Almost 15 years have gone ever since the discovery of graphene as a single atom layer. Numerous papers have been published to demonstrate its high electron mobility, excellent thermal and mechanical as well as optical properties. We have recently seen more and more applications towards using graphene in commercial products. This paper is an attempt to review and summarize the current status of the research of the thermal properties of graphene and other 2D based materials including the manufacturing and characterization techniques and their applications, especially in electronics and power modules. It is obvious from the review that graphene has penetrated the market and gets more and more applications in commercial electronics thermal management context. In the paper, we also made a critical analysis of how mature the manufacturing processes are; what are the accuracies and challenges with the various characterization techniques and what are the remaining questions and issues left before we see further more applications in this exciting and fascinating field.

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Graphene related materials for thermal management

Magnolol-based bio-epoxy resin with acceptable glass transition temperature, processability and flame retardancy

DCPDCE/BADCy hybrid resin and BN fillers were performed to fabricate the thermally conductive BN/DCPDCE/BADCy composites. When the molar ratio of DCPDCE/BADCy was 0.4/0.6, the dielectric constant (e) and dielectric loss tangent (tgδ) value of the DCPDCE/BADCy hybrid resin was decreased to 2.92 and 5.08 × 10−3, respectively. Impact and flexural strength was increased to 10.7 kJ/m2 and 100.7 MPa, respectively. And the heat-resistance index (THRI) was 201.6 °C. Furthermore, the thermally conductive coefficient (λ) of the BN/DCPDCE/BADCy composite with 30 wt% BN fillers was improved to 0.64 W/mK, about 3 times in comparison to that of pristine DCPDCE/BADCy hybrid resin. Compared to that of Maxwell and Russell models, our proposed thermally conductive model could predict the experimental λ values more precisely. THRI value was enhanced from 201.6 °C (Pristine DCPDCE/BADCy hybrid resin) to 206.6 °C. Moreover, the BN/DCPDCE/BADCy composite with 10 wt% BN presented the optimal impact strength (11.7 kJ/m2) and flexural strength (108.4 MPa).

Fabrication, proposed model and simulation predictions on thermally conductive hybrid cyanate ester composites with boron nitride fillers

Every time you create an iOS project, it will likely include at least two .swift files: ViewController.swift and AppDelegate.swift. A ViewController.swift file connects to a scene in a storyboard and lets you write code that manages the user interface. Each time you add another view controller scene to the storyboard, you’ll likely need another ViewController.swift file (under a different name) to manage any user interface objects such as buttons, text fields, or switches.

Understanding the Application Life Cycle

Novel composite proton exchange membrane with long-range proton transfer channels constructed by synergistic effect between acid and base functionalized graphene oxide

Phthalonitrile-based resin for advanced composite materials: Curing behavior studies

The thermosetting 4,4′-bis(3,4-dicyanophenoxy)biphenyl (BPh) was modified with the hydroxy-terminated poly(aryl ether nitrile) (PEN-OH). Two different crosslinking reactions including the polymerization of the nitrile groups and the formation of triazines were coexisted in the BPh/PEN-OH system, which depended on the different curing temperature. Moreover, along with the processing of crosslinking, the microstructure changed to plastic fracture first and then became brittle fracture (T > 320 °C), which was observed from SEM. The copolymer system showed good mechanical properties, outstanding thermal stability (over 520 °C) and high char yield (86.1% at 600 °C). Furthermore, they exhibited excellent dielectric properties. Both the dielectric constant and dielectric loss were found to be relatively stable over a wide range of frequencies ranging from 100 Hz to 200 kHz. Moreover, the dielectric stability was also found with respect to temperature.

Studied on mechanical, thermal and dielectric properties of BPh/PEN-OH copolymer

The thermal conductive cyanate ester/epoxy (CE/AG80) composites with hexagonal boron nitride (h-BN) reinforced were manufactured and investigated. The low and stable dielectric constant/loss of the composites with respect to both frequency (500 Hz-100 kHz) and temperature (50-350 °C) were discussed as functions of the content of h-BN. It was found that the low and stable dielectric constant/ loss of the composites can be maintained in the whole frequency range at room temperature, and the mutations of constant/loss at the frequency of 1 kHz occurred above 280 °C for all of the samples. Moreover, a remarkable enhancement of the thermal conductivity (0.54 W/mK a 1.8-fold enhancement) was achieved with the introduction of h-BN and significantly outperformed traditional thermal conductive fillers. The significant improvements of the thermal conductivity of the composites were analyzed by the Agari’s model and the parameters of C1 and C2 were also calculated.

Design of h-BN-Filled Cyanate/Epoxy Thermal Conductive Composite with Stable Dielectric Properties

Copolymerization is the typical method to obtain the high-performance resin composites, due to its universality and regulation performance. It can be employed among various resin matrices with active groups to obtain the desired structures, and subsequently, the outstanding properties. In this work, the copolymerization between the allyl-functional phthalonitrile-containing benzoxazine resin (DABA-Ph) and 4,4′-bis(Maleimidodiphenyl)methane (BMI) were monitored. The interactions among the active groups including allyl moieties, maleimide, benzoxazine rings and nitrile groups were investigated. Differential scanning calorimetry (DSC) and dynamic rheological analysis (DRA) were used to study the curing behaviors and the processing properties. The possible curing processes were proposed and confirmed by Fourier transform infrared spectroscopy (FTIR). Then, glass fiber-reinforced DABA-Ph/BMI composites were designed, and their thermal-mechanical properties were studied. Results indicated that all the composites exhibited outstanding flexural strength, flexural modulus, and high glass-transition temperatures (Tg > 450 °C). The thermal stability of the composites was studied by thermogravimetry (TGA) and evaluated by the integral program decomposition temperature (IPDT). it is believed that the excellent thermal mechanical properties and outstanding Tg as well as good thermal stability would enable the reinforced copolymer-based laminates to be applied in wider fields.

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Thermal Stability of Allyl-Functional Phthalonitriles-Containing Benzoxazine/Bismaleimide Copolymers and Their Improved Mechanical Properties.

The curing behavior and dielectric properties of cyanate ester/epoxy (EP) with a latent initiator imidazole was investigated as a function of blend composition. Differential scanning calorimetry (D...

http://journals.sagepub.com/doi/pdf/10.1177/0954008316672291

Yangxue Lei

Papers

Phthalonitrile-based resin for advanced composite materials: Curing behavior studies

Studied on mechanical, thermal and dielectric properties of BPh/PEN-OH copolymer

Design of h-BN-Filled Cyanate/Epoxy Thermal Conductive Composite with Stable Dielectric Properties

Thermal Stability of Allyl-Functional Phthalonitriles-Containing Benzoxazine/Bismaleimide Copolymers and Their Improved Mechanical Properties.

Curing behaviors of cyanate ester/epoxy copolymers and their dielectric properties