Zhu Lianfeng

Bio: Zhu Lianfeng is an academic researcher. The author has contributed to research in topics: Grinding & Abrasive. The author has an hindex of 4, co-authored 12 publications receiving 43 citations.

Sapphire wafer grinding and polishing method

Abstract: The invention relates to the technical field of grinding and polishing of sapphire wafers, in particular to a sapphire wafer grinding and polishing method. The polishing of the sapphire wafers is finished by four stations of a rough grinding station, a medium grinding station, a finish grinding station and a polishing station, wherein the rough grinding station, the medium grinding station and the finish grinding station respectively adopt high-hardness micro powder with particle sizes of 26-43 microns, 3-9 microns and 0.2-3 microns as abrasives; de-ionized water, a dispersing agent and a suspending agent are added to prepare boron carbide hydrous sol as grinding liquid; in the previous grinding, small-particle-size grinding sands are used for grinding the sapphires, so that the sapphire wafers obtain more excellent machined surfaces, that is, the Ra value and the TTV are relatively lower, and the needed time of reaching the preset target Ra and TTV of the sapphires in the machining process is shortened; and as the method, provided by the invention, is used, the sapphire polishing process time can be controlled within 120-180 minutes, the pass percent of the wafers prepared in batches is higher than 90%, and the surface roughness is low to 0.5 nm.

Sapphire coarse grinding fluid

Abstract: The invention relates to the technical field of sapphire grinding and polishing, and in particular relates to sapphire coarse grinding fluid comprising the following components in percentage by weight: 0.3-1% of a polymerization inhibitor, 1-3% of a dispersant, 5-15% of a grinding material, 1-2% of a powder lubricant and the balance of deionized water, wherein the powder lubricant is graphite or hexagonal boron nitride, and the grinding material is a high-hardness powder material. In the sapphire coarse grinding fluid, the high-hardness material achieves an effect of cutting sapphire surfaces and the lubricant achieves effects of lubricating and buffering to reduce cut damages of the high-hardness material to the surfaces. By using the sapphire coarse grinding fluid to perform grinding, the surface primary grinding of sapphire crystal faces does not have scratches and is less in defect, and the crystal plate removal rate after 20 hours of circular trough grinding still can be kept at 8-10 microns per minute; and moreover, compared with the existing strong corrosive agent, the sapphire coarse grinding fluid cannot generate harms to equipment and operating staffs.

Effective sapphire fine grinding method and fine grinding solution

Abstract: The invention relates to the technical field of sapphire grinding and polishing, in particular to a fine grinding solution for sapphire grinding. The fine grinding solution comprises the following components in percentage by weight: 10-15% of superfine high-hardness micro powder, 0.1-1.5% of a dispersing agent, 1-5% of a powder lubricant and the balance of deionized water, wherein the powder lubricant is graphite or hexagonal boron nitride. Through the adoption of the dispersing agent, micro powder can form a stable suspension system, so that flowing and transmission of the micro powder are facilitated, and a sol system has excellent permeation and cleaning functions to take fines generated in the grinding process away in a fluidal manner; aiming at the problem of the short service life, the powder lubricant is added in the fine grinding solution, so that a grinding contact surface has a sliding buffering effect, the powder can roll under the high pressure to prevent the superfine high-hardness micro powder from being in contact with a sapphire crystal surface and damaging a grinding material, and the service life of the fine grinding solution is prolonged; the invention further provides an efficient sapphire fine grinding method.

Flexible polishing pad

Abstract: The invention relates to the technical fields of grinding and polishing, in particular to a flexible polishing pad for grinding and processing super-hard materials The flexible polishing pad mainly consists of a high temperature resisting flexible fiber pad, super-hard composite ceramic flakes and flexible resins The flexible polishing pad is made through the following steps of performing in-situ sintering of a layer of rigid super-hard composite ceramics on the high temperature resisting flexible fiber pad; then enabling the flexible resins to be penetrated in gaps and holes in the fiber pad and gaps and holes in the super-hard composite ceramic flakes, so that after the resins are solidified, the composite ceramics are fixed on the flexible fiber pad; and finally, removing high molecular materials covering the surfaces of the composite ceramics, so that the surfaces of the ceramics are exposed, and the flexible polishing pad is obtained According to the flexible polishing pad disclosed by the invention, the super-hard composite ceramic flakes obtained through in-situ sintering have a high grinding removing efficiency; in addition, the flakes are positioned on the flexible fiber pad and the flexible resins, so that when the flakes meet with strong grinding collision, the fiber pad and the resins have the buffering effect, the situation that the ceramic flakes are in hard contact with the surface of a processing workpiece is avoided, and the scratching probability is reduced

Elastic consolidated abrasive as well as preparation method and application thereof

Abstract: The invention belongs to the technical field of polishing materials, and provides an elastic consolidated abrasive as well as a preparation method and the application thereof. The elastic consolidatedabrasive comprises the following components in parts by weight: 8-10 parts of diamond, 5-50 parts of thermoplastic polyurethane rubber, 20-25 parts of talcum powder, 15-20 parts of mica powder and 5-10 parts of stearic acid. The hardness of the elastic consolidated abrasive provided by the invention reaches 35-45HD; the thermoplastic polyurethane rubber serves as the main material of the elasticconsolidated abrasive, so that the elastic consolidated abrasive can be in full contact with a hard and brittle material, the pressure of a stress surface can be stable and uniform, and the polishingeffect of a grinding-polishing process can be more uniform than that of a free arc-surface polishing process; and such a diamond abrasive is uniformly dispersed in the main body of the thermoplastic polyurethane rubber, so that a plurality of uniformly-distributed diamond bulges can be exposed to the surface of an elastic body, and both the polishing effect and the polishing efficiency during thegrinding-polishing process can be remarkably improved.

Double-surface polishing method for silicon carbide chip

Abstract: The invention relates to a double-surface polishing method for a silicon carbide chip. The double-surface polishing method comprises the steps that the silicon carbide chip is subjected to rough polishing, semi-finishing polishing and finishing polishing sequentially on a double-surface polishing machine; during rough polishing, water-soluble diamond polishing liquid is used, the diameter of diamond particles is 5-15 microns, the polishing pressure is 40-100 kg, and a polishing disc is a resin copper disc or a resin tin disc or a polishing pad of a polyurethane structure; during semi-finishing polishing, water-soluble diamond polishing liquid is used, the diameter of diamond particles is 0.25-3 microns, the polishing pressure is 60-120 kg, and a polishing disc is a resin copper disc or a resin tin disc or a polishing pad of a polyurethane structure; and during finishing polishing, alkali silicon dioxide polishing liquid is used, an oxidizing agent with a proper proportion is added, the PH value of the finishing polishing liquid is adjusted to be 9-13, the polishing pressure is 80-140 kg, and a polishing pad is of a fluff structure. By means of the double-surface polishing method, the processing time can be shortened by a half, the flatness of the silicon carbide chip is improved, the surface quality is consistent after polishing, and the silicon carbide chip has no defects of orange peel, scratching damage, matte and the like.

Grinding auxiliary and grinding liquid for coarse grinding of sapphire and preparation methods of grinding auxiliary and grinding liquid

Abstract: The invention discloses a grinding auxiliary and a grinding liquid for coarse grinding of sapphire and preparation methods of the grinding auxiliary and the grinding liquid. The grinding auxiliary comprises a component A and a component B in a mass ratio of the component A to the component B being 3:1-5:1, wherein the component A is prepared from ingredients in parts by weight as follows: 5-10 parts of small molecular alcohol, 10-15 parts of an organic dispersing agent and 1-2 parts of filler; the component B is prepared from ingredients in parts by weight as follows: 10-20 parts of a suspending agent, 5-10 parts of a defoaming agent, 10-30 parts of the small molecular alcohol and 10-15 parts of an antirust agent. An appropriate quantity of the component A and an appropriate quantity of the component B are taken proportionally and are stirred and mixed uniformly at the normal temperature, a mixture is diluted with deionized water to 10-20 times by weight, abrasive particles are further added, and the grinding liquid for the coarse grinding of the sapphire is prepared. The grinding liquid prepared according to the technical scheme is good in dispersing stability and cannot layer after long-term storage; the lubricating performance is good, and large scratches caused when the grinding liquid is applied to the coarse grinding of the sapphire are reduced; the filler is added to the grinding liquid, so that the temperature of the grinding process is reduced, the surface of a substrate material of the sapphire is not prone to cracking, and the fragment rate is reduced.

Diamond lapping paste and preparation method thereof

Abstract: The invention relates to diamond lapping paste and a preparation method thereof. The diamond lapping paste is composed of artificial diamond micro powder, vaseline, diesel, oleic acid, graphite, stearic acid and polytetrafluoroethylene. The diamond lapping paste disclosed by the invention has excellent lapping and polishing properties, is fine and smooth in paste body and has an excellent effect of polishing sapphire lens materials.

Preparation method for alumina polishing solution

Abstract: The invention discloses a preparation method for an alumina polishing solution The preparation method comprises the following steps: S1, adding KOH solid with a weight percentage of 02% into deionized water and carrying out stirring to dissolve the KOH solid; S2, dissolving 04% by weight of sodium polypropylene and 02% by weight of a dispersant in an alkaline solution of S2 and carrying out ultrasonic treatment for dispersion; and S3, adding 10% by weight of alumina powder into an aqueous solution of S2 and carrying out stirring with a stirring rod so as to obtain the alumina polishing solution The alumina polishing solution is fast in sapphire polishing rate, and polished sapphire has high surface quality

Composite wear-resisting abrasive material and application thereof

Abstract: The invention discloses a novel abrasive material layer prepared from a composite wear-resisting abrasive material by a special technology; a particular preparation method comprises the steps: respectively weighing raw materials of the abrasive material layer according to a certain proportion, mixing, carrying out mixing and ball milling, filling into a graphite mold, sintering and then cooling, wherein the mold is a regular tetrahedron graphite mold, and the size of the graphite mold can be formulated into a variety of specifications according to the needs. The product prepared by the method has simple manufacture process and wide adaptive field, and can be widely used in the related technical fields of grinding, cutting and polishing tools and the like.