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Zhong Chen

Researcher at Nanyang Technological University

Publications -  1114
Citations -  37928

Zhong Chen is an academic researcher from Nanyang Technological University. The author has contributed to research in topics: Chemistry & Catalysis. The author has an hindex of 80, co-authored 1000 publications receiving 28171 citations. Previous affiliations of Zhong Chen include Institute of High Performance Computing Singapore & National Institute of Education.

Papers
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Proceedings ArticleDOI

Low Temperature Copper-Copper Thermocompression Bonding

TL;DR: In this paper, the effect of temperature on the copper joint shear strength was investigated and a hypothesis on the bonding mechanism between copper surfaces was proposed to explain the anomalous bonding behavior with temperature.
Journal ArticleDOI

Reaction mechanisms of ethylenediaminetetraacetic acid and diethanolamine in the precursor solution for producing (K, Na)NbO3 thin films with outstanding piezoelectric properties

TL;DR: In this article, an understanding of the reaction mechanisms of EDTA and diethanolamine for producing solution-derived (K, Na)NbO3 (KNN) thin films with outstanding piezoelectric properties and low leakage current is developed.
Journal ArticleDOI

First-principles investigation of the electronic properties of the Bi2O4(101)/BiVO4(010) heterojunction towards more efficient solar water splitting

TL;DR: First-principles calculations based on density functional theory show that the formed Bi2O4/BiVO4 heterojunction can improve visible light utilization and promote transfer of photo-generated holes from BiVO4 to Bi2 O4.
Journal ArticleDOI

Optimization of blood oxygenation level-dependent sensitivity in magnetic resonance imaging using intermolecular double-quantum coherence.

TL;DR: To optimize timing parameters in an intermolecular double‐quantum coherence imaging pulse sequence for overall image signal‐to‐noise ratio (SNR) and blood oxygenation level‐dependent (BOLD) sensitivity for brain functional imaging.
Journal ArticleDOI

Effect of ultrasonic energy on nanoscale interfacial structure in copper wire bonding on aluminium pads

TL;DR: In this paper, the effect of ultrasonic vibration on nanoscale interfacial structure of thermosonic copper wire bonding on aluminium pads was investigated, and it was found that bonding strength was determined by the extent of fragmentation of a native aluminium oxide overlayer (5-10 nm thick) on aluminum pads, forming paths for formation of intermetallic compound CuAl2 in areas of direct contact of bonded metal surfaces.