T
Tetsu Tanaka
Researcher at Tohoku University
Publications - 423
Citations - 11239
Tetsu Tanaka is an academic researcher from Tohoku University. The author has contributed to research in topics: Wafer & Chip. The author has an hindex of 38, co-authored 406 publications receiving 10375 citations. Previous affiliations of Tetsu Tanaka include NTT DoCoMo & Tokyo Medical and Dental University.
Papers
More filters
Journal ArticleDOI
Novel Optical/Electrical Printed Circuit Board with Polynorbornene Optical Waveguide
Makoto Fujiwara,Yoji Shirato,Hiroshi Owari,Kei Watanabe,Mutsuhiro Matsuyama,Keizo Takahama,Tetsuya Mori,Kenji Miyao,Koji Choki,Takafumi Fukushima,Tetsu Tanaka,Mitsumasa Koyanagi +11 more
TL;DR: In this article, an optical interconnection with a new optically transparent polymer called polynorbornene (PNB) was investigated for short-distance and high-speed data transmission on printed circuit boards (PCBs).
Proceedings ArticleDOI
Multichip self-assembly technique on flexible polymeric substrate
TL;DR: In this paper, a batch assembly technique of a number of LSI and MEMS chips onto Si or flexible polymeric substrates using self-assembly driven by surface tension of a small volume of liquid was introduced.
Proceedings ArticleDOI
Development of highly-reliable microbump bonding technology using self-assembly of NCF-covered KGDs and multi-layer 3D stacking challenges
Yuka Ito,Mariappan Murugesan,Hisashi Kino,Takafumi Fukushima,Kang-Wook Lee,Koji Choki,Tetsu Tanaka,Mitsumasa Koyanagi +7 more
TL;DR: In this paper, the authors proposed a new multichip-to-wafer 3D stacking method with high throughput and high yield based on a capillary self-assembly method using liquid droplets.
Proceedings ArticleDOI
Non-conductive film and compression molding technology for self-assembly-based 3D integration
Takafumi Fukushima,Yoshikazu Ohara,Jichoel Bea,M. Murugesan,K. W. Lee,Tetsu Tanaka,Mitsumasa Koyanagi +6 more
TL;DR: In this article, two key technologies consisting of chip-to-wafer bonding through a nonconductive film (NCF) and wafer-level packaging using compression molding were studied for self-assembly-based 3D integration, especially reconfigured wafer towafer stacking, where 4mm-by-5mm chips having 20μm-pitch Cu-SnAg microbumps were successfully bonded to wafers through NCF.
Proceedings ArticleDOI
Cu lateral interconnects formed between 100-µm-thick self-assembled chips on flexible substrates
M. Murugesan,Jichoel Bea,T. Fukushima,T. Konno,K. Kiyoyama,W.-C. Jeong,Hisashi Kino,Akihiro Noriki,Kang-Wook Lee,Tetsu Tanaka,Mitsumasa Koyanagi +10 more
TL;DR: In this paper, a very new interconnection method, namely Cu lateral interconnection is proposed and tested for the heterogeneous multi-chip module integration in which MEMS and LSI chips are self assembled onto the flexible substrate.