Ting-Kuang Wang

Bio: Ting-Kuang Wang is an academic researcher from National Taiwan University. The author has contributed to research in topics: Stopband & Ground plane. The author has an hindex of 9, co-authored 22 publications receiving 743 citations. Previous affiliations of Ting-Kuang Wang include National Sun Yat-sen University.

Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits

Abstract: A power/ground planes design for efficiently eliminating the ground bounce noise (GBN) in high-speed digital circuits is proposed by using low-period coplanar electromagnetic bandgap (LPC-EBG) structure. Keeping solid for the ground plane and designing an LPC-EBG pattern on the power plane, the proposed structure omnidirectionally behaves highly efficiently in suppression of GBN (over 50 dB) within the broad-band frequency range (over 4 GHz). In addition, the proposed designs suppress radiated emission (or electromagnetic interference) caused by the GBN within the stopband. These extinctive behaviors of low radiation and broad-band suppression of the GBN is demonstrated numerically and experimentally. Good agreements are seen. The impact of the LPC-EBG power plane on the signal integrity for the signals referring to the power plane is investigated. Two possible solutions, differential signals and an embedded LPC-EBG power plane concept, are suggested and discussed to reduce the impact.

Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation

Abstract: Mitigating power distribution network (PDN) noise is one of the main efforts for power integrity (PI) design in high-speed or mixed-signal circuits. Possible solutions, which are based on decoupling or isolation concept, for suppressing PDN noise on package or printed circuit board (PCB) levels are reviewed in this paper. Keeping the PDN impedance very low in a wide frequency range, except at dc, by employing a shunt capacitors, which can be in-chip, package, or PCB levels, is the first priority way for PI design. The decoupling techniques including the planes structure, surface-mounted technology decoupling capacitors, and embedded capacitors will be discussed. The isolation approach that keeps part of the PDN at high impedance is another way to reduce the PDN noise propagation. Besides the typical isolation approaches such as the etched slots and filter, the new isolation concept using electromagnetic bandgap structures will also be discussed.

A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits

Abstract: A novel L-bridged electromagnetic bandgap (EBG) power/ground planes is proposed with super-wideband suppression of the ground bounce noise (GBN) from 600Mz to 4.6GHz. The L-shaped bridge design on the EBG power plane not only broadens the stopband bandwidth, but also can increase the mutual coupling between the adjacent EBG cells by significantly decreasing the gap between the cells. It is found the small gap design can prevent from the severe degradation of the signal quality for the high-speed signal referring to the perforated EBG power plane. The excellent GBN suppression performance with keeping reasonably good signal integrity for the proposed structure is validated both experimentally and numerically. Good agreement is seen.

A Novel Power/Ground Layer Using Artificial Substrate EBG for Simultaneously Switching Noise Suppression

Abstract: A novel power/ground plane for eliminating the power noise in the high-speed digital circuits using an artificial substrate electromagnetic bandgap (AS-EBG) structure is proposed. The AS-EBG is designed by embedding the air rods and high dielectric constant (DK) rods between the coplanar EBG power/ground planes to enhance the stopband bandwidth. A 2-D transmission-line model of the AS-EBG power planes is also developed with experimental verification to explain the mode perturbation and predict the bandgap of the AS-EBG. It is found that over 60% enhancement of bandwidth (from 1.5 to 2.4 GHz) can be achieved for a 3 times 3 AS-EBG power plane compared to the coplanar-EBG power planes by proper design of the high DK rod with DK of 92. Based on SPICE-based modeling, the excellent power/signal integrity performance of the AS-EBG structure is also presented by the chip-package co-simulation in the time domain. It is found over 70% reduction of the simultaneously switching noise can be obtained with good signal eye-diagram improvement.

Design and Modeling of a Stopband-Enhanced EBG Structure Using Ground Surface Perturbation Lattice for Power/Ground Noise Suppression

Abstract: Based on the ground surface perturbation concept, a novel stopband-enhanced electromagnetic-bandgap (EBG) structure has been proposed to suppress the power/ground noise on a three-layer package. This structure consists of a coplanar periodic pattern on the top layer, a ground plane on the third layer, and a ground surface perturbation lattice on the second layer with eight vias connecting to the ground plane. By designing the dimension and via numbers, the ground surface perturbation lattice can significantly enhance the stopband bandwidth. A generic 1-D circuit model is proposed for the three-layer EBG structure. The reason why the proposed structure can possess wider stopband will be explained. Several test samples are fabricated. The agreement of the stopband between the circuit model and measured results are good.

A Novel Wideband Common-Mode Suppression Filter for Gigahertz Differential Signals Using Coupled Patterned Ground Structure

Abstract: A wideband and compact filter design for common-mode noise suppression in high-speed differential signals is proposed based on two U-shaped and one H-shaped coupled patterned ground structure. An equivalent model of three coupled LC resonators to predict the common-mode suppression characteristics is also developed with good agreement to the full-wave simulation and measurement result. A test sample is designed and fabricated on a standard printed circuit board (PCB). It is found the common-mode noise can be reduced by the filter over 15 dB from 3.6 to 9.1 GHz and over 75% of amplitude in the time domain. More important, the differential signal integrity, in terms of insertion loss and group delay in the frequency domain and eye diagrams in the time domain, is not degraded within the wide bandwidth. The fractional bandwidth of the stopband can reach 87% and the filter size is about 0.44 lambdag times 0.44 lambdag. The radiation caused by the common-mode current on the attached I/O cables is also efficiently suppressed by 10 dB on average within the designed stopband. To our best knowledge, it is the first low-cost common-mode filter designed for the gigahertz high-speed signals with the largest fractional bandwidth and most compact size on a PCB.

Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation

Abstract: Mitigating power distribution network (PDN) noise is one of the main efforts for power integrity (PI) design in high-speed or mixed-signal circuits. Possible solutions, which are based on decoupling or isolation concept, for suppressing PDN noise on package or printed circuit board (PCB) levels are reviewed in this paper. Keeping the PDN impedance very low in a wide frequency range, except at dc, by employing a shunt capacitors, which can be in-chip, package, or PCB levels, is the first priority way for PI design. The decoupling techniques including the planes structure, surface-mounted technology decoupling capacitors, and embedded capacitors will be discussed. The isolation approach that keeps part of the PDN at high impedance is another way to reduce the PDN noise propagation. Besides the typical isolation approaches such as the etched slots and filter, the new isolation concept using electromagnetic bandgap structures will also be discussed.

Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress

Abstract: This paper reviews the fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades. Most results in this field are based on the very rich and highly educational literature produced by Prof. C. Paul in his long scientific career. The inclusion of parameters variability effects is also considered, and it is demonstrated how statistical simulations can become affordable by means of recently-introduced stochastic methods. Finally, the necessity of practical training of designers is mentioned, and an experience relying on realistic PCB demonstrators is illustrated.

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Abstract: The ever-increasing demands of digital computing and wireless communication have been driving the semiconductor technology to change with each passing day. Modern electronic systems integrate more complex components and devices, which results in a very complex electromagnetic (EM) field environment. EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of efficient and accurate simulation tools and expertise on noise reduction and immunity improvement. This paper reviews the state of the arts of IC, electronic package, and printed circuit board simulation and modeling technologies. It summarizes the modeling technologies for both available structures [multilayered power-ground planes and macromodeling of interconnect (INC)] and novel structures (nano-INCs and 3-D ICs based on through-silicon via technology). It also illustrates the trends of simulation and modeling technologies in EM compatibility, signal integrity, and power integrity.