Vincent Larrey

Bio: Vincent Larrey is an academic researcher from Radiall (France). The author has contributed to research in topics: Multi-mode optical fiber & Fiber optic splitter. The author has an hindex of 1, co-authored 1 publications receiving 2 citations.

Reliability of fiber arrays

Abstract: The packaging of optical components (splitters, WDM, VOA, switches) used in telecommunication applications uses very often Fiber Arrays: it is indeed a very practical component to connect high channel count components (from 1 to 48 channels typically) to the outside world. These Fiber Arrays can be in different formats: standard, focusing, collimating, with single mode fiber or polarization maintaining fiber. But the optical performance of the packaged component is primarily linked to the performance of the Fiber Array. Also, the reliability of the packaged component is mainly determined by the reliability of the Fiber Array, and the way it is attached to the component. The optical performance includes mainly the fiber position error (Core Offset), which determines the insertion loss, but also the polishing induced parameters: polishing angles, surface planarity, fiber protrusion. Optical parameters are also important: excess loss, PDL, and return loss. During the presentation will be related some measurement options, and some results. The reliability of the fiber array is also very important, in order to meet the Telcordia qualification on the packaged product. Unfortunately, these standards, which apply to the packaged component, does not describe qualification procedures for Fiber Arrays, leaving some uncertainty on how to assess the reliability of the product. Different qualification options will be discussed, and some Telcordia qualification results shown.

Packaging de composants optiques et optoélectroniques : état de l'art et perspectives

Abstract: Le developpement recent des reseaux de telecommunication optique a pu se realiser grâce a de nouvelles fonctions optiques : WDM (Wavelength Division Multiplexing), VOA (Variable Optical Attenuator), switches optiques, lasers accordables en longueur d'onde... Ces fonctions sont en general realisees avec des technologies d'optique planaire (sur substrat silicium, verre) avec des technologies de MEMS (miroirs mobiles par exemple) ou en combinant les deux (guide planaire et MEMS). Les developpements recents dans ces domaines ont fait l'objet de nombreuses declarations (switches 1000 x 1000 ou composants WDM a plus de 100 voies par exemple). Les produits reellement disponibles ou commercialises sont toutefois plus modestes (switchs 16 x 16, WDM a 48 voies maximum). Outre les difficultes liees a la fabrication des puces, dont les rendements de fabrication decroissent exponentiellement avec le degre de complexite, la problematique du packaging de ces puces est plus rarement abordee. C'est pourtant le packaging et le test de ces puces qui representent la plus grosse partie du cout du composant, et affectent le rendement global de fabrication, ainsi que les performances.