Example of IEEE Transactions on Semiconductor Manufacturing format
Recent searches

Example of IEEE Transactions on Semiconductor Manufacturing format Example of IEEE Transactions on Semiconductor Manufacturing format Example of IEEE Transactions on Semiconductor Manufacturing format Example of IEEE Transactions on Semiconductor Manufacturing format Example of IEEE Transactions on Semiconductor Manufacturing format Example of IEEE Transactions on Semiconductor Manufacturing format Example of IEEE Transactions on Semiconductor Manufacturing format
Sample paper formatted on SciSpace - SciSpace
This content is only for preview purposes. The original open access content can be found here.
Look Inside
Example of IEEE Transactions on Semiconductor Manufacturing format Example of IEEE Transactions on Semiconductor Manufacturing format Example of IEEE Transactions on Semiconductor Manufacturing format Example of IEEE Transactions on Semiconductor Manufacturing format Example of IEEE Transactions on Semiconductor Manufacturing format Example of IEEE Transactions on Semiconductor Manufacturing format Example of IEEE Transactions on Semiconductor Manufacturing format
Sample paper formatted on SciSpace - SciSpace
This content is only for preview purposes. The original open access content can be found here.
open access Open Access ISSN: 8946507 e-ISSN: 15582345

IEEE Transactions on Semiconductor Manufacturing — Template for authors

Publisher: IEEE
Categories Rank Trend in last 3 yrs
Industrial and Manufacturing Engineering #83 of 336 up up by 7 ranks
Electrical and Electronic Engineering #203 of 693 up up by 61 ranks
Electronic, Optical and Magnetic Materials #75 of 246 up up by 29 ranks
Condensed Matter Physics #127 of 411 up up by 67 ranks
journal-quality-icon Journal quality:
High
calendar-icon Last 4 years overview: 293 Published Papers | 1277 Citations
indexed-in-icon Indexed in: Scopus
last-updated-icon Last updated: 30/06/2020
Insights & related journals
General info
Top papers
Popular templates
Get started guide
Why choose from SciSpace
FAQ

Journal Performance & Insights

  • Impact Factor
  • CiteRatio
  • SJR
  • SNIP

Impact factor determines the importance of a journal by taking a measure of frequency with which the average article in a journal has been cited in a particular year.

1.977

73% from 2018

Impact factor for IEEE Transactions on Semiconductor Manufacturing from 2016 - 2019
Year Value
2019 1.977
2018 1.14
2017 1.336
2016 1.117
graph view Graph view
table view Table view

insights Insights

  • Impact factor of this journal has increased by 73% in last year.
  • This journal’s impact factor is in the top 10 percentile category.

CiteRatio is a measure of average citations received per peer-reviewed paper published in the journal.

4.4

52% from 2019

CiteRatio for IEEE Transactions on Semiconductor Manufacturing from 2016 - 2020
Year Value
2020 4.4
2019 2.9
2018 2.6
2017 2.4
2016 2.7
graph view Graph view
table view Table view

insights Insights

  • CiteRatio of this journal has increased by 52% in last years.
  • This journal’s CiteRatio is in the top 10 percentile category.

SCImago Journal Rank (SJR) measures weighted citations received by the journal. Citation weighting depends on the categories and prestige of the citing journal.

0.732

11% from 2019

SJR for IEEE Transactions on Semiconductor Manufacturing from 2016 - 2020
Year Value
2020 0.732
2019 0.659
2018 0.44
2017 0.359
2016 0.429
graph view Graph view
table view Table view

insights Insights

  • SJR of this journal has increased by 11% in last years.
  • This journal’s SJR is in the top 10 percentile category.

Source Normalized Impact per Paper (SNIP) measures actual citations received relative to citations expected for the journal's category.

1.305

2% from 2019

SNIP for IEEE Transactions on Semiconductor Manufacturing from 2016 - 2020
Year Value
2020 1.305
2019 1.275
2018 0.77
2017 0.874
2016 1.004
graph view Graph view
table view Table view

insights Insights

  • SNIP of this journal has increased by 2% in last years.
  • This journal’s SNIP is in the top 10 percentile category.

Related Journals

open access Open Access ISSN: 21563381

IEEE

CiteRatio: 7.2 | SJR: 1.023 | SNIP: 1.249
open access Open Access ISSN: 15661199

Elsevier

CiteRatio: 6.5 | SJR: 0.888 | SNIP: 0.744
open access Open Access ISSN: 10627995 e-ISSN: 1099159X
recommended Recommended

Wiley

CiteRatio: 16.6 | SJR: 2.286 | SNIP: 2.274
open access Open Access ISSN: 10408436 e-ISSN: 15476561
recommended Recommended

Taylor and Francis

CiteRatio: 15.9 | SJR: 1.838 | SNIP: 2.599

IEEE Transactions on Semiconductor Manufacturing

Guideline source: View

All company, product and service names used in this website are for identification purposes only. All product names, trademarks and registered trademarks are property of their respective owners.

Use of these names, trademarks and brands does not imply endorsement or affiliation. Disclaimer Notice

IEEE

IEEE Transactions on Semiconductor Manufacturing

IEEE Transactions on Semiconductor Manufacturing addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manuf...... Read More

Engineering

i
Last updated on
29 Jun 2020
i
ISSN
0894-6507
i
Impact Factor
High - 1.38
i
Open Access
No
i
Sherpa RoMEO Archiving Policy
Green faq
i
Plagiarism Check
Available via Turnitin
i
Endnote Style
Download Available
i
Bibliography Name
IEEEtran
i
Citation Type
Numbered
[25]
i
Bibliography Example
C. W. J. Beenakker, “Specular andreev reflection in graphene,” Phys. Rev. Lett., vol. 97, no. 6, p.

Top papers written in this journal

Journal Article DOI: 10.1109/66.4384
Scheduling semiconductor wafer fabrication
Lawrence M. Wein1

Abstract:

The impact that scheduling can have on the performance of semi-conductor wafer fabrication facilities is assessed. The performance measure considered is the mean throughput time (sometimes called cycle time, turnaround time or manufacturing interval) for a lot of wafers. A variety of input control and sequencing rules are eva... The impact that scheduling can have on the performance of semi-conductor wafer fabrication facilities is assessed. The performance measure considered is the mean throughput time (sometimes called cycle time, turnaround time or manufacturing interval) for a lot of wafers. A variety of input control and sequencing rules are evaluated using a simulation model of a representative, but fictitious, semiconductor wafer fabrication. Certain of these scheduling rules are derived by restricting attention to the sub-set of stations that are heavily utilized, and by using a Brownian network model, which approximates a multi-class queuing network model with dynamic control capability. Three versions of the wafer fabrication model, which differ only by the number of servers present at particular stations, are studied. The three versions have one, two, and four stations, respectively, that are heavily utilized (near 90% utilization). The simulation results indicate that scheduling has a significant impact on average throughput time, with larger improvements coming from discretionary imput control than from lot sequencing. The effects that specific sequencing rules have are highly dependent on both the type of input control used and the number of bottleneck stations in the fabrication. > read more read less

Topics:

Wafer fabrication (60%)60% related to the paper, Round-robin scheduling (58%)58% related to the paper, Dynamic priority scheduling (57%)57% related to the paper, Fair-share scheduling (57%)57% related to the paper, Two-level scheduling (57%)57% related to the paper
636 Citations
Journal Article DOI: 10.1109/66.920723
Material removal mechanism in chemical mechanical polishing: theory and modeling
Jianfeng Luo1, David Dornfeld1

Abstract:

The abrasion mechanism in solid-solid contact mode of the chemical mechanical polishing (CMP) process is investigated in detail. Based on assumptions of plastic contact over wafer-abrasive and pad-abrasive interfaces, the normal distribution of abrasive size and an assumed periodic roughness of pad surface, a novel model is d... The abrasion mechanism in solid-solid contact mode of the chemical mechanical polishing (CMP) process is investigated in detail. Based on assumptions of plastic contact over wafer-abrasive and pad-abrasive interfaces, the normal distribution of abrasive size and an assumed periodic roughness of pad surface, a novel model is developed for material removal in CMP. The basic model is MRR=/spl rho//sub w/NVol/sub removed/, where /spl rho//sub w/ is the density of wafer N the number of active abrasives, and Vol/sub removed/ the volume of material removed by a single abrasive. The model proposed integrates process parameters including pressure and velocity and other important input parameters including the wafer hardness, pad hardness, pad roughness, abrasive size, and abrasive geometry into the same formulation to predict the material removal rate (MRR). An interface between the chemical effect and mechanical effect has been constructed through a fitting parameter H/sub w/ a "dynamical" hardness value of the wafer surface, in the model. It reflects the influences of chemicals on the mechanical material removal. The fluid effect in the current model is attributed to the number of active abrasives. It is found that the nonlinear down pressure dependence of material removal rate is related to a probability density function of the abrasive size and the elastic deformation of the pad. Compared with experimental results, the model accurately predicts MRR. With further verification of the model, a better understanding of the fundamental mechanism involved in material removal in the CMP process, particularly different roles played by the consumables and their interactions, can be obtained. read more read less

Topics:

Chemical-mechanical planarization (59%)59% related to the paper, Abrasive (53%)53% related to the paper, Surface finish (52%)52% related to the paper, Surface roughness (52%)52% related to the paper
501 Citations
Journal Article DOI: 10.1109/66.311341
Efficient scheduling policies to reduce mean and variance of cycle-time in semiconductor manufacturing plants
S.C.H. Lu1, D. Ramaswamy1, P.R. Kumar1

Abstract:

The problem of reducing the mean and variance of cycle time in semiconductor manufacturing plants is addressed. Such plants feature a characteristic reentrant process flow, where lots repeatedly return at different stages of their production to the same service stations for further processing, consequently creating much compe... The problem of reducing the mean and variance of cycle time in semiconductor manufacturing plants is addressed. Such plants feature a characteristic reentrant process flow, where lots repeatedly return at different stages of their production to the same service stations for further processing, consequently creating much competition for machines. We introduce a new class of scheduling policies, called Fluctuation Smoothing policies. Unanimously, our policies achieved the best mean cycle time and Standard Deviation of Cycle Time, in all the configurations of plant models and release policies tested. As an example, under the recommended Workload Regulation Release policy, for a heavily loaded Research and Development Fabrication Line model, our Fluctuation Smoothing policies achieved a reduction of 22.4% in the Mean Queueing Time, and a reduction of 52.0% in the Standard Deviation of Cycle Time, over the baseline FIFO policy. These conclusions are based on extensive simulations conducted on two models of semiconductor manufacturing plants. The first is a model of a Research and Development Fabrication Line. The second is an aggregate model intended to approximate a full scale production line. Statistical tests are used to corroborate our conclusions. > read more read less

Topics:

Scheduling (production processes) (54%)54% related to the paper, Standard deviation (52%)52% related to the paper
392 Citations
Journal Article DOI: 10.1109/TSM.2007.913186
VARIUS: A Model of Process Variation and Resulting Timing Errors for Microarchitects
Smruti R. Sarangi, Brian Greskamp1, Radu Teodorescu1, Jun Nakano1, Abhishek Tiwari1, Josep Torrellas1

Abstract:

Within-die parameter variation poses a major challenge to high-performance microprocessor design, negatively impacting a processor's frequency and leakage power. Addressing this problem, this paper proposes a microarchitecture-aware model for process variation-including both random and systematic effects. The model is specifi... Within-die parameter variation poses a major challenge to high-performance microprocessor design, negatively impacting a processor's frequency and leakage power. Addressing this problem, this paper proposes a microarchitecture-aware model for process variation-including both random and systematic effects. The model is specified using a small number of highly intuitive parameters. Using the variation model, this paper also proposes a framework to model timing errors caused by parameter variation. The model yields the failure rate of microarchitectural blocks as a function of clock frequency and the amount of variation. With the combination of the variation model and the error model, we have VARIUS, a comprehensive model that is capable of producing detailed statistics of timing errors as a function of different process parameters and operating conditions. We propose possible applications of VARIUS to microarchitectural research. read more read less

Topics:

Process variation (57%)57% related to the paper, Failure rate (51%)51% related to the paper
View PDF
372 Citations
Journal Article DOI: 10.1109/66.4371
Closed-loop job release control for VLSI circuit manufacturing
C.R. Glassey1, Mauricio G. C. Resende1

Abstract:

A closed-loop job release mechanism for job shops where the main source of randomness is due to machine failure and repair is introduced. The release policy adapts concepts of the reorder-point method of inventory control to the context of job-shop scheduling. The control mechanism, called starvation avoidance, is compared em... A closed-loop job release mechanism for job shops where the main source of randomness is due to machine failure and repair is introduced. The release policy adapts concepts of the reorder-point method of inventory control to the context of job-shop scheduling. The control mechanism, called starvation avoidance, is compared empirically with other input control mechanisms on several semiconductor wafer manufacturing job shops with favorable results. > read more read less

Topics:

Flow shop scheduling (53%)53% related to the paper, Production control (52%)52% related to the paper, Inventory control (51%)51% related to the paper
353 Citations
Author Pic

SciSpace is a very innovative solution to the formatting problem and existing providers, such as Mendeley or Word did not really evolve in recent years.

- Andreas Frutiger, Researcher, ETH Zurich, Institute for Biomedical Engineering

Get MS-Word and LaTeX output to any Journal within seconds
1
Choose a template
Select a template from a library of 40,000+ templates
2
Import a MS-Word file or start fresh
It takes only few seconds to import
3
View and edit your final output
SciSpace will automatically format your output to meet journal guidelines
4
Submit directly or Download
Submit to journal directly or Download in PDF, MS Word or LaTeX

(Before submission check for plagiarism via Turnitin)

clock Less than 3 minutes

What to expect from SciSpace?

Speed and accuracy over MS Word

''

With SciSpace, you do not need a word template for IEEE Transactions on Semiconductor Manufacturing.

It automatically formats your research paper to IEEE formatting guidelines and citation style.

You can download a submission ready research paper in pdf, LaTeX and docx formats.

Time comparison

Time taken to format a paper and Compliance with guidelines

Plagiarism Reports via Turnitin

SciSpace has partnered with Turnitin, the leading provider of Plagiarism Check software.

Using this service, researchers can compare submissions against more than 170 million scholarly articles, a database of 70+ billion current and archived web pages. How Turnitin Integration works?

Turnitin Stats
Publisher Logos

Freedom from formatting guidelines

One editor, 100K journal formats – world's largest collection of journal templates

With such a huge verified library, what you need is already there.

publisher-logos

Easy support from all your favorite tools

IEEE Transactions on Semiconductor Manufacturing format uses IEEEtran citation style.

Automatically format and order your citations and bibliography in a click.

SciSpace allows imports from all reference managers like Mendeley, Zotero, Endnote, Google Scholar etc.

Frequently asked questions

Absolutely not! With our tool, you can freely write without having to focus on LaTeX. You can write your entire paper as per the IEEE Transactions on Semiconductor Manufacturing guidelines and autoformat it.

Yes. The template is fully compliant as per the guidelines of this journal. Our experts at SciSpace ensure that. Also, if there's any update in the journal format guidelines, we take care of it and include that in our algorithm.

Sure. We support all the top citation styles like APA style, MLA style, Vancouver style, Harvard style, Chicago style, etc. For example, in case of this journal, when you write your paper and hit autoformat, it will automatically update your article as per the IEEE Transactions on Semiconductor Manufacturing citation style.

You can avail our Free Trial for 7 days. I'm sure you'll find our features very helpful. Plus, it's quite inexpensive.

Yup. You can choose the right template, copy-paste the contents from the word doc and click on auto-format. You'll have a publish-ready paper that you can download at the end.

A matter of seconds. Besides that, our intuitive editor saves a load of your time in writing and formating your manuscript.

One little Google search can get you the Word template for any journal. However, why do you need a Word template when you can write your entire manuscript on SciSpace, autoformat it as per IEEE Transactions on Semiconductor Manufacturing's guidelines and download the same in Word, PDF and LaTeX formats? Try us out!.

Absolutely! You can do it using our intuitive editor. It's very easy. If you need help, you can always contact our support team.

SciSpace is an online tool for now. We'll soon release a desktop version. You can also request (or upvote) any feature that you think might be helpful for you and the research community in the feature request section once you sign-up with us.

Sure. You can request any template and we'll have it up and running within a matter of 3 working days. You can find the request box in the Journal Gallery on the right sidebar under the heading, "Couldn't find the format you were looking for?".

After you have written and autoformatted your paper, you can download it in multiple formats, viz., PDF, Docx and LaTeX.

To be honest, the answer is NO. The impact factor is one of the many elements that determine the quality of a journal. Few of those factors the review board, rejection rates, frequency of inclusion in indexes, Eigenfactor, etc. You must assess all the factors and then take the final call.

SHERPA/RoMEO Database

We have extracted this data from Sherpa Romeo to help our researchers understand the access level of this journal. The following table indicates the level of access a journal has as per Sherpa Romeo Archiving Policy.

RoMEO Colour Archiving policy
Green Can archive pre-print and post-print or publisher's version/PDF
Blue Can archive post-print (ie final draft post-refereeing) or publisher's version/PDF
Yellow Can archive pre-print (ie pre-refereeing)
White Archiving not formally supported
FYI:
  1. Pre-prints as being the version of the paper before peer review and
  2. Post-prints as being the version of the paper after peer-review, with revisions having been made.

The 5 most common citation types in order of usage are:.

S. No. Citation Style Type
1. Author Year
2. Numbered
3. Numbered (Superscripted)
4. Author Year (Cited Pages)
5. Footnote

Our journal submission experts are skilled in submitting papers to various international journals.

After uploading your paper on SciSpace, you would see a button to request a journal submission service for IEEE Transactions on Semiconductor Manufacturing.

Each submission service is completed within 4 - 5 working days.

Yes. SciSpace provides this functionality.

After signing up, you would need to import your existing references from Word or .bib file.

SciSpace would allow download of your references in IEEE Transactions on Semiconductor Manufacturing Endnote style, according to ieee guidelines.

Fast and reliable,
built for complaince.

Instant formatting to 100% publisher guidelines on - SciSpace.

Available only on desktops 🖥

No word template required

Typset automatically formats your research paper to IEEE Transactions on Semiconductor Manufacturing formatting guidelines and citation style.

Verifed journal formats

One editor, 100K journal formats.
With the largest collection of verified journal formats, what you need is already there.

Trusted by academicians

I spent hours with MS word for reformatting. It was frustrating - plain and simple. With SciSpace, I can draft my manuscripts and once it is finished I can just submit. In case, I have to submit to another journal it is really just a button click instead of an afternoon of reformatting.

Andreas Frutiger
Researcher & Ex MS Word user
Use this template