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Y. C. Lee

Bio: Y. C. Lee is an academic researcher from Bell Labs. The author has contributed to research in topics: Child-resistant packaging & Microelectronics. The author has an hindex of 1, co-authored 1 publications receiving 1321 citations.

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15 Dec 1996

1,322 citations


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Journal ArticleDOI
TL;DR: In this paper, a number of cubic crystals, two-dimensional layered materials, nanostructure networks and composites, molecular layers and surface functionalization, and aligned polymer structures are examined for potential applications as heat spreading layers and substrates, thermal interface materials, and underfill materials in future-generation electronics.

1,269 citations

Journal ArticleDOI
TL;DR: An overview of antenna design for passive radio frequency identification (RFID) tags is presented, which outlines a generic design process including range measurement techniques and focuses on one practical application: RFID tag for box tracking in warehouses.
Abstract: In this paper, an overview of antenna design for passive radio frequency identification (RFID) tags is presented. We discuss various requirements of such designs, outline a generic design process including range measurement techniques and concentrate on one practical application: RFID tag for box tracking in warehouses. A loaded meander antenna design for this application is described and its various practical aspects such as sensitivity to fabrication process and box content are analyzed. Modeling and simulation results are also presented which are in good agreement with measurement data.

1,268 citations

Journal ArticleDOI
TL;DR: A review of the state-of-the-art polymer adhesive wafer bonding technologies, materials, and applications can be found in this paper, where the main advantages of this technique include the insensitivity to surface topography, the low bonding temperatures, the compatibility with standard integrated circuit wafer processing, and the ability to join different types of wafers.
Abstract: Wafer bonding with intermediate polymer adhesives is an important fabrication technique for advanced microelectronic and microelectromechanical systems, such as three-dimensional integrated circuits, advanced packaging, and microfluidics. In adhesive wafer bonding, the polymer adhesive bears the forces involved to hold the surfaces together. The main advantages of adhesive wafer bonding include the insensitivity to surface topography, the low bonding temperatures, the compatibility with standard integrated circuit wafer processing, and the ability to join different types of wafers. Compared to alternative wafer bonding techniques, adhesive wafer bonding is simple, robust, and low cost. This article reviews the state-of-the-art polymer adhesive wafer bonding technologies, materials, and applications.

494 citations

Journal ArticleDOI
TL;DR: 3D technology from IBM is highlighted, including demonstration test vehicles used to develop ground rules, collect data, and evaluate reliability, and examples of 3D emerging industry product applications that could create marketable systems are provided.
Abstract: Three-dimensional (3D) silicon integration of active devices with through-silicon vias (TSVs), thinned silicon, and silicon-to-silicon fine-pitch interconnections offers many product benefits. Advantages of these emerging 3D silicon integration technologies can include the following: power efficiency, performance enhancements, significant product miniaturization, cost reduction, and modular design for improved time to market. IBM research activities are aimed at providing design rules, structures, and processes that make 3D technology manufacturable for chips used in actual products on the basis of data from test-vehicle (i.e., prototype) design, fabrication, and characterization demonstrations. Three-dimensional integration can be applied to a wide range of interconnection densities (<10/cm2 to 108/cm2), requiring new architectures for product optimization and multiple options for fabrication. Demonstration test structures, which are designed, fabricated, and characterized, are used to generate experimental data, establish models and design guidelines, and help define processes for future product consideration. This paper 1) reviews technology integration from a historical perspective, 2) describes industry-wide progress in 3D technology with examples of TSV and silicon-silicon interconnection advancement over the last 10 years, 3) highlights 3D technology from IBM, including demonstration test vehicles used to develop ground rules, collect data, and evaluate reliability, and 4) provides examples of 3D emerging industry product applications that could create marketable systems.

461 citations

Journal ArticleDOI
TL;DR: The composite of diamond and copper have a potential for a heat spreading substrate with high performance and high reliability because not only its thermal conductivity is high but its coefficient of thermal expansion can be tailored according to a semiconductor material of electronics devices.

344 citations