Author
V. Antonetti
Bio: V. Antonetti is an academic researcher from IBM. The author has an hindex of 1, co-authored 1 publications receiving 17 citations.
Papers
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IBM1
TL;DR: A bibliography of 237 publications dealing with heat transfer in electronic equipment is presented in this paper, covering the period from 1970-1984, although a majority of the papers listed were published in the last three years.
Abstract: A bibliography of 237 publications dealing with heat transfer in electronic equipment is presented. The papers are arranged in twelve categories, and cover the period from 1970-1984, although a majority of the papers listed were published in the last three years.
17 citations
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229 citations
Patent•
Cray1
TL;DR: In this paper, a liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid.
Abstract: A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.
69 citations
Patent•
Cray1
TL;DR: A spray cooling system includes a spray delivery device and a cooling liquid delivered to the spray delivery devices as mentioned in this paper, which form an asymmetric non-uniform density full-cone spray pattern.
Abstract: A spray cooling system includes a spray delivery device and a cooling liquid delivered to the spray delivery device. The spray delivery device includes one or more inlet apertures and one or more corresponding outlet apertures, at least one pair of inlet aperture and corresponding outlet aperture being positioned relative to each so as to form an asymmetric non-uniform density full-cone spray pattern.
69 citations
TL;DR: In this article, a physical model is presented that describes mechanisms for operating-equipment junction-to-ambient thermal resistance in excess of a typical component manufacturer's data-sheet value by as much as a factor of four under constant cooling conditions.
Abstract: A physical model is presented that describes mechanisms for operating-equipment junction-to-ambient thermal resistance in excess of a typical component manufacturer's data-sheet value by as much as a factor of four under constant cooling conditions. The model accounts for the discrepancy between system thermal performance of a package and data-sheet thermal resistance value which are not accompanied by qualifying data in the form of junction-to-header thermal resistance, board temperature rise over ambient, convection coefficient, mounting sensitivity, and power dissipation. The eight constants used to predict inherent increases in package thermal resistance when going from the data-sheet-specified operating conditions to the excess-value conditions are described. These constants and procedures for obtaining them are given for dual in-line packages (DIPs), pin-grid arrays (PGAs), small-outline transistors (SOTs), and plastic leaded chip carriers (PLCCs). >
60 citations
TL;DR: In this paper, selected aspects of cooling technology for electrical apparatus and electronic devices are considered for the past 80 years and the emphasis is on the past 50 years, where the technology has evolved to meet the challenges of microminiaturization, and heat transfer considerations are now an integral part of the design procedure for microelectronic systems.
Abstract: Selected aspects of cooling technology for electrical apparatus and electronic devices are considered for the past 80 years. The emphasis is on the past 50 years. The technology has evolved to meet the challenges of microminiaturization, and heat transfer considerations are now an integral part of the design procedure for microelectronic systems.
58 citations