Heritage Institute of Technology

About: Heritage Institute of Technology is a based out in . It is known for research contribution in the topics: Support vector machine & Transconductance. The organization has 581 authors who have published 1045 publications receiving 8345 citations.

Possibility–necessity–credibility measures on generalized intuitionistic fuzzy number and their applications to multi-product manufacturing system

Abstract: As a special intuitionistic fuzzy set on a real number set, intuitionistic fuzzy numbers (IFNs) have the best capability to model ill-known quantities. The purpose of this paper is to investigate generalized intuitionistic fuzzy numbers (GIFNs). The weighted possibility, necessity and credibility measures of generalized trapezoidal intuitionistic fuzzy numbers (GTIFN) are introduced, and expected value of GTIFN has been formulated. By employing the possibility and necessity measures of GIFN, the single period multi-product manufacturing generalized intuitionistic fuzzy inventory models is transformed into an equivalent deterministic problem. The transformed problem has been solved by soft computing technique. Finally, the proposed method is illustrated with one numerical example.

The analytical approximate solution of the multi-term fractionally damped Van der Pol equation

Abstract: The present paper deals with the analytical approximate solution of the fractionally damped Van der Pol equation by the homotopy perturbation method and a numerical method. By using initial conditions, the explicit solution of the equation is presented and then the numerical solutions are represented graphically; then the results obtained by two methods are compared.

Metal–ligand ring aromaticity in a 2D coordination polymer used as a photosensitive electronic device

Abstract: In this study, aromaticity of a 14-membered metal–ligand ring present in a two-dimensional coordination polymer (2D CP), [Zn2(fum)2(4-phpy)4(H2O)2] (1) (H2fum = fumaric acid and 4-phpy = 4-phenyl pyridine), was theoretically investigated by calculating the nucleus-independent chemical shifts (NICS). Furthermore, the calculation was supported by free of in-plane component NICS (FiPC-NICS) used specifically for inorganic heterocycle and electron localization function (ELF) analysis. The calculations reveal that the metal–ligand ring has an aromatic character and a moderate C–H⋯π interaction energy (−8.56 kcal mol−1 at the HF/6-311++G(d,p) level of theory) of 4-phpy with the 14-membered ring, which plays an active role in the molecular self-assembly for crystal packing. Furthermore, the compound 1 has a substantive photosensitivity with an appreciable on–off ratio; therefore, this material can be used as a photosensitive electronic device.

Electronic Components (EC) Reuse and Recycling – A New Approach towards WEEE Management

Abstract: Waste Electrical and Electronic Equipments (WEEE) is the fastest growing waste stream in the world. In 2014, a total amount of 41.8 metric kilotonnes of WEEE was generated globally. There are two main parts of a WEEE – a) The Printed Circuit Board (PCB) and b) The Casing i.e. the polymer and/or metal portion that covers the PCB. PCBs contain a lot of components like resistors, transistors, microcontrollers, integrated circuits etc. Once a Electrical and Electronic Equipment (EEE) becomes obsolete; Electronic Components (EC) in the PCB remains unaltered. These ECs can be reused based on their status. In most of the cases, the PCBs end up in the informal sector that employs open burning, acid leaching etc to recover valuable metals from it and the residues end up in landfill which is a malpractice. In this work, two case has been considered – a) Small WEEE (mouse, speakers, headphones, mobile, radio, wires etc) and b) Large WEEE (Laptop, desktops, TV, printer etc). PCBs from these two types of WEEE have been examined. A solution is proposed that will help to enhance the reuse and recycling of the ECs obtained from the PCBs. The proper technique for de-soldering of ECs from the PCB and further testing methods has been discussed. Proper recycling routes of the unusable ECs have also been suggested. Finally, a novel framework has been proposed that will enhance the EC reusability and recycling. The findings will help the stakeholders in decision making, the researchers in considering future research direction and overall a sustainable future for both semiconductor and electronics industry.