Z
Zhong Chen
Researcher at Nanyang Technological University
Publications - 1114
Citations - 37928
Zhong Chen is an academic researcher from Nanyang Technological University. The author has contributed to research in topics: Chemistry & Catalysis. The author has an hindex of 80, co-authored 1000 publications receiving 28171 citations. Previous affiliations of Zhong Chen include Institute of High Performance Computing Singapore & National Institute of Education.
Papers
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Journal ArticleDOI
Fabrication of heat-treated soybean protein isolate-EGCG complex nanoparticle as a functional carrier for curcumin
Juming Li,Zhong Chen +1 more
TL;DR: Wang et al. as mentioned in this paper used heat-treated soybean protein isolate-epigallocatechin-3-gallate (HSPI-E) as a carrier.
Journal ArticleDOI
Improved binding and stability in Si/CNT hybrid nanostructures via interfacial functionalization: a first-principles study
TL;DR: In this paper, the geometric structure, energy and electronic properties of Si/CNT hybrid nanostructures with potential application as Li-ion battery anodes were investigated using first-principles calculations.
Proceedings ArticleDOI
Spread spectrum compressed sensing MRI using chirp radio frequency pulses
TL;DR: In this article, an alternating direction method of multipliers (ADMM) algorithm is modified by exploiting the complex orthogonality of the quadratic phase encoding to accelerate the image reconstruction.
Journal ArticleDOI
Interplay of carriers and deep-level recombination centers of 275-nm light-emitting diodes — Analysis on the parasitic peaks over wide ranges of temperature and injection density
Tingzhu Wu,Yue Lin,Zhangbao Peng,Huashan Chen,Zhibin Shangguan,Liu Meng,Sung Wen Huang Chen,Chih Hao Lin,Hao-Chung Kuo,Zhong Chen +9 more
TL;DR: A thorough investigation on the interplay among carriers and various types of defects should be conducted on the basis of the measurement taken under a wide temperature range, as well as under a proper forward voltage to let the quasi-Fermi level shift across deep defect levels, the band-edge, and to over-band.
Journal ArticleDOI
The role of bonding duration in wire bond formation: a study of footprints of thermosonic gold wire on aluminium pad
TL;DR: In this paper, a gold wire (20μm diameter/99.99 per cent wt%) was bonded to aluminium metallization pads (1μm thick) on a silicon chip using a commercial ball/wedge automatic bonder.