Agilent Technologies

About: Agilent Technologies is a company organization based out in Santa Clara, California, United States. It is known for research contribution in the topics: Signal & Mass spectrometry. The organization has 7398 authors who have published 11518 publications receiving 262410 citations. The organization is also known as: Agilent Technologies, Inc..

Dual-mode RF communication device

Abstract: A novel RF to IF converter operates in two modes allowing both wide bandwidth signals and narrow bandwidth signals to be processed using the same wide bandwidth bandpass filter as well as a dual-mode image-reject mixer As a mobile receiver, both wide bandwidth WCDMA or IMT-2000 signals and narrow bandwidth GSM signals pass through the same wide bandwidth channel select filter In the GSM mode, signals lying to one side of the frequency range of the narrow GSM signal are attenuated by the wide bandwidth channel select filter Then signals lying to the other side of the GSM signal are attenuated by an image-reject mixer The image-reject mixer also downconverts the GSM signal In the WCDMA or IMT-2000 mode, the wide bandwidth channel select filter attenuates signals outside of the WCDMA or IMT-2000 channel bandwidth, and the image-reject mixer downconverts the wide bandwidth signal without rejecting signals

Integrated or intrapackage capability for testing electrical continuity between an integrated circuit and other circuitry

Abstract: An electromagnetic probe is integrated within an integrated circuit or mounted within an IC package to provide a capability for testing continuity between the integrated circuit and a substrate to which the integrated circuit is mounted. In a first embodiment, capacitive test probes are integrated within the integrated circuit, underneath bonding pads. In a second embodiment, Hall-effect devices are integrated within the integrated circuit underneath bonding pads. In a third embodiment, an inductive loop is integrated within the integrated circuit underneath bonding pads. In a fourth embodiment, an IC package assembly includes an internal capacitive test probe for electrical continuity testing. An internal shield may also be used as a capacitive test probe. In a fifth embodiment, an IC package assembly includes an inductive loop within the package for electrical continuity testing. The integrated or intrapackage test probes provide electromagnetic coupling to bonding pads or to a lead frame and to bonding wires (if present), to detect whether there is electrical continuity between an integrated circuit bonding pad or lead frame and conductors on an external substrate. The integrated or intrapackage test probes enable continuity testing for direct-bonding with no package, or for a package assembly even if the package assembly includes grounded shielding or a grounded heat sink.

Communications framework for supporting multiple simultaneous communications protocols in a distributed object environment

Abstract: A communication framework supporting multiple communications protocols. The communications framework having a remote procedure call class providing an interface for an apply method, the apply method referencing a remote object, an operation to be performed, and an argument list. The communications framework also having at least one remote procedure call transport deriving from the remote procedure call class, each remote procedure call transport providing an implementation for the apply method whose interface is provided by the remote procedure call class. Other systems and methods are disclosed.

Packet-based input test data compression techniques

Abstract: This paper presents a test input data compression technique, which can be used to reduce input test data volume, test time, and the number of required tester channels. The technique is based on grouping data packets and applying various binary encoding techniques, such as Huffman codes and Golomb-Rice codes. Experiments on actual industrial designs and benchmark circuits show an input vector data reduction ranging from 17/spl times/ to 70/spl times/.