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Werner John

Bio: Werner John is an academic researcher from Leibniz University of Hanover. The author has contributed to research in topics: Equivalent circuit & Electromagnetic compatibility. The author has an hindex of 14, co-authored 81 publications receiving 722 citations. Previous affiliations of Werner John include Fraunhofer Society & Technical University of Dortmund.


Papers
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Proceedings ArticleDOI
19 Mar 2006
TL;DR: In this article, a simple but highly accurate high frequency model of induction machines for time and frequency domain simulation is presented, which enables exact simulation of both, differential and common mode behavior in the EMI-frequency range up to 30MHz.
Abstract: In this paper, a simple but highly accurate high frequency model of induction machines for time and frequency domain simulation is presented. The proposed model enables exact simulation of both, differential and common mode behavior in the EMI-frequency range up to 30MHz. All parameters are easily obtained by differential and common mode impedance measurements and proposed calculation methodology. The model is verified for several induction machines in the power range of 370W up to 45kW. Comparison of simulation and measurement results confirm the good compromise between simulation time and accuracy even in complex simulation problems.

87 citations

Journal ArticleDOI
A.E. Engin1, Werner John1, G. Sommer1, Wolfgang Mathis, Herbert Reichl 
TL;DR: In this article, a stripline model for coupled signal lines routed between a power and a ground plane based on multiconductor transmission line (MTL) theory is presented, which is applied to represent mode conversion due to vias, holes in the reference planes, and terminations.
Abstract: In this paper, a stripline model is presented for coupled signal lines routed between a power and a ground plane based on multiconductor transmission line (MTL) theory. Through a suitable diagonalization of the MTL equations for striplines, the transverse electromagnetic (TEM) parallel-plate mode is decoupled from the stripline mode. In this way, stripline models that are obtained assuming ideal planes at ground potential can be extended to take into account the nonideal behavior of the planes. The presented model is applied to represent mode conversion due to vias, holes in the reference planes, and terminations of the stripline. Influence of inhomogeneous media is discussed

71 citations

Proceedings ArticleDOI
Stephan Guttowski1, S. Weber1, Eckart Hoene1, Werner John1, Herbert Reichl1 
14 Oct 2003
TL;DR: In this paper, the integration of electric drive systems into today's cars represents a substantial challenge and the EMC issues related to integration of an electric drive system into a conventional passenger car are investigated.
Abstract: From the EMC point of view, the integration of electric drive systems into today's cars represents a substantial challenge. The electric drive system is a new component consisting of a high-voltage power source, a frequency converter, an electric motor and shielded or unshielded high-power cables. Treating this new electric drive system or its components as a conventional automotive component in terms of EMI test procedures and emission limits would lead to substantial incompatibility problems. In this paper, the EMC issues related to the integration of an electric drive system into a conventional passenger car are investigated. The components of the drive system have been analyzed being either noise sources or part of the coupling path within the new electrical system of the car. The obtained results can also be used to determine the acceptable noise levels on a high voltage bus of an electric drive system.

71 citations

Proceedings ArticleDOI
16 Jun 2005
TL;DR: In this article, a simulation method for predicting stray fields of components and conducting structures is introduced, which is verified experimentally for different passive components and setups, and examples demonstrate a possibility of handling interaction problems.
Abstract: In high power density inverters with integrated functions like filters and control electronics electromagnetic interaction between components becomes an important issue. Especially filters for electromagnetic interference are very sensitive to electromagnetic fields and therefore critical to design. Nevertheless only few guidelines for optimizing placement of filter components were published up to now. This paper introduces a simulation method for predicting stray fields of components and conducting structures, which is verified experimentally for different passive components and setups. The examples demonstrate a possibility of handling interaction problems

45 citations

Proceedings ArticleDOI
S. Weber1, Eckart Hoene1, Stephan Guttowski1, Werner John1, Herbert Reichl1 
20 Jun 2004
TL;DR: A model for induction machines' EMC behaviour simulation is parameterized in the frequency range from some kHz up to 100 MHz and the high-frequency characteristics of induction machines with power ratings from 370 W up to 45 kW are compared.
Abstract: EMC-analysis of power electronic systems is strongly supported by network simulations. Simulations at the system level provide not only the prediction of EMI but also deep insight into the EMC relevant effects. To model the system properly, it is necessary to model source and target of EMI and also all parts of the coupling paths. EMI-filters can be designed efficiently using network based modeling approaches. In this paper a model for induction machines' EMC behaviour simulation is parameterized in the frequency range from some kHz up to 100 MHz. The high-frequency characteristics of induction machines with power ratings from 370 W up to 45 kW are compared and a model library is set up for both, frequency and time domain.

32 citations


Cited by
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01 Jan 2016
TL;DR: This rfid handbook fundamentals and applications in contactless smart cards and identification helps people to read a good book with a cup of coffee in the afternoon instead of juggled with some malicious bugs inside their laptop.
Abstract: Thank you for reading rfid handbook fundamentals and applications in contactless smart cards and identification. As you may know, people have search numerous times for their chosen novels like this rfid handbook fundamentals and applications in contactless smart cards and identification, but end up in malicious downloads. Rather than reading a good book with a cup of coffee in the afternoon, instead they juggled with some malicious bugs inside their laptop.

570 citations

Journal ArticleDOI
TL;DR: A review of state of charge (SoC) estimation for lithium-ion batteries is presented in this article, focusing on the description of the techniques and the elaboration of their weaknesses for the use in online battery management systems (BMS) applications.
Abstract: Energy storage emerged as a top concern for the modern cities, and the choice of the lithium-ion chemistry battery technology as an effective solution for storage applications proved to be a highly efficient option. State of charge (SoC) represents the available battery capacity and is one of the most important states that need to be monitored to optimize the performance and extend the lifetime of batteries. This review summarizes the methods for SoC estimation for lithium-ion batteries (LiBs). The SoC estimation methods are presented focusing on the description of the techniques and the elaboration of their weaknesses for the use in on-line battery management systems (BMS) applications. SoC estimation is a challenging task hindered by considerable changes in battery characteristics over its lifetime due to aging and to the distinct nonlinear behavior. This has led scholars to propose different methods that clearly raised the challenge of establishing a relationship between the accuracy and robustness of the methods, and their low complexity to be implemented. This paper publishes an exhaustive review of the works presented during the last five years, where the tendency of the estimation techniques has been oriented toward a mixture of probabilistic techniques and some artificial intelligence.

219 citations

Journal ArticleDOI
TL;DR: The fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades are reviewed and the necessity of practical training of designers is mentioned.
Abstract: This paper reviews the fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades. Most results in this field are based on the very rich and highly educational literature produced by Prof. C. Paul in his long scientific career. The inclusion of parameters variability effects is also considered, and it is demonstrated how statistical simulations can become affordable by means of recently-introduced stochastic methods. Finally, the necessity of practical training of designers is mentioned, and an experience relying on realistic PCB demonstrators is illustrated.

166 citations

Journal ArticleDOI
TL;DR: In this article, the state of the arts of IC, electronic package, and printed circuit board simulation and modeling technologies are summarized for both available structures [multilayered powerground planes and macromodeling of interconnect (INC)] and novel structures (nano-INCs and 3-D ICs based on through-silicon via technology).
Abstract: The ever-increasing demands of digital computing and wireless communication have been driving the semiconductor technology to change with each passing day. Modern electronic systems integrate more complex components and devices, which results in a very complex electromagnetic (EM) field environment. EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of efficient and accurate simulation tools and expertise on noise reduction and immunity improvement. This paper reviews the state of the arts of IC, electronic package, and printed circuit board simulation and modeling technologies. It summarizes the modeling technologies for both available structures [multilayered power-ground planes and macromodeling of interconnect (INC)] and novel structures (nano-INCs and 3-D ICs based on through-silicon via technology). It also illustrates the trends of simulation and modeling technologies in EM compatibility, signal integrity, and power integrity.

166 citations