Yen-Hui Lin

Bio: Yen-Hui Lin is an academic researcher from National Sun Yat-sen University. The author has contributed to research in topics: Ground bounce & Signal integrity. The author has an hindex of 8, co-authored 14 publications receiving 627 citations.

Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits

Abstract: A power/ground planes design for efficiently eliminating the ground bounce noise (GBN) in high-speed digital circuits is proposed by using low-period coplanar electromagnetic bandgap (LPC-EBG) structure. Keeping solid for the ground plane and designing an LPC-EBG pattern on the power plane, the proposed structure omnidirectionally behaves highly efficiently in suppression of GBN (over 50 dB) within the broad-band frequency range (over 4 GHz). In addition, the proposed designs suppress radiated emission (or electromagnetic interference) caused by the GBN within the stopband. These extinctive behaviors of low radiation and broad-band suppression of the GBN is demonstrated numerically and experimentally. Good agreements are seen. The impact of the LPC-EBG power plane on the signal integrity for the signals referring to the power plane is investigated. Two possible solutions, differential signals and an embedded LPC-EBG power plane concept, are suggested and discussed to reduce the impact.

A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits

Abstract: A novel L-bridged electromagnetic bandgap (EBG) power/ground planes is proposed with super-wideband suppression of the ground bounce noise (GBN) from 600Mz to 4.6GHz. The L-shaped bridge design on the EBG power plane not only broadens the stopband bandwidth, but also can increase the mutual coupling between the adjacent EBG cells by significantly decreasing the gap between the cells. It is found the small gap design can prevent from the severe degradation of the signal quality for the high-speed signal referring to the perforated EBG power plane. The excellent GBN suppression performance with keeping reasonably good signal integrity for the proposed structure is validated both experimentally and numerically. Good agreement is seen.

Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB

Abstract: Influence of the partitioning and bridging of the power/ground planes on the radiation caused by the switching noise on the dc reference planes is investigated both theoretically and experimentally. Based on the three-dimensional finite-difference time-domain modeling, the electromagnetic interference (EMI) performance of the partitioned power/ground planes is studied. Radiated emission at the 3-m distance from the tested boards is measured in a fully anechoic chamber. The measured and the numerical results agree generally well. The radiation behavior of four kinds of partitioned configuration of the power/ground planes is studied. It is found that completely isolating the noise source by the etched slits, or moats, significantly reduces the radiation level at the frequencies near resonance. However, bridges connecting two sides of the moat not only significantly degrade the ability of the EMI protection of the moat, but also excite a new low-frequency resonant mode. The effect of the geometrical parameters, such as the moat size, moat location, bridge width, and bridge position, on the radiation behavior of the printed circuit board is considered. The radiation mechanism of the EMI behavior of the partitioned dc reference planes is discussed.

A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures

Abstract: A novel power/ground planes design for eliminating the ground bounce noise (GBN) in high-speed digital circuits is proposed by using low-period photonic bandgap (PBG) structure. Keeping solid for the ground plane and designing low-period PBG pattern on the power plane, the proposed structure omni-directionally behaves highly efficient suppression of GBN (over 50 dB) within broadband frequency range from 1 GHz to 4 GHz. Although the power plane has low-period perforation, the proposed structure still performs with relatively low radiation within the stopband compared with the solid power/ground planes. The low radiation and high suppression of the GBN for the proposed structure are checked both experimentally and numerically. Good consistency is seen.

Investigation of signal quality and radiated emission of microstrip line on imperfect ground plane: FDTD analysis and measurement

Abstract: Taking four kinds of imperfect ground planes as examples, the effect of the imperfect ground plane on the signal integrity (SI) and electromagnetic interference (EMI) for high-speed digital transmission line on the printed circuit boards (PCB) are investigated both by FDTD simulation and experimental measurement It is found that good signal quality does not guarantee good EMI performance and ill signal integrity does not imply severe radiated emission The dominant factor that affects the EMI performance of the signal trace on the reference plane is the path of return current All simulated S-parameter and EMI behavior of the signal traces are compared with the measurement results The agreement between them is good

Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits

Abstract: A power/ground planes design for efficiently eliminating the ground bounce noise (GBN) in high-speed digital circuits is proposed by using low-period coplanar electromagnetic bandgap (LPC-EBG) structure. Keeping solid for the ground plane and designing an LPC-EBG pattern on the power plane, the proposed structure omnidirectionally behaves highly efficiently in suppression of GBN (over 50 dB) within the broad-band frequency range (over 4 GHz). In addition, the proposed designs suppress radiated emission (or electromagnetic interference) caused by the GBN within the stopband. These extinctive behaviors of low radiation and broad-band suppression of the GBN is demonstrated numerically and experimentally. Good agreements are seen. The impact of the LPC-EBG power plane on the signal integrity for the signals referring to the power plane is investigated. Two possible solutions, differential signals and an embedded LPC-EBG power plane concept, are suggested and discussed to reduce the impact.

Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation

Abstract: Mitigating power distribution network (PDN) noise is one of the main efforts for power integrity (PI) design in high-speed or mixed-signal circuits. Possible solutions, which are based on decoupling or isolation concept, for suppressing PDN noise on package or printed circuit board (PCB) levels are reviewed in this paper. Keeping the PDN impedance very low in a wide frequency range, except at dc, by employing a shunt capacitors, which can be in-chip, package, or PCB levels, is the first priority way for PI design. The decoupling techniques including the planes structure, surface-mounted technology decoupling capacitors, and embedded capacitors will be discussed. The isolation approach that keeps part of the PDN at high impedance is another way to reduce the PDN noise propagation. Besides the typical isolation approaches such as the etched slots and filter, the new isolation concept using electromagnetic bandgap structures will also be discussed.

A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits

Abstract: A novel L-bridged electromagnetic bandgap (EBG) power/ground planes is proposed with super-wideband suppression of the ground bounce noise (GBN) from 600Mz to 4.6GHz. The L-shaped bridge design on the EBG power plane not only broadens the stopband bandwidth, but also can increase the mutual coupling between the adjacent EBG cells by significantly decreasing the gap between the cells. It is found the small gap design can prevent from the severe degradation of the signal quality for the high-speed signal referring to the perforated EBG power plane. The excellent GBN suppression performance with keeping reasonably good signal integrity for the proposed structure is validated both experimentally and numerically. Good agreement is seen.

Gap Waveguide PMC Packaging for Improved Isolation of Circuit Components in High-Frequency Microwave Modules

Abstract: In this paper, perfect magnetic conductor (PMC)-based packaging technique was used to improve the isolation performance among various microwave circuit components such as high-gain amplifier chains. In this approach, a periodic structure (such as metal pin rows) together with the ground plane of the substrate created a stopband for unwanted parallel plate or cavity modes as well as substrate modes, and thereby suppressed the problems of circuit resonances and related package phenomena. This paper describes two Ka-band amplifier chains that were tested with this new packaging technique. Firstly, a single amplifier chain was tested for maximum stable gain operation, and it was found that the stable gain of was achieved, whereas traditional metal wall package with RF absorber offered stable gain of 40 dB, thus showing significant isolation improvement. Secondly, two high-gain amplifier chains were placed side by side and their mutual isolation was tested. With the proposed gap waveguide packaging, a minimum isolation of 78 dB was achieved, whereas a complete metal shield provided a minimum isolation of only 64 dB over the band of interest.

Electromagnetic bandgap structure and printed circuit board

Abstract: An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.