다중혈관 관상동맥 환자에서 y-문합을 이용하여 양쪽 내흉동맥만을 사용한 우회술의 조기 성적

Countless millions of people have died from tuberculosis, a chronic infectious disease caused by the tubercle bacillus. The complete genome sequence of the best-characterized strain of Mycobacterium tuberculosis, H37Rv, has been determined and analysed in order to improve our understanding of the biology of this slow-growing pathogen and to help the conception of new prophylactic and therapeutic interventions. The genome comprises 4,411,529 base pairs, contains around 4,000 genes, and has a very high guanine + cytosine content that is reflected in the biased amino-acid content of the proteins. M. tuberculosis differs radically from other bacteria in that a very large portion of its coding capacity is devoted to the production of enzymes involved in lipogenesis and lipolysis, and to two new families of glycine-rich proteins with a repetitive structure that may represent a source of antigenic variation.

/pdf/deciphering-the-biology-of-mycobacterium-tuberculosis-from-56gdir9h56.pdf

Deciphering the biology of Mycobacterium tuberculosis from the complete genome sequence

BackgroundExperimental and clinical data suggest that reducing inflammation without affecting lipid levels may reduce the risk of cardiovascular disease. Yet, the inflammatory hypothesis of atherothrombosis has remained unproved. MethodsWe conducted a randomized, double-blind trial of canakinumab, a therapeutic monoclonal antibody targeting interleukin-1β, involving 10,061 patients with previous myocardial infarction and a high-sensitivity C-reactive protein level of 2 mg or more per liter. The trial compared three doses of canakinumab (50 mg, 150 mg, and 300 mg, administered subcutaneously every 3 months) with placebo. The primary efficacy end point was nonfatal myocardial infarction, nonfatal stroke, or cardiovascular death. ResultsAt 48 months, the median reduction from baseline in the high-sensitivity C-reactive protein level was 26 percentage points greater in the group that received the 50-mg dose of canakinumab, 37 percentage points greater in the 150-mg group, and 41 percentage points greater in t...

https://www.nejm.org/doi/pdf/10.1056/NEJMoa1707914

Antiinflammatory Therapy with Canakinumab for Atherosclerotic Disease

Pseudomonas aeruginosa is a ubiquitous environmental bacterium that is one of the top three causes of opportunistic human infections. A major factor in its prominence as a pathogen is its intrinsic resistance to antibiotics and disinfectants. Here we report the complete sequence of P. aeruginosa strain PAO1. At 6.3 million base pairs, this is the largest bacterial genome sequenced, and the sequence provides insights into the basis of the versatility and intrinsic drug resistance of P. aeruginosa. Consistent with its larger genome size and environmental adaptability, P. aeruginosa contains the highest proportion of regulatory genes observed for a bacterial genome and a large number of genes involved in the catabolism, transport and efflux of organic compounds as well as four potential chemotaxis systems. We propose that the size and complexity of the P. aeruginosa genome reflect an evolutionary adaptation permitting it to thrive in diverse environments and resist the effects of a variety of antimicrobial substances.

/pdf/complete-genome-sequence-of-pseudomonas-aeruginosa-pao1-an-u88d4e2n3p.pdf

Complete genome sequence of Pseudomonas aeruginosa PAO1, an opportunistic pathogen.

https://www.thelancet.com/pdfs/journals/lancet/PIIS0140-6736(00)04403-2.pdf

Whole genome sequencing of meticillin-resistant Staphylococcus aureus

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pol.20200094

On-wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through-silicon via applications: Comparison to plasma-enhanced chemical vapor deposition SiO2

Over the scaling limit, 3D LSI using Through Silicon Vias (TSVs) brings in a huge number of additional logic gates. 3D LSI technology allows LSIs to adopt redundant or spare modules in order to raise its availability, dependability or resiliency. For such 3D LSI, the one of the most important matter is to increase the connectivity of vertical connections between stacked tiers. To achieve a resilient 3-D stacked multicore processor system, it is indispensable to develop TSV self-test and self-repair circuit. Especially, it is important to reduce redundant TSVs with large-pitch because of their area cost while increasing its repairability. The processor chip for the resilient 3-D stacked multicore processor has been designed and fabricated with highly area-efficient TSV repair technology.

Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system

Typical die shift is beyond several tens micrometers or more, which is a serious problem on advanced fan-out wafer-level packaging (FOWLP), to give inevitable misalignment errors in the subsequent photolithography processes for fine-pitch redistributed wiring layer (RDL) formation. In particular, this problem is expected to grow all the more serious in chiplets and tiny dies less than 1 mm in a side. In this work, the use of an anchoring layer is proposed to fix these dies/chiplets on a double-side laminate thermo-release tape and drastically reduce the die shift. In addition, an on-nail photoplethysmogram (PPG) sensor module as a part of flexible hybrid electronics (FHE) is integrated with $\mu $ LED ( $270\,\,\mu \text{m}\,\,\times 270\,\,\mu \text{m}$ ) based on a die-first FOWLP methodology using a biocompatible polydimethylsiloxane (PDMS) mold resin for real-time monitoring pulse wave and percutaneous oxygen saturation (SpO2). The repeated bendability of fan-out Au wirings formed on the PDMS and the current–voltage ( $I$ – $V$ ) behavior of the $\mu $ LED before and after die embedment in the PDMS is characterized.

/pdf/significant-die-shift-reduction-and-m-led-integration-based-gkzv93fz54.pdf

Significant Die-Shift Reduction and μ LED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics

We developed a new self-assembled die bonder to produce three-dimensionally integrated circuit (3D IC) using a multichip-to-wafer bonding method in batch. In the self-assembled multichip bonder, large number of known good dies (KGDs) can be simultaneously transferred to an LSI wafer on which hydrophilic bonding areas with liquid droplets are prepared. The many KGD can be aligned to the bonding areas by the liquid surface tension. The average alignment accuracy was found to be approximately 400 nm and the total alignment time was less than 0.1 sec. After liquid evaporation, the many KGDs can be bonded to the bonding areas in the new self-assembled die bonder.

Tetsu Tanaka

Papers

On-wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through-silicon via applications: Comparison to plasma-enhanced chemical vapor deposition SiO2

Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system

Significant Die-Shift Reduction and μ LED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics

Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch

Novel Opto-Electro Printed Circuit Board with Polynorbornene Optical Waveguide