents and targets for new therapeutic uses.
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Scaling theory for double-gate SOI MOSFET's

TL;DR: In this paper, a scaling theory for double-gate SOI MOSFETs is presented, which gives guidance for device design that maintains a sub-threshold factor for a given gate length.
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Efficacy of catheter-based renal denervation in the absence of antihypertensive medications (SPYRAL HTN-OFF MED Pivotal): a multicentre, randomised, sham-controlled trial

Michael Böhm, +224 more
- 02 May 2020 - 
TL;DR: The SPYRAL HTN-OFF MED (SPYRAL Pivotal) trial showed the superiority of catheter-based renal denervation compared with a sham procedure to safely lower blood pressure in the absence of antihypertensive medications.
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High-Density Through Silicon Vias for 3-D LSIs

TL;DR: The 3-D microprocessor test chip,3-D memorytest chip, 3- D image sensor chip, and 3-Ds artificial retina chip were successfully fabricated by using poly-Si TSV and tungsten (W/poly-Si) TSV technology.