Agilent Technologies

About: Agilent Technologies is a company organization based out in Santa Clara, California, United States. It is known for research contribution in the topics: Signal & Mass spectrometry. The organization has 7398 authors who have published 11518 publications receiving 262410 citations. The organization is also known as: Agilent Technologies, Inc..

High speed acquisition system that allows capture from a packet network and streams the data to a storage medium

Abstract: A packet data capture apparatus, method and a computer readable medium having instructions recorded thereon, stream data packets in real time. The apparatus includes: a buffer, to store a plurality of data packets until transmission; a macro-packet transmitter, to prepare macro-packets from the stored plurality of packets and operate in a UDP mode that includes a predetermined re-transmit and flow control protocol; and a processor, to stream the macro-packets to a computer/server or storage device in real time and to retransmit respective macro-packets of the stream of macro-packets via the re-transmit and flow control protocol in accordance with a request from the computer/server.

Removing delay fluctuation in network time synchronization

Abstract: Techniques for removing delay fluctuations from network time synchronization so that timing packets that experience an inordinate network delay to not cause unneeded adjustments to a local clock. Time synchronization according to the present techniques includes measuring a network delay associated with a timing packet and discarding the timing packet if the network delay exceeds an adjustable threshold. The adjustable threshold enables balancing the quality of delay measurements in terms of delay fluctuation against the number of delay measurements that are sufficient to maintain time synchronization.

Metabolomic Profiling Reveals a Role for Androgen in Activating Amino Acid Metabolism and Methylation in Prostate Cancer Cells

Abstract: Prostate cancer is the second leading cause of cancer related death in American men. Development and progression of clinically localized prostate cancer is highly dependent on androgen signaling. Metastatic tumors are initially responsive to anti-androgen therapy, however become resistant to this regimen upon progression. Genomic and proteomic studies have implicated a role for androgen in regulating metabolic processes in prostate cancer. However, there have been no metabolomic profiling studies conducted thus far that have examined androgen-regulated biochemical processes in prostate cancer. Here, we have used unbiased metabolomic profiling coupled with enrichment-based bioprocess mapping to obtain insights into the biochemical alterations mediated by androgen in prostate cancer cell lines. Our findings indicate that androgen exposure results in elevation of amino acid metabolism and alteration of methylation potential in prostate cancer cells. Further, metabolic phenotyping studies confirm higher flux through pathways associated with amino acid metabolism in prostate cancer cells treated with androgen. These findings provide insight into the potential biochemical processes regulated by androgen signaling in prostate cancer. Clinically, if validated, these pathways could be exploited to develop therapeutic strategies that supplement current androgen ablative treatments while the observed androgen-regulated metabolic signatures could be employed as biomarkers that presage the development of castrate-resistant prostate cancer.

Composite transversely plastic interconnect for microchip carrier

Abstract: A composite transversely plastic interconnect for a microcarrier produces a carrier-to-substrate bond having low electrical resistance and high mechanical strength, significant bond height to mediate TCE mismatch between dissimilar carrier and substrate materials, and sufficient gap between the carrier and the substrate to permit effective post solder cleaning of the interconnect. A contact array consisting of solder balls is placed directly onto either of a carrier or a substrate interconnect surface with a stencil positioned to the chosen interconnect surface. The solder balls may have a selected melting temperature. Additionally, the solder balls may have a metallic coating, such as nickel or copper, or molten solder. The carrier and substrate are joined by mating an interconnect surface of each and applying heat. Solder paste may be applied to one of the interconnect surfaces to add additional height to the joint and compensate for lack of coplanarity between the carrier and the substrate.