Hodges University

About: Hodges University is a education organization based out in Naples, Florida, United States. It is known for research contribution in the topics: MOSFET & Gate oxide. The organization has 2061 authors who have published 3924 publications receiving 69557 citations. The organization is also known as: International College.

Red Media, Blue Media: Evidence of Ideological Selectivity in Media Use

Abstract: We show that the demand for news varies with the perceived affinity of the news organization to the consumer’s political preferences. In an experimental setting, conservatives and Republicans preferred to read news reports attributed to Fox News and to avoid news from CNN and NPR. Democrats and liberals exhibited exactly the opposite syndrome—dividing their attention equally between CNN and NPR, but avoiding Fox News. This pattern of selective exposure based on partisan affinity held not only for news coverage of controversial issues but also for relatively ‘‘soft’’ subjects such as crime and travel. The tendency to select news based on anticipated agreement was also strengthened among more politically engaged partisans. Overall, these results suggest that the further proliferation of new media and enhanced media choices may contribute to the further polarization of the news audience.

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Abstract: Solder is widely used to connect chips to their packaging substrates in flip chip technology as well as in surface mount technology. At present, the electronic packaging industry is actively searching for Pb-free solders due to environmental concern of Pb-based solders. Concerning the reliability of Pb-free solders, some electronic companies are reluctant to adopt them into their high-end products. Hence, a review of the reliability behavior of Pb-free solders is timely. We use the format of “case study” to review six reliability problems of Pb-free solders in electronic packaging technology. We conducted analysis of these cases on the basis of thermodynamic driving force, time-dependent kinetic processes, and morphology and microstructure changes. We made a direct comparison to the similar problem in SnPb solder whenever it is available. Specifically, we reviewed: (1) interfacial reactions between Pb-free solder and thick metalliztion of bond-pad on the substrate-side, (2) interfacial reactions between Pb-free solder and thin-film under-bump metallization on the chip-side, (3) the growth of a layered intermetallic compound (IMC) by ripening in solid state aging of solder joints, (4) a long range interaction between chip-side and substrate-side metallizations across a solder joint, (5) electromigration in flip chip solder joints, and finally (6) Sn whisker growth on Pb-free finish on Cu leadframe. Perhaps, these cases may serve as helpful references to the understanding of other reliability behaviors of Pb-free solders.

Recent advances on electromigration in very-large-scale-integration of interconnects

Abstract: Today, the price of building a factory to produce submicron size electronic devices on 300 mm Si wafers is over billions of dollars. In processing a 300 mm Si wafer, over half of the production cost comes from fabricating the very-large-scale-integration of the interconnect metallization. The most serious and persistent reliability problem in interconnect metallization is electromigration. In the past 40 years, the microelectronic industry has used Al as the on-chip conductor. Due to miniaturization, however, a better conductor is needed in terms of resistance–capacitance delay, electromigration resistance, and cost of production. The industry has turned to Cu as the on-chip conductor, so the question of electromigration in Cu metallization must be examined. On the basis of what we have learned from the use of Al in devices, we review here what is current with respect to electromigration in Cu. In addition, the system of interconnects on an advanced device includes flip chip solder joints, which now tend ...