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Xingping Li

Bio: Xingping Li is an academic researcher from Chinese Academy of Sciences. The author has contributed to research in topics: Heat pipe & Heat flux. The author has an hindex of 4, co-authored 7 publications receiving 59 citations.

Papers
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Journal ArticleDOI
TL;DR: In this article, a micro-scale flat plate heat pipe with superhydrophilicity in a specially treated wick was explored and a visual study on the two-phase flow pattern was conducted.

62 citations

Journal ArticleDOI
TL;DR: Wang et al. as mentioned in this paper proposed a new cooling concept enabled by a compact loop heat pipe module, which can provide high reliability operation, meanwhile maintaining high thermal performance, and demonstrated that the 4-mm thick loop heatpipe module with finned tube condenser could dissipate a heat load of 150-W under a wide fan voltage range from 12-V to 24-V at tested directions when the chip junction temperature was below 85°C.

46 citations

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TL;DR: In this article, a super-large aluminum-based flat heat pipe (FHP) heat spreader with the overall size of 420mm × 210mm × 6.3mm was developed and systematically studied under natural convection condition.

16 citations

Journal ArticleDOI
TL;DR: In this paper, a visualized seasonal cold storage system utilizing a two-phase closed thermosyphon as the passive heat transfer device was presented and a theoretical model of energy conservation for the passive cold energy storage system was established.

16 citations

Journal ArticleDOI
TL;DR: In this paper, a miniature experimental apparatus was built and the characteristics of liquid-metal free surface flow and laminar convective heat transfer on different surface structures were experimentally investigated.

12 citations


Cited by
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Journal ArticleDOI
TL;DR: In this article, an experimental study was conducted to quantify the heat transfer coefficient of a liquid metal mixture including gallium, indium and tin (Ga-In-Sn) under various heat fluxes inside a compact heat exchanger equipped with rectangular micro-passages.

58 citations

Journal ArticleDOI
TL;DR: Wang et al. as mentioned in this paper proposed a new cooling concept enabled by a compact loop heat pipe module, which can provide high reliability operation, meanwhile maintaining high thermal performance, and demonstrated that the 4-mm thick loop heatpipe module with finned tube condenser could dissipate a heat load of 150-W under a wide fan voltage range from 12-V to 24-V at tested directions when the chip junction temperature was below 85°C.

46 citations

Journal ArticleDOI
TL;DR: In this paper, an experimental investigation was conducted on the fluid flow and heat transfer characteristics of gallium-indium eutectic flowing in the microchannel passages and the influence of low-frequency vibration at two frequencies and amplitudes on the overall heat transfer coefficient and thermo-hydraulic performance of the micro channel was also studied and discussed.

40 citations

Journal ArticleDOI
TL;DR: In this article, the heat transfer correlations of single-phase, two-phase and nanofluid in a micro-channel are discussed and analyzed, and the correlations of pressure drop for single phase and two phase fluids are also presented.
Abstract: The method to cool a high heat flux device is an important research direction for the heat exchanger design. Micro-channels are an effective heat exchange structure both for single-phase and two-phase flow. In this paper, the heat transfer correlations of single-phase, two-phase and nanofluid in a micro-channel are discussed and analyzed. The correlations of pressure drop for single-phase and two-phase fluids are also presented. Excluding the different working fluids used in the micro-channel, the diameter and aspect ratio, shape and structure, surface roughness, internal and external factor and layout of micro-channel pipe are considered to analyze their influence on the heat transfer performance and pressure drop. Micro-channel technology applications include industry, air-conditioning, solar energy systems, heat pipe technology and computer data center cooling. Compared to the conventional heat exchangers used in these fields, a micro-channel heat sink showed a much better heat transfer coefficient and low volume, indicating that it is a good choice and has huge potential for cooling application. Finally, existing problems and future scopes are described, and drawing up design standard, experimental and simulated methods for evaluating its performance are the urgent actions which need to be carried out. This review paper serves as guidance for researchers to design and predict the performance of micro-channel heat sinks.

36 citations

Journal ArticleDOI
TL;DR: This research presents a comprehensive review of the state-of-the-art for both rigid and flexible ultra-thin heat pipe technology for flexible thermal management solutions for foldable and wearable devices.

36 citations