Umesh K. Mishra

Bio: Umesh K. Mishra is an academic researcher from University of California, Santa Barbara. The author has contributed to research in topics: Scattering & Electron mobility. The author has an hindex of 9, co-authored 16 publications receiving 656 citations. Previous affiliations of Umesh K. Mishra include University of California, Berkeley.

Dislocation scattering in a two-dimensional electron gas

Abstract: A theory of scattering by charged dislocation lines in a two-dimensional electron gas (2DEG) is developed. The theory is directed towards understanding transport in AlGaN/GaN high-electron-mobility transistors which have a large number of line dislocations piercing through the 2DEG. The scattering time due to dislocations is derived for a 2DEG in closed form. This work identifies dislocation scattering as a mobility-limiting scattering mechanism in 2DEGs with high dislocation densities. The insensitivity of the 2DEG (as compared to bulk) to dislocation scattering is explained by the theory.

Gallium nitride based high power heterojunction field effect transistors: process development and present status at UCSB

Abstract: The development of GaN based devices for microwave power electronics at the University of California, Santa Barbara (UCSB), is reviewed. From 1995 to 2000, the power performance of AlGaN/GaN-on-sapphire heterojunction field effect transistors improved from 1.1 W/mm to 6.6 W/mm, respectively. Compensating the disadvantages of the low thermal conductivity of the sapphire substrate through heat management via flip chip bonding onto AlN substrates, large periphery devices with an output power of 7.6 W were demonstrated. UCSB also fabricated the first GaN based amplifier integrated circuits. Critical issues involved in the growth of high quality AlGaN/GaN heterostructures by metal-organic chemical vapor deposition and the device fabrication are discussed.

Morphological and structural transitions in GaN films grown on sapphire by metal-organic chemical vapor deposition

Abstract: The structural and morphological evolution of GaN films grown by MOCVD at high temperature (1080?C) on a low temperature grown GaN nucleation layer (NL) on (0001) sapphire were studied using atomic force microscopy (AFM), transmission electron microscopy (TEM) and photoluminescence (PL) measurements. The high temperature (HT) GaN layers were found to grow by initially forming isolated truncated hexagonal islands having {10*BAR*1*BAR*1} facet planes and a top (0001) plane. The non-wetting or partial wetting behavior of the HT GaN on the GaN NL is attributed to both the roughness and predominantly cubic nature of the NL.

Effect of the trimethylgallium flow during nucleation layer growth on the properties of GaN grown on sapphire

Abstract: We report on the effect of the trimethylgallium flow during nucleation layer growth on the electrical, optical and structural properties of epitaxial GaN films grown on basal plane sapphire by atmospheric pressure metalorganic chemical vapor deposition. The 1.2 µm thick GaN films grown on nucleation layers with the optimum trimethylgallium flow of 45 µmol/min had a room temperature mobility of 644 cm2/s and minimum width of the (002) and the (102) X-ray diffraction peaks. The roughness of the as-grown nucleation layers decreased with increased trimethylgallium flow. However, smooth, as-grown, nucleation layers showed a strong tendency for island coarsening and an increased surface roughness after heating to the bulk GaN growth temperature.

Dipole scattering in polarization induced two-dimensional electron gases

Abstract: Unusually large spontaneous and piezoelectric fields in the III-V nitrides have led to the making of an entirely new class of two-dimensional electron gas. Fluctuation from a perfectly periodic binary structure in highly polar semiconductor alloys present the same physical situation as a random distribution of microscopic dipoles. The excess dipole distribution in the barrier layers is evaluated by a method similar to the virtual crystal approximation. It is shown that the mobility of electrons in the two-dimensional electron gas formed in highly polar heterostructures is intrinsically limited by scattering from such dipoles.

AlGaN/GaN HEMTs-an overview of device operation and applications

Abstract: Wide bandgap semiconductors are extremely attractive for the gamut of power electronics applications from power conditioning to microwave transmitters for communications and radar. Of the various materials and device technologies, the AlGaN/GaN high-electron mobility transistor seems the most promising. This paper attempts to present the status of the technology and the market with a view of highlighting both the progress and the remaining problems.

The Roles of Structural Imperfections in InGaN-Based Blue Light-Emitting Diodes and Laser Diodes

Abstract: REVIEW High-efficiency light-emitting diodes emitting amber, green, blue, and ultraviolet light have been obtained through the use of an InGaN active layer instead of a GaN active layer. The localized energy states caused by In composition fluctuation in the InGaN active layer are related to the high efficiency of the InGaN-based emitting devices. The blue and green InGaN quantum-well structure light-emitting diodes with luminous efficiencies of 5 and 30 lumens per watt, respectively, can be made despite the large number of threading dislocations (1 x 10(8) to 1 x 10(12) cm-2). Epitaxially laterally overgrown GaN on sapphire reduces the number of threading dislocations originating from the interface of the GaN epilayer with the sapphire substrate. InGaN multi-quantum-well structure laser diodes formed on the GaN layer above the SiO2 mask area can have a lifetime of more than 10,000 hours. Dislocations increase the threshold current density of the laser diodes.

GaN-Based RF Power Devices and Amplifiers

Abstract: The rapid development of the RF power electronics requires the introduction of wide bandgap material due to its potential in high output power density, high operation voltage and high input impedance GaN-based RF power devices have made substantial progresses in the last decade This paper attempts to review the latest developments of the GaN HEMT technologies, including material growth, processing technologies, device epitaxial structures and MMIC designs, to achieve the state-of-the-art microwave and millimeter-wave performance The reliability and manufacturing challenges are also discussed

Growth and applications of Group III-nitrides

Abstract: Recent research results pertaining to InN, GaN and AlN are reviewed, focusing on the different growth techniques of Group III-nitride crystals and epitaxial films, heterostructures and devices. The chemical and thermal stability of epitaxial nitride films is discussed in relation to the problems of deposition processes and the advantages for applications in high-power and high-temperature devices. The development of growth methods like metalorganic chemical vapour deposition and plasma-induced molecular beam epitaxy has resulted in remarkable improvements in the structural, optical and electrical properties. New developments in precursor chemistry, plasma-based nitrogen sources, substrates, the growth of nucleation layers and selective growth are covered. Deposition conditions and methods used to grow alloys for optical bandgap and lattice engineering are introduced. The review is concluded with a description of recent Group III-nitride semiconductor devices such as bright blue and white light-emitting diodes, the first blue-emitting laser, high-power transistors, and a discussion of further applications in surface acoustic wave devices and sensors.

The impact of surface states on the DC and RF characteristics of AlGaN/GaN HFETs

Abstract: GaN based HFETs are of tremendous interest in applications requiring high power at microwave frequencies. Although excellent current-voltage (I-V) characteristics and record high output power densities at microwave frequencies have been achieved, the origin of the 2DEG and the factors limiting the output power and reliability of the devices under high power operation remain uncertain. Drain current collapse has been the major obstacle in the development of reliable high power devices. We show that the cause of current collapse is a charging up of a second virtual gate, physically located in the gate drain access region. Due to the large bias voltages present on the device during a microwave power measurement, surface states in the vicinity of the gate trap electrons, thus acting as a negatively charged virtual gate. The maximum current available from a device during a microwave power measurement is limited by the discharging of this virtual gate. Passivated devices located adjacent to unpassivated devices on the same wafer show almost no current collapse, thus demonstrating that proper surface passivation prevents the formation of the virtual gate. The possible mechanisms by which a surface passivant reduces current collapse and the factors affecting reliability and stability of such a passivant are discussed.