Institution
Agilent Technologies
Company•Santa Clara, California, United States•
About: Agilent Technologies is a company organization based out in Santa Clara, California, United States. It is known for research contribution in the topics: Signal & Mass spectrometry. The organization has 7398 authors who have published 11518 publications receiving 262410 citations. The organization is also known as: Agilent Technologies, Inc..
Papers published on a yearly basis
Papers
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TL;DR: The data indicate that the outer vestibule imposes a barrier on the entry of MFZ2-12 into the SERT substrate binding site, providing a useful framework for a further exploration of antidepressant binding.
68 citations
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07 Oct 1994TL;DR: A flip-chip IC package as mentioned in this paper provides a thermallyconductive lid attached to a backside of the chip by a die attach layer (18) of a predetermined thickness range, with a depth (44) less than a sum (42) of the thickness of a chip, the interconnects, and a minimum final thickness (40) required by a predetermined margin.
Abstract: A flip-chip IC package (10) provides a thermally-conductive lid (20) attached to a backside of the chip (12) by a die attach layer (18) of a predetermined thickness range A rim (22), preferably KOVAR iron-nickel alloy, is formed on the lid (20) with a depth (44) less than a sum (42) of a thickness of the chip, the interconnects (16), and a minimum final thickness (40) of the die attach layer (18) by a predetermined margin (46) An initial thickness of thermally-filled epoxy is applied to the backside of the chip and a layer of lid attach epoxy (24) is applied to the rim of the lid in a thickness sufficient to span the predetermined margin The lid is floated on the die attach layer (18) with the rim of the lid surrounding the chip and floating on the lid attach material The lid is clamped against the chip with a force sufficient to compress the die attach material to a predetermined thickness in a range less than the initial thickness and not less than the minimum final thickness (40) An oxide layer, such as an iron or iron-alloy oxide layer, is formed on the bottom surface of the rim A spacer is placed on the backside of the chip within the die attach material (18), to define the minimum final thickness (40) of the die attach layer A beveled or stepped vent hole is formed in the lid and plugged and sealed
68 citations
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TL;DR: This data indicates that modulation of PD-L1 through “cell reprograming” or “ ‘spiking’ the immune response to anti-PD-1 therapy may occur through a number of mechanisms, including “self-consistency” and “ LTD”.
Abstract: e14589Background: Developing clinically relevant and highly reproducible scoring methods for PD-L1 to identify patients who will respond effectively to anti-PD-1 therapy is key in the development o...
68 citations
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14 Apr 2005TL;DR: In this paper, a light source utilizes a light generator that generates a light signal of a wavelength at an intensity that is set by a control signal, which is controlled by a servo that monitors the light output of the light generator and compares the monitored value with a target value.
Abstract: A light source and method for controlling the same. The light source utilizes a light generator that generates a light signal of a wavelength at an intensity that is set by a control signal. The control signal is controlled by a servo that monitors the light output of the light generator and compares the monitored value with a target value. When the target value is changed, the control signal is initially replaced by a predicted control signal based on the new target value rather than the error signal generated in the servo. This provides time for the servo to adjust to the new target value. In one embodiment, the control signal includes a periodic signal that switches between a value that causes the light generator to generate light of the wavelength and a second value at which the light generator does not generate light of the wavelength.
68 citations
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20 Sep 2002TL;DR: In this article, a method and system for molding light emitting diode (LED) lamps is presented, where a mold frame is provided around each LED chip in an array.
Abstract: The present invention provides a method and system for molding light emitting diode (LED) lamps A mold frame is provided around each LED chip in an array A first mold insert is placed in the mold frame and light converting material comprising a carrier and light converting particles is injected into the first mold insert to form a light converting molding around each LED chip The first mold insert is removed A second mold insert is placed in the mold frame and lens material is injected into the first mold insert to form a lens molding around the light converting molding for each LED chip
68 citations
Authors
Showing all 7402 results
Name | H-index | Papers | Citations |
---|---|---|---|
Hongjie Dai | 197 | 570 | 182579 |
Zhuang Liu | 149 | 535 | 87662 |
Jie Liu | 131 | 1531 | 68891 |
Thomas Quertermous | 103 | 405 | 52437 |
John E. Bowers | 102 | 1767 | 49290 |
Roy G. Gordon | 89 | 449 | 31058 |
Masaru Tomita | 76 | 677 | 40415 |
Stuart Lindsay | 74 | 347 | 22224 |
Ron Shamir | 74 | 319 | 23670 |
W. Richard McCombie | 71 | 144 | 64155 |
Tomoyoshi Soga | 71 | 392 | 21209 |
Michael R. Krames | 65 | 321 | 18448 |
Shabaz Mohammed | 64 | 188 | 17254 |
Geert Leus | 62 | 609 | 19492 |
Giuseppe Gigli | 61 | 541 | 15159 |