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Institution

Agilent Technologies

CompanySanta Clara, California, United States
About: Agilent Technologies is a company organization based out in Santa Clara, California, United States. It is known for research contribution in the topics: Signal & Mass spectrometry. The organization has 7398 authors who have published 11518 publications receiving 262410 citations. The organization is also known as: Agilent Technologies, Inc..


Papers
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Patent
30 Mar 2001
TL;DR: In this article, a mobile CDMA station incorporating the global positioning system (GPS) incorporates the GPS, and two modes of operation are possible: one, during GPS operation, there is no transmission or reception of CDMA services; and two, simultaneous CDMA transmissions and reception of GPS are provided.
Abstract: This novel mobile CDMA station incorporates the global positioning system (GPS). Two modes of operation are possible. One, during GPS operation, there is no transmission or reception of CDMA services. Two, simultaneous CDMA transmissions and reception of GPS are provided. When the mobile receiver is in the CDMA mode, a signal path selector selects the CDMA RF section and the GPS RF section is powered down. During GPS operation, the GPS RF section is selected and the CDMA section is powered down. When CDMA operation is compared with GPS, the average current draw can be less, as the system swaps between the RF sections. The GPS RF section may accept an antenna input from a multi-band antenna network or a separate GPS antenna. The GPS signal is propagated through the existing CDMA channel select filter, having a 1.23 MHz bandwidth and is processed in a base-band signal processor.

61 citations

Journal ArticleDOI
TL;DR: In this paper, the thermal-mechanical behavior of the lead-free solder bumped wafer level chip scale package (WLCSP) on microvia buildup printed circuit board (PCB) assemblies subjected to thermal cycling conditions are presented.
Abstract: In this study, time-temperature-dependent nonlinear analyses of lead-free solder bumped wafer level chip scale package (WLCSP) on microvia buildup printed circuit board (PCB) assemblies subjected to thermal cycling conditions are presented. The lead-free solder considered is 96.5Sn-3.5Ag. The 62Sn-2Ag-36Pb solder is also considered to establish a baseline. These two solder alloys are assumed to obey the Garofalo-Arrhenius steady-state creep constitutive law. The shear stress and shear creep strain hysteresis loops, shear stress history, shear creep strain history, and creep strain density range at the corner solder joint are presented for a better understanding of the thermal-mechanical behavior of the lead-free solder bumped WLCSP on microvia buildup PCB assemblies.

61 citations

Patent
14 Nov 2002
TL;DR: In this article, a method and apparatus for calibrating a measurement path of 2N measurement ports comprises presenting a high reflect calibration standard at each measurement port and measuring a reflection characteristic for each measurement ports, presenting a line calibration standard and a through calibration standard between each one of N direct pairs of the measurement ports and measuring forward and reverse reflection and transmission responses and calculating a load match error coefficient for every measurement port.
Abstract: A method and apparatus for calibrating a measurement path of 2N measurement ports comprises presenting a high reflect calibration standard at each measurement port and measuring a reflection characteristic for each measurement port, presenting a line calibration standard and a through calibration standard between each one of N direct pairs of the measurement ports and measuring forward and reverse reflection and transmission responses and calculating a load match error coefficient for each measurement port, and presenting only the through calibration standard between indirect pairs of measurement ports and calculating the forward and reverse transmission tracking for each indirect pairs of measurement ports.

61 citations

Patent
25 Jan 2007
TL;DR: In this paper, the authors present a method for optimization of demands in a packet switched communication network, especially, though not exclusively, for the optimization of requests in a Multi Protocol Label Switching (MPLS) packet switched communications network.
Abstract: The present invention relates to a method for optimization of demands in a packet switched communication network, especially, though not exclusively, for the optimization of demands in a Multi Protocol Label Switching (MPLS) packet switched communication network. The present invention provides a method to enable network nodes, such as routers to be clustered into components, with the components organised in a hierarchical fashion, and with the network “core” at the root of this hierarchy. Demands that originate or terminate at components outside the core, but that traverse the core, are temporarily replaced by demands that originate and terminate within the core component. Having optimized the resulting set of demands it is then shown how to use the solution to satisfy the original demands. Multi-access networks cause some complications, and these are taken into account. Also, further demand replacement methods have been developed that take into account complex access situations, In particular, as mentioned, the case has been considered, where there is an existing partitioning of the routers, e.g. into core and access routers, which needs to be respected.

61 citations

Patent
30 Jul 2001
TL;DR: In this paper, the interpolation along an axis is performed by finding the intersection of two straight line segments that are identified by the shape of the cross section of the Correlation Surface along the axis of interest.
Abstract: Interpolation along an axis is performed on a Correlation Surface Array that was created from counting the instances of difference (XOR) between corresponding pixels of single bit resolution images having trial displacements. The interpolation is performed by finding the intersection of two straight line segments that are identified by the shape of the cross section of the Correlation Surface along the axis of interest. In the case of nine trial shifts there are three values in such a cross section, and they may seen as representing three points whose abscissas are the pixel shift amounts minus one, no shift, and plus one, and whose ordinates are the corresponding correlation values. In situations where navigation (and interpolation) is possible, these three points will have certain properties. The ususal case is that two of the points determine one line having a slope m, and the other point determines the other line (assumed to have slope −m). The three points may also lie along the same line, although this represents an exceptional case that may be handled differently. The three points might also describe other conditions that are associated with Correlation Surfaces that are not suitable for navigation, and these are ignored. In the usual case the point of intersection for the two lines is found and its abscissa is the interpolated value for motion along the axis of interest.

61 citations


Authors

Showing all 7402 results

NameH-indexPapersCitations
Hongjie Dai197570182579
Zhuang Liu14953587662
Jie Liu131153168891
Thomas Quertermous10340552437
John E. Bowers102176749290
Roy G. Gordon8944931058
Masaru Tomita7667740415
Stuart Lindsay7434722224
Ron Shamir7431923670
W. Richard McCombie7114464155
Tomoyoshi Soga7139221209
Michael R. Krames6532118448
Shabaz Mohammed6418817254
Geert Leus6260919492
Giuseppe Gigli6154115159
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Performance
Metrics
No. of papers from the Institution in previous years
YearPapers
20231
20228
2021142
2020157
2019168
2018164