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V. W. Antonetti

Bio: V. W. Antonetti is an academic researcher from Manhattan College. The author has contributed to research in topics: Spreading resistance profiling & Coating. The author has an hindex of 2, co-authored 2 publications receiving 44 citations.

Papers
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01 Jan 1999
TL;DR: In this paper, a solution for computing the thermalspreading resistance of planarcircular contact surfaces is presented, where a model is developed to compute the contact conductance between a bare substrate and a coated substrate.
Abstract: Application of highly conductive coatings to contacting surfaces is a commonly employed method to enhance thermal contact conductance. In many applications it is often necessary to apply an intermediate coating such that the conductive coating may be applied to a nonadhering substrate. In these instances, it is desirable to predict the effect that the intermediate and e nal coatings have on the spreading resistance. A solution for computing the thermalspreading resistanceofa planarcircularcontactona doubly coatedsubstrateispresented.Also,a modelis developed to compute the contact conductance between a bare substrate and a coated substrate. Comparisons are made with data obtained in the literature for which no analytical model was available. Solution of the governing equations and numerical computation of the spreading resistance were obtained using computer algebra systems. Nomenclature Ac; At; Aa = area, m 2 Ain; Bin = Fourier‐Bessel coefe cients a;b = two radii with a < b, m CL = spreading correction factor e = natural log base Hc = contact microhardness, MPa hc = contact conductance, W/m 2 K J0.x/

25 citations

Journal ArticleDOI
TL;DR: In this article, a solution for computing the thermal spreading resistance of a planar circular contact on a doubly-coated substrate is presented, and a model is developed to compute the contact conductance between a bare substrate and a coated substrate.
Abstract: Application of highly conductive coatings to contacting surfaces is a commonly employed method to enhance thermal contact conductance. In many applications it is often necessary to apply an intermediate coating such that the conductive coating may be applied to a nonadhering substrate. In these instances, it is desirable to predict the effect that the intermediate and final coatings have on the spreading resistance. A solution for computing the thermal spreading resistance of a planar circular contact on a doubly coated substrate is presented. Also, a model is developed to compute the contact conductance between a bare substrate and a coated substrate. Comparisons are made with data obtained in the literature for which no analytical model was available. Solution of the governing equations and numerical computation of the spreading resistance were obtained using computer algebra systems

24 citations


Cited by
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Journal ArticleDOI
TL;DR: A thermal analysis of high power LED packages implementing chip-on-board (COB) architecture combined with power electronic substrate focusing on heat spreading effect is conducted, bypassing the need for detailed computational simulations using FEA.

124 citations

Journal ArticleDOI
TL;DR: In this article, a closed-form analytical solution for the temperature distribution in a rectangular structure with rectangular isoflux heat sources, any number of layers of arbitrary thermal conductivity, and perfect interfacial contact or finite interfacial conductance was presented.
Abstract: Temperature rise and thermal spreading resistance in multilayered structures are an important research topic in several branches of the thermal-fluid sciences, including thermal management of electronics and contact resistance. Previous work in developing analytical solutions for the temperature rise and thermal spreading resistance has been limited to relatively few layers and simple conditions at the interfaces. Recent development of multilayer epitaxial structures for high power electronics has led to the need for more general and flexible analytical solutions because numerical methods, such as the finite element method, are often computationally inefficient. This paper presents a closed-form, analytical solution for the temperature distribution in a rectangular structure with rectangular isoflux heat sources, any number of layers of arbitrary thermal conductivity, and perfect interfacial contact or finite interfacial conductance. Extensions are also presented for convective boundary conditions in the source and sink planes. The proposed analytical solution is demonstrated and validated to study gallium nitride (GaN)-based epitaxial structures in realistic device configurations. The capability to explore the parametric space in a computationally efficient manner provides the ability to understand the key dependencies of the temperature rise on the properties of the structure, such as the substrate thickness in GaN-on-diamond epitaxial structures. Our results show that reduction of the thickness of diamond substrates may actually increase the device temperature in a realistic device configuration due to the importance of thermal spreading within the first ${\sim}{\rm 100}~\mu{\rm m}$ of the heat source.

78 citations

Journal ArticleDOI
TL;DR: In this paper, the literature on thermal spreading resistance from the past 50 years is chronologically presented, and the last decade of advances are specifically described, focusing on recent advances since much of the literature was reviewed in a handbook chapter published in 2003.
Abstract: Thermal spreading resistance problems have been studied by many different researchers over the past six decades. In this paper, the literature on thermal spreading resistance from the past 50 years is chronologically presented, and the last decade of advances are specifically described. Focus is given to recent advances since much of the literature was reviewed in a handbook chapter published in 2003. For consistency throughout the paper, the rectangular slab and cylindrical disk heat spreader are referred to as flux channels and flux tubes, respectively. The thermal spreading resistance of compound rectangular flux channels and circular flux tubes with and without contact resistance are presented. The sink plane boundary condition is modeled using convective cooling with constant and/or variable heat transfer coefficient. Furthermore, the effects of discrete cooling in the heat-sink plane, orthotropic properties, and temperature-dependent thermal conductivity are also presented.

36 citations

Journal ArticleDOI
TL;DR: In this article, the friction of polyimide/DLN is lower than for polyimides/steel, while polyIMide shows higher wear rates after sliding against DLN compared to steel counterfaces.

29 citations