scispace - formally typeset
Search or ask a question
Author

Vadim V. Silberschmidt

Bio: Vadim V. Silberschmidt is an academic researcher from Loughborough University. The author has contributed to research in topics: Machining & Materials science. The author has an hindex of 44, co-authored 543 publications receiving 8619 citations. Previous affiliations of Vadim V. Silberschmidt include University of Rhode Island & Universities UK.


Papers
More filters
Journal ArticleDOI
TL;DR: In this paper, a finite element (FE) model was proposed to analyze the microstructural processes at the cutting tool-chip interface for both conventional and ultrasonically assisted machining.

88 citations

Journal ArticleDOI
TL;DR: Ultrasonically assisted machining (UAM) is an advanced machining technique, which has been shown to improve machinability of a β-titanium alloy, namely, Ti-15- 3-3-3, when compared to conventional turning processes.

86 citations

Journal ArticleDOI
TL;DR: In this paper, the authors further developed the finite element (FE) model of ultrasonically assisted turning discussed in Mitrofanov et al. This model is used to study the effect of cutting parameters (such as the cutting speed, depth of cut and feed rate) and influence of lubrication on various features of two turning techniques, including cutting forces and chip shapes.

82 citations

Journal ArticleDOI
TL;DR: In this article, an experimental study of temperature-dependent mechanical behavior of polymethyl methacrylate (PMMA) was performed at a range of temperatures (20, 40, 60, and 80°C) below its glass transition point (108,°C).

77 citations

Journal ArticleDOI
TL;DR: In this article, the growth kinetics of the Cu-Al IMCs were correlated to the diffusion process during aging; their combined activation energy was estimated to be 1.01 eV.
Abstract: Interface evolution caused by thermal aging under different temperatures and durations was investigated by means of scanning electron microscopy (SEM) and transmission electron microscopy (TEM). It was found that approximately 30-nm-thick and discontinuous Cu-Al intermetallic compounds (IMCs) were present in the initial bonds before aging. Cu-Al IMCs grew under thermal aging with increasing aging time. The growth kinetics of the Cu-Al IMCs was correlated to the diffusion process during aging; their combined activation energy was estimated to be 1.01 eV. Initially, Al-rich Cu-Al IMCs formed in the as-bonded state and early stage of aging treatment. Cu9Al4 was identified by selected-area electron diffraction (SAD) as the only type of Cu-Al IMC present after thermal aging at 250°C for 100 h; this is attributed to the relatively short supply of aluminum to the interfacial reaction.

76 citations


Cited by
More filters
01 May 1993
TL;DR: Comparing the results to the fastest reported vectorized Cray Y-MP and C90 algorithm shows that the current generation of parallel machines is competitive with conventional vector supercomputers even for small problems.
Abstract: Three parallel algorithms for classical molecular dynamics are presented. The first assigns each processor a fixed subset of atoms; the second assigns each a fixed subset of inter-atomic forces to compute; the third assigns each a fixed spatial region. The algorithms are suitable for molecular dynamics models which can be difficult to parallelize efficiently—those with short-range forces where the neighbors of each atom change rapidly. They can be implemented on any distributed-memory parallel machine which allows for message-passing of data between independently executing processors. The algorithms are tested on a standard Lennard-Jones benchmark problem for system sizes ranging from 500 to 100,000,000 atoms on several parallel supercomputers--the nCUBE 2, Intel iPSC/860 and Paragon, and Cray T3D. Comparing the results to the fastest reported vectorized Cray Y-MP and C90 algorithm shows that the current generation of parallel machines is competitive with conventional vector supercomputers even for small problems. For large problems, the spatial algorithm achieves parallel efficiencies of 90% and a 1840-node Intel Paragon performs up to 165 faster than a single Cray C9O processor. Trade-offs between the three algorithms and guidelines for adapting them to more complex molecular dynamics simulations are also discussed.

29,323 citations

Journal Article
TL;DR: This book by a teacher of statistics (as well as a consultant for "experimenters") is a comprehensive study of the philosophical background for the statistical design of experiment.
Abstract: THE DESIGN AND ANALYSIS OF EXPERIMENTS. By Oscar Kempthorne. New York, John Wiley and Sons, Inc., 1952. 631 pp. $8.50. This book by a teacher of statistics (as well as a consultant for \"experimenters\") is a comprehensive study of the philosophical background for the statistical design of experiment. It is necessary to have some facility with algebraic notation and manipulation to be able to use the volume intelligently. The problems are presented from the theoretical point of view, without such practical examples as would be helpful for those not acquainted with mathematics. The mathematical justification for the techniques is given. As a somewhat advanced treatment of the design and analysis of experiments, this volume will be interesting and helpful for many who approach statistics theoretically as well as practically. With emphasis on the \"why,\" and with description given broadly, the author relates the subject matter to the general theory of statistics and to the general problem of experimental inference. MARGARET J. ROBERTSON

13,333 citations

Reference EntryDOI
31 Oct 2001
TL;DR: The American Society for Testing and Materials (ASTM) as mentioned in this paper is an independent organization devoted to the development of standards for testing and materials, and is a member of IEEE 802.11.
Abstract: The American Society for Testing and Materials (ASTM) is an independent organization devoted to the development of standards.

3,792 citations

Book ChapterDOI
01 Jan 1976
TL;DR: A positive temperature coefficient is the term which has been used to indicate that an increase in solubility occurs as the temperature is raised, whereas a negative coefficient indicates a decrease in Solubility with rise in temperature.
Abstract: A positive temperature coefficient is the term which has been used to indicate that an increase in solubility occurs as the temperature is raised, whereas a negative coefficient indicates a decrease in solubility with rise in temperature.

1,573 citations