X. H. Chen

Bio: X. H. Chen is an academic researcher from Chinese Academy of Sciences. The author has contributed to research in topics: Ultimate tensile strength & Work hardening. The author has an hindex of 5, co-authored 6 publications receiving 837 citations. Previous affiliations of X. H. Chen include Chongqing University.

High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins

Abstract: Bulk Cu foils have been synthesized via magnetron sputtering with an average twin spacing of 5 nm. Twin interfaces are of {111} type and normal to the growth direction. Growth twins with such high twin density and preferred orientation have never been observed in elemental metals. These Cu foils exhibited tensile strengths of 1.2 GPa, a factor of 3 higher than that reported earlier for nanocrystalline Cu, average uniform elongation of 1%-2%, and ductile dimple fracture surfaces. This work provides a route for the synthesis of ultrahigh-strength, ductile pure metals via control of twin spacing and twin orientation in vapor-deposited materials. (c) 2006 American Institute of Physics.

Electrical resistivity of ultrafine-grained copper with nanoscale growth twins

Abstract: We have investigated electrical resistivities of high-purity ultrafine-grained Cu containing different concentrations of nanoscale growth twins, but having identical grain size. The samples were synthesized by pulsed electrodeposition, wherein the density of twins was varied systematically by adjusting the processing parameters. The electrical resistivity of the Cu specimen with a twin spacing of 15nm at room temperature (RT) is 1.75μΩcm (the conductivity is about 97% IACS), which is comparable to that of coarse-grained (CG) pure Cu specimen. A reduction in twin density for the same grain size (with twin lamellar spacings of 35 and 90nm, respectively) results in an increment in electrical resistivity from 1.75to2.12μΩcm. However, the temperature coefficient of resistivity at RT for these Cu specimens is insensitive to the twin spacing and shows a consistent value of ∼3.78×10−3∕K, which is slightly smaller than that of CG Cu (3.98×10−3∕K). The increased electrical resistivities of the Cu samples were ascribed dominantly to the intrinsic grain boundary (GB) scattering, while the GB defects and GB energy would decrease with increasing twin density. Transmission electron microscope observations revealed the GB configuration difference from the Cu samples with various twin densities. Plastic deformation would induce an apparent increase in the resistivity. The higher of the twin density, the higher increment of RT resistivity was detected in the Cu specimens subjected to 40% rolling strain. Both the deviated twin boundaries and strained GBs may give rise to an increase in the resistivity.

Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale

Abstract: [Lu, K.; Lu, L.] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China. [Lu, L.; Suresh, S.] MIT, Sch Engn, Cambridge, MA 02139 USA.;Lu, K (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China;lu@imr.ac.cn ssuresh@mit.edu

Recent developments in stainless steels

Abstract: This article presents an overview of the developments in stainless steels made since the 1990s. Some of the new applications that involve the use of stainless steel are also introduced. A brief introduction to the various classes of stainless steels, their precipitate phases and the status quo of their production around the globe is given first. The advances in a variety of subject areas that have been made recently will then be presented. These recent advances include (1) new findings on the various precipitate phases (the new J phase, new orientation relationships, new phase diagram for the Fe–Cr system, etc.); (2) new suggestions for the prevention/mitigation of the different problems and new methods for their detection/measurement and (3) new techniques for surface/bulk property enhancement (such as laser shot peening, grain boundary engineering and grain refinement). Recent developments in topics like phase prediction, stacking fault energy, superplasticity, metadynamic recrystallisation and the calculation of mechanical properties are introduced, too. In the end of this article, several new applications that involve the use of stainless steels are presented. Some of these are the use of austenitic stainless steels for signature authentication (magnetic recording), the utilisation of the cryogenic magnetic transition of the sigma phase for hot spot detection (the Sigmaplugs), the new Pt-enhanced radiopaque stainless steel (PERSS) coronary stents and stainless steel stents that may be used for magnetic drug targeting. Besides recent developments in conventional stainless steels, those in the high-nitrogen, low-Ni (or Ni-free) varieties are also introduced. These recent developments include new methods for attaining very high nitrogen contents, new guidelines for alloy design, the merits/demerits associated with high nitrogen contents, etc.

Revealing the Maximum Strength in Nanotwinned Copper

Abstract: [Lu, L.; Chen, X.; Lu, K.] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China. [Huang, X.] Tech Univ Denmark, Riso Natl Lab Sustainable Energy, Ctr Fundamental Res Met Struct Four Dimens, Dept Mat Res, DK-4000 Roskilde, Denmark.;Lu, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China;llu@imr.ac.cn

Additively manufactured hierarchical stainless steels with high strength and ductility

Abstract: Many traditional approaches for strengthening steels typically come at the expense of useful ductility, a dilemma known as strength-ductility trade-off. New metallurgical processing might offer the possibility of overcoming this. Here we report that austenitic 316L stainless steels additively manufactured via a laser powder-bed-fusion technique exhibit a combination of yield strength and tensile ductility that surpasses that of conventional 316L steels. High strength is attributed to solidification-enabled cellular structures, low-angle grain boundaries, and dislocations formed during manufacturing, while high uniform elongation correlates to a steady and progressive work-hardening mechanism regulated by a hierarchically heterogeneous microstructure, with length scales spanning nearly six orders of magnitude. In addition, solute segregation along cellular walls and low-angle grain boundaries can enhance dislocation pinning and promote twinning. This work demonstrates the potential of additive manufacturing to create alloys with unique microstructures and high performance for structural applications.