Eaton Corporation

About: Eaton Corporation is a company organization based out in Taipei, Taiwan. It is known for research contribution in the topics: Circuit breaker & Clutch. The organization has 9516 authors who have published 12004 publications receiving 161134 citations. The organization is also known as: Eaton Corporation Plc.

Opportunities and Challenges of Wireless Sensor Networks in Smart Grid

Abstract: The collaborative and low-cost nature of wireless sensor networks (WSNs) brings significant advantages over traditional communication technologies used in today's electric power systems. Recently, WSNs have been widely recognized as a promising technology that can enhance various aspects of today's electric power systems, including generation, delivery, and utilization, making them a vital component of the next-generation electric power system, the smart grid. However, harsh and complex electric-power-system environments pose great challenges in the reliability of WSN communications in smart-grid applications. This paper starts with an overview of the application of WSNs for electric power systems along with their opportunities and challenges and opens up future work in many unexploited research areas in diverse smart-grid applications. Then, it presents a comprehensive experimental study on the statistical characterization of the wireless channel in different electric-power-system environments, including a 500-kV substation, an industrial power control room, and an underground network transformer vault. Field tests have been performed on IEEE 802.15.4-compliant wireless sensor nodes in real-world power delivery and distribution systems to measure background noise, channel characteristics, and attenuation in the 2.4-GHz frequency band. Overall, the empirical measurements and experimental results provide valuable insights about IEEE 802.15.4-compliant sensor network platforms and guide design decisions and tradeoffs for WSN-based smart-grid applications.

Oscillations in NF-κB Signaling Control the Dynamics of Gene Expression

Abstract: Signaling by the transcription factor nuclear factor kappa B (NF-kappaB) involves its release from inhibitor kappa B (IkappaB) in the cytosol, followed by translocation into the nucleus. NF-kappaB regulation of IkappaBalpha transcription represents a delayed negative feedback loop that drives oscillations in NF-kappaB translocation. Single-cell time-lapse imaging and computational modeling of NF-kappaB (RelA) localization showed asynchronous oscillations following cell stimulation that decreased in frequency with increased IkappaBalpha transcription. Transcription of target genes depended on oscillation persistence, involving cycles of RelA phosphorylation and dephosphorylation. The functional consequences of NF-kappaB signaling may thus depend on number, period, and amplitude of oscillations.

Using the Theory of Planned Behaviour to investigate the determinants of recycling behaviour: a case study from Brixworth, UK

Abstract: New mandatory household recycling targets present a serious challenge to UK Local Authorities (LAs). The key to achieving these targets is participation by households in waste management and recycling schemes. However, for these schemes to be successful, they must be based on a thorough understanding of householder attitudes to recycling, and their perceptions of the barriers to recycling. The Theory of Planned Behaviour (TPB), which provides a theoretical framework for systematically identifying the determinants of recycling behaviour, was used as the basis for a study of 191 participants in a local kerbside recycling scheme. The findings suggest that pro-recycling attitudes are the major contributor to recycling behaviour, and that these attitudes are influenced firstly, by having the appropriate opportunities, facilities and knowledge to recycle, and secondly by not being deterred by the issues of physically recycling (for example time, space and inconvenience). Previous recycling experience, and a concern for the community and the consequences of recycling are also significant predictors of recycling behaviour. The implications of the findings for the development and implementation of recycling schemes and for marketing and communication campaigns which advocate the use of these schemes are discussed.

A Literature Review of IGBT Fault Diagnostic and Protection Methods for Power Inverters

Abstract: This paper presents a survey on existing methods for fault diagnosis and protection of insulated gate bipolar transistors with special focus on those used in three-phase power inverters. Twenty-one methods for open-circuit faults and ten methods for short-circuit faults are evaluated and summarized, based on their performance and implementation efforts. The gate-misfiring faults and their diagnostic methods are also briefly discussed. Finally, the promising methods are recommended for future work.

The changing automotive environment: high-temperature electronics

Abstract: The underhood automotive environment is harsh and current trends in the automotive electronics industry will be pushing the temperature envelope for electronic components. The desire to place engine control units on the engine and transmission control units either on or in the transmission will push the ambient temperature above 125/spl deg/C. However, extreme cost pressures, increasing reliability demands (10 year/241 350 km) and the cost of field failures (recalls, liability, customer loyalty) will make the shift to higher temperatures occur incrementally. The coolest spots on engine and in the transmission will be used. These large bodies do provide considerable heat sinking to reduce temperature rise due to power dissipation in the control unit. The majority of near term applications will be at 150/spl deg/C or less and these will be worst case temperatures, not nominal. The transition to X-by-wire technology, replacing mechanical and hydraulic systems with electromechanical systems will require more power electronics. Integration of power transistors and smart power devices into the electromechanical actuator will require power devices to operate at 175/spl deg/C to 200/spl deg/C. Hybrid electric vehicles and fuel cell vehicles will also drive the demand for higher temperature power electronics. In the case of hybrid electric and fuel cell vehicles, the high temperature will be due to power dissipation. The alternates to high-temperature devices are thermal management systems which add weight and cost. Finally, the number of sensors in vehicles is increasing as more electrically controlled systems are added. Many of these sensors must work in high-temperature environments. The harshest applications are exhaust gas sensors and cylinder pressure or combustion sensors. High-temperature electronics use in automotive systems will continue to grow, but it will be gradual as cost and reliability issues are addressed. This work examines the motivation for higher temperature operation, the packaging limitations even at 125/spl deg/C with newer package styles and concludes with a review of challenges at both the semiconductor device and packaging level as temperatures push beyond 125/spl deg/C.