https://www.diva-portal.org/smash/get/diva2:17175/FULLTEXT02

Ionized physical vapor deposition (IPVD): A review of technology and applications

http://liu.diva-portal.org/smash/get/diva2:303552/FULLTEXT01

The Mn+1AXn phases: Materials science and thin-film processing

High power pulsed magnetron sputtering (HPPMS) is an emerging technology that has gained substantial interest among academics and industrials alike. HPPMS, also known as HIPIMS (high power impulse ...

High power pulsed magnetron sputtering: A review on scientific and engineering state of the art

This updated version of the popular handbook further explains all aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the new edition remains on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications, with additional information to support the original material. The book covers subjects seldom treated in the literature: substrate characterization, adhesion, cleaning and the processing. The book also covers the widely discussed subjects of vacuum technology and the fundamentals of individual deposition processes. However, the author uniquely relates these topics to the practical issues that arise in PVD processing, such as contamination control and film growth effects, which are also rarely discussed in the literature. In bringing these subjects together in one book, the reader can understand the interrelationship between various aspects of the film deposition processing and the resulting film properties. The author draws upon his long experience with developing PVD processes and troubleshooting the processes in the manufacturing environment, to provide useful hints for not only avoiding problems, but also for solving problems when they arise. He uses actual experiences, called 'war stories', to emphasize certain points. Special formatting of the text allows a reader who is already knowledgeable in the subject to scan through a section and find discussions that are of particular interest. The author has tried to make the subject index as useful as possible so that the reader can rapidly go to sections of particular interest. Extensive references allow the reader to pursue subjects in greater detail if desired. The book is intended to be both an introduction for those who are new to the field and a valuable resource to those already in the field. The discussion of transferring technology between R&D and manufacturing provided in Appendix 1, will be of special interest to the manager or engineer responsible for moving a PVD product and process from R&D into production. Appendix 2 has an extensive listing of periodical publications and professional societies that relate to PVD processing. The extensive Glossary of Terms and Acronyms provided in Appendix 3 will be of particular use to students and to those not fully conversant with the terminology of PVD processing or with the English language. This title is fully revised and updated to include the latest developments in PVD process technology. It includes 'War stories' drawn from the author's extensive experience emphasize important points in development and manufacturing. Appendices include listings of periodicals and professional societies, terms and acronyms, and material on transferring technology between R&D and manufacturing.

Handbook of physical vapor deposition (PVD) processing

https://escholarship.org/content/qt3261x4bm/qt3261x4bm.pdf?t=li5xir

A structure zone diagram including plasma-based deposition and ion etching

Using a novel pulsed power supply in combination with a standard circular flat magnetron source, operated with a Cu target, a peak power density of 2800 W cm -2 was achieved. This results in a very intense plasma with peak ion current densities of up to 3.4 A cm −2 at the substrate situated 10 cm from the target. The ionized fraction of the deposited Cu flux was estimated to be approximately 70% from deposition rate measurements. The potential for high-aspect-ratio trench filling applications by high power pulsed magnetron sputtering is demonstrated by deposition in via-structures. The high power pulsed technique also results in a higher degree of target utilization and an improved thickness uniformity of the deposited films compared with conventional d.c. magnetron sputtering.

A novel pulsed magnetron sputter technique utilizing very high target power densities

Influence of high power densities on the composition of pulsed magnetron plasmas

Time resolved plasma probe measurements of a novel high power density pulsed plasma discharge are presented. Extreme peak power densities in the pulse (on the order of several kW cm−2) result in a very dense plasma with substrate ionic flux densities of up to 1 A cm−2 at source-to-substrate distances of several cm and at a pressure of 0.13 Pa (1 mTorr). The pulse duration was ∼100 μs with a pulse repetition frequency of 50 Hz. The plasma consists of metallic and inert gas ions, as determined from time resolved Langmuir probe measurements and in situ optical emission spectroscopy data. It was found that the plasma composition at the beginning of the pulse was dominated by Ar ions. As time elapsed metal ions were detected and finally dominated the ion composition. The effect of the process parameters on the temporal development of the ionic fluxes is discussed. The ionized portion of the sputtered metal flux was found to have an average velocity of 2500 m s−1 at 6 cm distance from the source, which conforms...

Vladimir Kouznetsov

Papers

A novel pulsed magnetron sputter technique utilizing very high target power densities

Influence of high power densities on the composition of pulsed magnetron plasmas

Ionized sputter deposition using an extremely high plasma density pulsed magnetron discharge