Novel Development for Thermal Design of Electronic Equipment Using Pulsating Flow from Knowledge of Nature

In order to utilize a numerical simulation on a product development for electronic equipment, not only the simulation techniques themselves, but the application technologies of the simulation in the product design, were examined. The design process of electronic equipment was categorized into four stages, which were a concept, a function, a layout and a parameter design. Each design stage consists of a specifying that a human decide the specification for the next stage and a verification whether the specification satisfy the previous stage requirements. The specifying and the verification are conducted over and over again. Numerical simulation is corresponded to the verification and is used to accelerate this iteration instead of experiments. The examples of numerical simulation corresponding to these four verifications were shown in the present paper. There are few examples in last two type of simulation. The progress of the numerical technology for function and concept verification is expected. The product development process requires not only numerical simulation based on physics but also statistical approach.Copyright © 2009 by ASME

Categorized Application Technology of Numerical Simulation on Electronic Equipment Thermal Design

Numerical Investigation of Jet Impingement Cooling with Supercritical Pressure Carbon Dioxide in a Multi-Layer Cold Plate during High Heat Flux

Received: 5 January 2021 Accepted: 11 March 2021 In electronic equipment, thermal failure and thermal degradation are two increasingly prominent problems of the devices, with the deepening integration and growing power density. Currently, there are relatively few reports on the heat transfer mechanism, heat source analysis, and numerical simulation of electronic equipment containing power electronic devices (PEDs). Therefore, this paper carries out thermal design and evaluates the cooling performance of PED-containing electronic equipment. Firstly, the basic flow was given for the thermal design of PED-containing electronic equipment; the heat transfer mode of PEDs and the equipment were detailed, so was the principle of thermal design; the cooling principles were introduced for ventilation cooling, heat pipe cooling, and closed loop cooling. Then, numerical simulation was carried out on the solid and liquid state heat transfer of PEDs and the equipment under different cooling modes. Based on an engineering example, the cooling scheme was finalized through heat source analysis on the proposed electronic equipment. The experimental results rove the effectiveness of numerical simulation and electronic equipment cooling scheme. The results provide a reference for the cooling scheme design for other fields of thermal design.

/pdf/thermal-design-and-cooling-performance-evaluation-of-4ye13nb54j.pdf

Zhengde Wang

Papers

Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices