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W.I. Wang

Bio: W.I. Wang is an academic researcher from IBM. The author has contributed to research in topics: Quantum tunnelling & Hall effect. The author has an hindex of 2, co-authored 2 publications receiving 812 citations.

Papers
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Journal ArticleDOI
TL;DR: In this article, an accurate determination of the physical oxide thickness is achieved by fitting experimentally measured capacitanceversus-voltage curves to quantum-mechanically simulated capacitance-versusvoltage results.
Abstract: Quantum-mechanical modeling of electron tunneling current from the quantized inversion layer of ultra-thin-oxide (<40 /spl Aring/) nMOSFET's is presented, together with experimental verification. An accurate determination of the physical oxide thickness is achieved by fitting experimentally measured capacitance-versus-voltage curves to quantum-mechanically simulated capacitance-versus-voltage results. The lifetimes of quasibound states and the direct tunneling current are calculated using a transverse-resonant method. These results are used to project an oxide scaling limit of 20 /spl Aring/ before the chip standby power becomes excessive due to tunneling currents,.

784 citations

Journal ArticleDOI
Sandip Tiwari1, W.I. Wang1
TL;DR: In this article, a GaAlAs/GaAs modulation-doped hole gas structure was fabricated and the properties of the hole gas system tested to ascertain its suitability for complementary logic.
Abstract: p-channel MODFET's were fabricated in the GaAlAs/GaAs system and the properties of the hole gas system tested to ascertain its suitability for complementary logic. The Hall mobilities on a Ga .5 Al .5 As/GaAs modulation-doped hole gas structure were measured to be 3650 cm2V-1s-1and 54000 cm2V-1s-1with sheet carrier concentration of 1 × 1012cm-2and 7.76 × 1011cm-2at 77 and 4.2 K, respectively. The measured transconductances of 1.5-µm gate-length MODFET's on this structure were measured to lie in the range of 28-35 mS.mm-1at 77 K. The field mobility measured on long gate-length MODFET's was approximately 3200 cm2V-1s-1at 77 K. Using test structures for measuring current voltage characteristic in the hole-gas system, low field drift mobility was measured to be 3000 cm2V-1s-1and velocities of 3 5 × 106cm.s-1were measured at electric fields of 3-4 kV.cm-1at 77 K. The Schottky barriers showed low leakage and a barrier height of 0.7 to 0.8 eV. Calculations indicate that transconductances of approximately 100 mS.mm-1should be achievable in this system for similar gate lengths.

39 citations


Cited by
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Book
Yuan Taur1, Tak H. Ning1
01 Jan 2016
TL;DR: In this article, the authors highlight the intricate interdependencies and subtle tradeoffs between various practically important device parameters, and also provide an in-depth discussion of device scaling and scaling limits of CMOS and bipolar devices.
Abstract: Learn the basic properties and designs of modern VLSI devices, as well as the factors affecting performance, with this thoroughly updated second edition. The first edition has been widely adopted as a standard textbook in microelectronics in many major US universities and worldwide. The internationally-renowned authors highlight the intricate interdependencies and subtle tradeoffs between various practically important device parameters, and also provide an in-depth discussion of device scaling and scaling limits of CMOS and bipolar devices. Equations and parameters provided are checked continuously against the reality of silicon data, making the book equally useful in practical transistor design and in the classroom. Every chapter has been updated to include the latest developments, such as MOSFET scale length theory, high-field transport model, and SiGe-base bipolar devices.

2,680 citations

Journal ArticleDOI
TL;DR: In this article, a review of the development of high-k gate oxides such as hafnium oxide (HFO) and high-K oxides is presented, with the focus on the work function control in metal gate electrodes.
Abstract: The scaling of complementary metal oxide semiconductor transistors has led to the silicon dioxide layer, used as a gate dielectric, being so thin (14?nm) that its leakage current is too large It is necessary to replace the SiO2 with a physically thicker layer of oxides of higher dielectric constant (?) or 'high K' gate oxides such as hafnium oxide and hafnium silicate These oxides had not been extensively studied like SiO2, and they were found to have inferior properties compared with SiO2, such as a tendency to crystallize and a high density of electronic defects Intensive research was needed to develop these oxides as high quality electronic materials This review covers both scientific and technological issues?the choice of oxides, their deposition, their structural and metallurgical behaviour, atomic diffusion, interface structure and reactions, their electronic structure, bonding, band offsets, electronic defects, charge trapping and conduction mechanisms, mobility degradation and flat band voltage shifts The oxygen vacancy is the dominant electron trap It is turning out that the oxides must be implemented in conjunction with metal gate electrodes, the development of which is further behind Issues about work function control in metal gate electrodes are discussed

1,520 citations

Journal ArticleDOI
TL;DR: In this article, the choice of oxides, their structural and metallurgical behaviour, atomic diffusion, their deposition, interface structure and reactions, their electronic structure, bonding, band offsets, mobility degradation, flat band voltage shifts and electronic defects are discussed.
Abstract: The scaling of complementary metal oxide semiconductor (CMOS) transistors has led to the silicon dioxide layer used as a gate dielectric becoming so thin (1.4 nm) that its leakage current is too large. It is necessary to replace the SiO2 with a physically thicker layer of oxides of higher dielectric constant (κ) or 'high K' gate oxides such as hafnium oxide and hafnium silicate. Little was known about such oxides, and it was soon found that in many respects they have inferior electronic properties to SiO2 ,s uch as a tendency to crystallise and a high concentration of electronic defects. Intensive research is underway to develop these oxides into new high quality electronic materials. This review covers the choice of oxides, their structural and metallurgical behaviour, atomic diffusion, their deposition, interface structure and reactions, their electronic structure, bonding, band offsets, mobility degradation, flat band voltage shifts and electronic defects. The use of high K oxides in capacitors of dynamic random access memories is also covered.

1,500 citations

Journal ArticleDOI
David J. Frank1, R.H. Dennard1, E. J. Nowak1, Paul M. Solomon1, Yuan Taur1, Hon-Sum Philip Wong1 
01 Mar 2001
TL;DR: The end result is that there is no single end point for scaling, but that instead there are many end points, each optimally adapted to its particular applications.
Abstract: This paper presents the current state of understanding of the factors that limit the continued scaling of Si complementary metal-oxide-semiconductor (CMOS) technology and provides an analysis of the ways in which application-related considerations enter into the determination of these limits. The physical origins of these limits are primarily in the tunneling currents, which leak through the various barriers in a MOS field-effect transistor (MOSFET) when it becomes very small, and in the thermally generated subthreshold currents. The dependence of these leakages on MOSFET geometry and structure is discussed along with design criteria for minimizing short-channel effects and other issues related to scaling. Scaling limits due to these leakage currents arise from application constraints related to power consumption and circuit functionality. We describe how these constraints work out for some of the most important application classes: dynamic random access memory (DRAM), static random access memory (SRAM), low-power portable devices, and moderate and high-performance CMOS logic. As a summary, we provide a table of our estimates of the scaling limits for various applications and device types. The end result is that there is no single end point for scaling, but that instead there are many end points, each optimally adapted to its particular applications.

1,417 citations

Journal ArticleDOI
31 Aug 2000-Nature
TL;DR: Development of higher permittivity dielectrics for dynamic random-access memories serves to illustrate the magnitude of the now urgent problem of identifying alternatives to silicon dioxide for the gate dielectric in logic devices, such as the ubiquitous field-effect transistor.
Abstract: The silicon-based microelectronics industry is rapidly approaching a point where device fabrication can no longer be simply scaled to progressively smaller sizes. Technological decisions must now be made that will substantially alter the directions along which silicon devices continue to develop. One such challenge is the need for higher permittivity dielectrics to replace silicon dioxide, the properties of which have hitherto been instrumental to the industry's success. Considerable efforts have already been made to develop replacement dielectrics for dynamic random-access memories. These developments serve to illustrate the magnitude of the now urgent problem of identifying alternatives to silicon dioxide for the gate dielectric in logic devices, such as the ubiquitous field-effect transistor.

1,179 citations