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Wenqiang Li

Bio: Wenqiang Li is an academic researcher from Northwestern Polytechnical University. The author has contributed to research in topics: Heat transfer & Coolant. The author has an hindex of 9, co-authored 26 publications receiving 237 citations.

Papers
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Journal ArticleDOI
15 May 2017-Energy
TL;DR: In this article, a new strategy for passive thermal management with microencapsulated phase change material (MEPCM) particles embedded into cellular metal foam was proposed in order to improve the thermal conductivity of PCM.

60 citations

Journal ArticleDOI
15 Dec 2018-Energy
TL;DR: In this paper, a novel thermally stable and efficient hybrid PCM that infiltrates nano-PCMS into metal foam for passive thermal management was proposed, which not only provides high heat transfer efficiency, but also reduces the dependency on the convection coefficient of nanoPCMS.

53 citations

Journal ArticleDOI
TL;DR: In this article, an efficient hybrid phase change material (PCM) for passive thermal management that integrated micro-encapsulated MEPCM and metal foam was proposed, which was aimed to enhance the heat transfer of MEMCM, while avoiding the leakage of molten phase change materials (MCM).

52 citations

Journal ArticleDOI
TL;DR: In this paper, an enhanced energy storage technique with microencapsulated phase change material (MEPCM) saturated in metal foam is proposed to address the issues of low thermal conductivity and volume expansion during phase transition.

43 citations

Journal ArticleDOI
TL;DR: In this article, an experimental investigation of thermal and thermoelectric performances of integrated energy storage/release/harvesting system that utilized PCM-based metal foam composite for enhanced latent-heat energy storage and employed TEG for energy harvest was conducted.

39 citations


Cited by
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Journal ArticleDOI
TL;DR: In this paper, the effect of porosity and pore density on heat transfer, thermal conductivity, specific heat, latent heat and charging/discharging time are critically reviewed.

336 citations

Journal ArticleDOI
TL;DR: In this paper, the authors studied free convective flow and heat transfer of a suspension of nano-encapsulated phase change materials (NEPCMs) in an enclosure and found that the enhancement of heat transfer is highly dependent on the non-dimensional fusion temperature, θf, and very good performance can be achieved in the range of ¼ < θ f < 0.

240 citations

Journal ArticleDOI
TL;DR: In this paper, a visible experimental device was built to investigate the melting behavior of paraffin with and without copper foam, and the effect of the heating position on the thermal performance of copper foam/paraffin composite phase change material (CPCM) was also discussed.

213 citations

Journal ArticleDOI
15 Nov 2020-Energy
TL;DR: In this article, a detailed illustration of phase change materials and their working principle, different types, and properties are provided, and a characteristic example of PCM in solar energy storage and the design of PCMs are reviewed and analyzed.

210 citations

Journal ArticleDOI
TL;DR: In this article, the authors discuss the advantages and mechanisms of 3D interconnected heat-conductive networks for preparing thermally conductive polymer-based composites and highlight new advancements in the design and fabrication of three-dimensional interconnected heat conductive networks as well as their application in improving the k of polymers.
Abstract: With the development of science and technology, microelectronic components have evolved to become increasingly integrated and miniaturized. As a result, thermal management, which can seriously impact the function, reliability, and lifetime of such components, has become a critical issue. Recently, the use of polymer-based thermal interface materials (TIMs) in thermal management systems has attracted considerable attention in view of the superior comprehensive properties of the former. Compared with designing and fabricating a polymer with an intrinsically high thermal conductivity, a more effective and widely used strategy for improving the heat conductivity is to fill a polymer matrix with a thermally conductive filler. Specifically, three-dimensional (3D) interconnected heat-conductive networks can increase the thermal conductivity (k) of polymers more effectively than dispersed fillers can, owing to their intrinsic continuous structures. In this review, we first introduce the heat conduction mechanisms and the problems associated with polymer-based TIMs fabricated using engineering polymer chains and traditional filling methods. Next, we discuss the advantages and mechanisms of 3D interconnected heat-conductive networks for preparing thermally conductive polymer-based composites. In addition, we highlight new advancements in the design and fabrication of 3D thermally conductive networks as well as their application in improving the k of polymers. Our exhaustive review of 3D interconnected networks includes graphene, carbon nanotubes, boron nitride, metal and other 3D hybrid architectures. The key structural parameters and control methods for improving the thermal properties of polymer composites are outlined. Finally, we summarize some effective strategies and possible challenges for the development of polymer-based thermally conductive composites via integration with 3D interconnected networks.

205 citations