Institution
Fuji Xerox
Company•Tokyo, Japan•
About: Fuji Xerox is a company organization based out in Tokyo, Japan. It is known for research contribution in the topics: Image processing & Information processing. The organization has 9252 authors who have published 14261 publications receiving 124551 citations. The organization is also known as: FUJI XEROX & Fuji Xerox Co., Ltd..
Topics: Image processing, Information processing, Color image, Layer (electronics), Controller (computing)
Papers published on a yearly basis
Papers
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17 Oct 2001TL;DR: In this paper, a method of forming a crystalline semiconductor thin film on a base material which can be prepared at a low temperature by simple step and device, the method including a processing step of applying UV-rays to an amorphous semiconductor bit-film provided on the base material while keeping a temperature at not less than 25°C. and not more than 300°C in a vacuum or a reducing gas atmosphere.
Abstract: A method of forming a crystalline semiconductor thin film on a base material which can be prepared at a low temperature by simple step and device, the method including a processing step of applying UV-rays to an amorphous semiconductor thin film provided on a base material while keeping a temperature at not less than 25° C. and not more than 300° C. in a vacuum or a reducing gas atmosphere, as well as a substrate having the semiconductor thin film provided on the base material, a substrate for forming a color filter and a color filter using the substrate.
1,044 citations
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20 Nov 2001TL;DR: In this paper, a camera array captures plural component images which are combined into a single scene in one embodiment, each camera of the array is a fixed digital camera The images from each camera are warped to a common coordinate system and the disparity between overlapping images is reduced using disparity estimation techniques.
Abstract: A camera array captures plural component images which are combined into a single scene In one embodiment, each camera of the array is a fixed digital camera The images from each camera are warped to a common coordinate system and the disparity between overlapping images is reduced using disparity estimation techniques
415 citations
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15 Mar 2002TL;DR: In this paper, the authors proposed an organic electroluminescent device with one or more organic compound layers held between a pair of positive and negative electrodes, at least one of which is transparent or translucent.
Abstract: PROBLEM TO BE SOLVED: To provide an organic EL device, which has a high intensity of emission, exhibits stable performance even in repeated use and is easily fabricated, by using a new electron-transfer material having excellent electron-transfer property. SOLUTION: For the organic electroluminescent device with one or more organic compound layers held between a pair of positive and negative electrodes, at least one of which is transparent or translucent, at least one layer of the organic compound layers contains one or more of polymeric compounds obtained by using at least one of monomers represented by formula (1), [wherein, R1 represents a hydrogen atom or methyl group, and A represents any group selected from groups represented by formulae (2)-(6), (wherein, X represents an oxygen atom or the like, Y represents an oxygen atom or -COO(CH2)nO-, R4 and R5 each represents an alkyl group or the like, W represents -(CH2)nO- or the like, and Z represents an alkyl group or the like)].
392 citations
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TL;DR: In this work, several vertically stacked chip layers in 3D LSI chips or 3D multichip modules (MCMs) are fabricated using a new three-dimensional integration technology to overcome future wiring connectivity crises.
Abstract: The development of system-on-silicon large-scale integration (LSI) devices has significantly influenced the demand for higher wiring connectivity within LSI chips. Currently, increasing the number of metal layers in a multilevel metallization as the device size decreases increases wiring connectivity. In the future, however, designers will have difficulty catching up with the rising demand for higher wiring connectivity by merely increasing the number of metal layers. We propose a new three-dimensional integration technology to overcome future wiring connectivity crises. In our solution, several vertically stacked chip layers in 3D LSI chips or 3D multichip modules (MCMs) are fabricated using our new integration technology. More than 10/sup 5/ interconnections per chip form in a vertical direction in these 3D LSI chips or 3D MCMs. Consequently, we can dramatically increase wiring connectivity while reducing the number of long interconnections.
328 citations
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21 Oct 2005TL;DR: This paper focuses on body, gesture, gaze, and affective interaction (facial expression recognition, and emotion in audio) in multimodal human computer interaction from a computer vision perspective.
Abstract: In this paper we review the major approaches to multimodal human computer interaction from a computer vision perspective. In particular, we focus on body, gesture, gaze, and affective interaction (facial expression recognition, and emotion in audio). We discuss user and task modeling, and multimodal fusion, highlighting challenges, open issues, and emerging applications for Multimodal Human Computer Interaction (MMHCI) research.
298 citations
Authors
Showing all 9252 results
Name | H-index | Papers | Citations |
---|---|---|---|
Abhinav Gupta | 93 | 249 | 39876 |
Timothy Bickmore | 56 | 262 | 12519 |
Elizabeth F. Churchill | 53 | 331 | 9490 |
Lynn D. Wilcox | 51 | 206 | 8652 |
Catherine C. Marshall | 50 | 150 | 7344 |
Morgan N. Price | 49 | 142 | 23357 |
Patrick Chiu | 47 | 216 | 7135 |
Andreas Girgensohn | 46 | 174 | 7464 |
Volker Roth | 44 | 209 | 7195 |
Ming Yang | 43 | 93 | 18928 |
Frank M. Shipman | 43 | 232 | 6033 |
Gene Golovchinsky | 41 | 167 | 5352 |
Francine Chen | 40 | 147 | 6875 |
David W. McDonald | 39 | 158 | 8394 |
Khai N. Truong | 39 | 121 | 4473 |