Cabot Corporation

About: Cabot Corporation is a company organization based out in Boston, Massachusetts, United States. It is known for research contribution in the topics: Carbon black & Carbon. The organization has 1279 authors who have published 1399 publications receiving 36736 citations.

Hydrothermal process for making barium titanate powders

Abstract: A hydrothermal process for making barium titanate powders. The process utilizes a thawed hydrated titanium oxide gel as a titanium source for the hydrothermal reaction. The process includes mixing the thawed hydrated titanium oxide gel and a barium source in a reaction chamber to form a hydrothermal reaction mixture. The temperature of the hydrothermal reaction mixture in the reaction chamber is increased to a reaction temperature to form a barium titanate particle suspension. The particle suspension is then cooled to room temperature. The resulting barium titanate particles, preferably, have a submicron particle size.

Production of carbon black

Abstract: This disclosure relates to an improved furnace process for producing carbon blacks by the incomplete combustion of hydrocarbonaceous feedstock wherein the resultant blacks either have higher surface areas than the carbon blacks normally prepared from the feedstocks or are produced more economically. The blacks produced by the process are suitable for use in all of the typical applications such as rubber plastics, inks and the like.

Method of producing secure images using inks comprising modified pigment particles

Abstract: The present invention describes a method of producing an image which is visually distinct from its reproductions. This method comprises the steps of formulating an ink composition comprising a liquid vehicle and at least one modified pigment having attached at least one organic group and applying this ink composition to a substrate. Methods of determining the authenticity of an image and of verifying the date of creation of an image is also described.

The Effect of Wafer Shape on Slurry Film Thickness and Friction Coefficients in Chemical Mechanical Planarization

Abstract: The fluid film thickness and drag during chemical-mechanical polishing are largely dependent on the shape of the wafer polished. In this study we use dual emission laser induced fluorescence to measure the film thickness and a strain gage, mounted on the polishing table, to measure the friction force between the wafer and the pad. All measurements are taken during real polishing processes. The trends indicate that with a convex wafer in contact with the polishing pad, the slurry layer increases with increasing platen speed and decreases with increasing downforce. The drag force decreases with increasing platen speed and increases with increasing downforce. These similarities are observed for both in-situ and ex-situ conditioning. However, these trends are significantly different for the case of a concave wafer in contact with the polishing pad. During ex-situ conditioning the trends are similar as with a convex wafer. However, in-situ conditioning decreases the slurry film layer with increasing platen speed, and increases it with increasing downforce in the case of the concave wafer. The drag force increases with increasing platen speed as well as increasing downforce. Since we are continually polishing, the wafer shape does change over the course of each experiment causing a larger error in repeatability than the measurement error itself. Different wafers are used throughout the experiment and the results are consistent with the variance of the wafer shape. Local pressure measurements on the rotating wafer help explain the variances in fluid film thickness and friction during polishing.

Elastomer composites, elastomer blends and methods

Abstract: Elastomer composites and elastomer blends comprising particulate fillers having selected and surface area values are disclosed as well as elastomer composites and elastomer blends having improved properties. Methods of making and using elastomer composites and elastomer blends are also disclosed.