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Wataru Nakayama

Bio: Wataru Nakayama is an academic researcher from Hitachi. The author has an hindex of 1, co-authored 1 publications receiving 125 citations.

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Book ChapterDOI
TL;DR: The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones on the thermal control of semiconductor devices, modules, and total systems.
Abstract: Publisher Summary Thermal control of electronic components has one principal objective, to maintain relatively constant component temperature equal to or below the manufacturer's maximum specified service temperature, typically between 85 and 100°C. It is noted that even a single component operating 10°C beyond this temperature can reduce the reliability of certain systems by as much as 50%. Therefore, it is important for the new thermal control schemes to be capable of eliminating hot spots within the electronic devices, removing heat from these devices and dissipating this heat to the surrounding environment. Several strategies have developed over the years for controlling and removing the heat generated in multichip modules, which include advanced air-cooling schemes, direct cooling, and miniature thermosyphons or free-falling liquid films. The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones. The chapter focuses on investigations performed over the past decade and includes information on the thermal control of semiconductor devices, modules, and total systems.

285 citations

Journal ArticleDOI
TL;DR: This paper shows that with the apparent slowing down of semiconductor scaling and the advent of the Internet of Things, there is a focus on heterogeneous integration and system-level scaling, and proposes ways in which this transformation can evolve to provide a significant value at the system level while providing a significantly lower barrier to entry compared with a chip-based SoC approach.
Abstract: Moore’s law has so far relied on the aggressive scaling of CMOS silicon minimum features of over $1000\times $ for over four decades, and recently, on the adoption of innovative features, such as Cu interconnects, low- $k$ dielectrics for interconnects, strained channels, and high- $k$ materials for gate dielectrics, resulting in a better power performance, cost per function, and density every generation. This has spawned a vibrant system-on-chip (SoC) approach, where progressively more function has been integrated on a single die. The integration of multiple dies on packages and boards has, however, scaled only modestly by a factor of three to five times. In this paper, we show that with the apparent slowing down of semiconductor scaling and the advent of the Internet of Things, there is a focus on heterogeneous integration and system-level scaling. Packaging is undergoing a transformation that focuses on overall system performance and cost rather than on individual components. We propose ways in which this transformation can evolve to provide a significant value at the system level while providing a significantly lower barrier to entry compared with a chip-based SoC approach that is currently used. This transformation is already under way with 3-D stacking of dies and will evolve to make heterogeneous integration the backbone of sustaining Moore’s law in the years ahead.

108 citations

Journal ArticleDOI
TL;DR: The main aims of this study are to cover the research gap in a review of cross-section impact on the thermo-hydraulic performance of microchannel heat sinks and the commercialized heat sinks for electronics cooling were discussed which has not been reported before.

98 citations

Journal ArticleDOI
TL;DR: The state-of-the-art in air and liquid-cooled multichip modules is examined in this paper, where the salient features of eight distinct modules, defined their thermal characteristics and established a consistent basis for comparing and evaluating their thermal performance.
Abstract: The state-of-the-art in air- and liquid-cooled multichip modules is examined. An effort is made to identify the salient features of eight distinct modules, define their thermal characteristics, and establish a consistent basis for comparing and evaluating their thermal performance.

95 citations

Journal ArticleDOI
TL;DR: In this paper, experiments were performed to determine the convective heat transfer coefficients for water cooling of inline and staggered arrays of 30 heated protruding elements arranged in six rows, and the data for all spacings were correlated using an array Reynolds number which accounts for a partitioning of the flow into bypass and array flows.

92 citations