Author
Vadim Tsoi
Bio: Vadim Tsoi is an academic researcher from Huawei. The author has contributed to research in topics: Airflow & Heat sink. The author has an hindex of 4, co-authored 6 publications receiving 56 citations.
Topics: Airflow, Heat sink, Heat exchanger, Active cooling, Boiling
Papers
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Patent•
18 May 2010TL;DR: In this article, a heat spreading device of thermo siphon, the device comprising sectioning forming a first chamber portion and a second chamber portion, first plurality of conduits, and second at least two conduits providing interconnection of the first and second chamber portions is disclosed.
Abstract: A heat spreading device of thermo siphon, the device comprising sectioning forming a first chamber portion and a second chamber portion, first plurality of conduits, and second at least two conduits, the second at least two conduits providing interconnection of the first and second chamber portions is disclosed. Integral parts/portions are provided, such as cavities, barrier and fins.
26 citations
TL;DR: In this paper, the authors examined the thermal performance of a newly devised plate-type two-phase loop thermosyphon with cooling applications to electronic boards of telecommunication systems.
24 citations
Patent•
16 Sep 2014TL;DR: An Electro Hydro Dynamic, EHD, thruster (105) comprising a first set of electrodes (210), a second set of sensors (220), and a supporting structure (103) was used to generate airflow of ionised air for cooling a heat sink as mentioned in this paper.
Abstract: An Electro Hydro Dynamic, EHD, thruster (105) comprising a first set of electrodes (210), a second set of electrodes (220) and a supporting structure (103) for supporting the first set of electrodes (210) and the second set of electrodes (220). The EHD thruster (105) is configured to generate airflow of ionised air for cooling a heat sink (101). Further, the EHD thruster (105) is electrically isolated from the heat sink (101).
6 citations
Patent•
18 Nov 2011TL;DR: A heat spreading device includes sectioning forming a first chamber portion and a second chamber portion, a plurality of conduits, and at least two conduits interconnect the first and second chamber portions as discussed by the authors.
Abstract: A heat spreading device includes sectioning forming a first chamber portion and a second chamber portion, a first plurality of conduits, and a second at least two conduits. The second at least two conduits interconnect the first chamber portion and the second chamber portion. The heat spreading device may also include cavities, a barrier, and fins.
4 citations
Patent•
31 Dec 2010TL;DR: In this article, an air-to-air heat exchanger comprising first and second passages (10, 20) formed by interconnected separating walls according to a first structure (30) is disclosed.
Abstract: An air-to-air heat exchanger (1) comprising first and second passages (10, 20) formed by interconnected separating walls (35) according to a first structure (30) is disclosed. An inlet and an outlet (2 '' ) of each of the second passages (20) are formed on a common side of the heat exchanger (1) along the second passages (20).
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TL;DR: In this paper, a new dynamic simulation tool using interconnected PDEs is described in the first part of the present paper followed by the validation of the modeling for both steady and dynamic regimes using a first-of-a-kind 15 cm-height thermosyphon test bench.
74 citations
TL;DR: In this paper, an analytical model for a closed thermosyphon loop developed for cooling air inside a telecommunication cabinet is presented, based on the combination of thermal and hydraulic management of two-phase flow in the loop.
55 citations
TL;DR: In this paper, a computational fluid dynamics model for simulation of a thermosyphon with two-phase flow including phase change heat transfer was developed, where de-ionized water and CuO/Water nanofluid were used as working fluids in the thermosYphon.
Abstract: A computational fluid dynamics model for simulation of a thermosyphon with two-phase flow including phase change heat transfer was developed. De-ionized water and CuO/Water nanofluid were used as working fluids in the thermosyphon. Results show that, maximum heat flux of the nanofluid is about 46 % higher than that of water. Also by increasing the nanofluid concentration, the wall temperature decreases, and the concentration of 1 wt% is the optimum concentration.
49 citations
TL;DR: In this article, a symmetric dual taper configuration is introduced in the evaporator to generate a highly efficient and stable two-phase flow in the system using HFE7000.
44 citations
Patent•
07 May 2013TL;DR: In this article, a thermoelectric heat exchanger component with a heat spreading lid that optimizes thermal interface resistance between a heat spread lid and a set of thermal interfaces is described.
Abstract: Embodiments of a thermoelectric heat exchanger component having a heat spreading lid that optimizes thermal interface resistance between the heat spreading lid and multiple thermoelectric devices and methods of fabrication thereof are disclosed. In one embodiment, a thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a heat spreading lid over the thermoelectric devices and a thermal interface material between the thermoelectric devices and the heat spreading lid. An orientation (i.e., a tilt) of the heat spreading lid is such that a thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices.
36 citations