Y
Y. Zhou
Researcher at University of Waterloo
Publications - 336
Citations - 11389
Y. Zhou is an academic researcher from University of Waterloo. The author has contributed to research in topics: Welding & Spot welding. The author has an hindex of 54, co-authored 316 publications receiving 9650 citations. Previous affiliations of Y. Zhou include Ryerson University & Tsinghua University.
Papers
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Low temperature sintering of Ag nanoparticles for flexible electronics packaging
TL;DR: In this article, the authors achieved robust bonding of Cu wires to Cu pads on polyimide with silver nanopaste cured at 373 K. The bonding is formed by solid state sintering of Ag NPs through neck growth and direct metallic bonding between clean Ag-Cu interfaces.
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Secondary phases in AlxCoCrFeNi high-entropy alloys: An in-situ TEM heating study and thermodynamic appraisal
Jiancun Rao,Jiancun Rao,Haoyan Diao,Vaclav Ocelik,D. Vainchtein,Chuan Zhang,Chih-Hsiang Kuo,Z. Tang,Wei Guo,Jonathan D. Poplawsky,Y. Zhou,Peter K. Liaw,J.Th.M. De Hosson +12 more
TL;DR: In this article, the formation of secondary phases at high temperatures, and their effect on mechanical properties, is investigated using the AlxCoCrFeNi (x = 0.3, 0.5, and 0.7) as a model alloy.
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Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging.
TL;DR: High temperature aging at 250 °C for up to 196 h has been used to accelerate the aging process of the bonds and the results of micro-XRD analysis confirmed that Cu 9 Al 4 , and CuAl 2 were the main IMC products, while a third phase is found which possibly is CuAl.
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Modelling of transient liquid phase bonding
TL;DR: In this article, the effects of increased diffusivity at base material grain boundaries, of grain boundary motion, and grain boundary grooving, on isothermal solidification during TLP bonding are described.
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Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging
TL;DR: In this paper, a method for preparing a paste containing a high concentration of Ag nanoparticles for pressureless bonding was developed. But this method requires the use of polyvinylpyrrolidone to prevent the coalescence of the nanoparticles.