Institution
Indian Institute of Management Calcutta
Education•Kolkata, India•
About: Indian Institute of Management Calcutta is a education organization based out in Kolkata, India. It is known for research contribution in the topics: Supply chain & Emerging markets. The organization has 415 authors who have published 1354 publications receiving 21725 citations. The organization is also known as: IIMC & IIM Calcutta.
Papers published on a yearly basis
Papers
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TL;DR: In this paper, the authors present the case of the distribution system of an Indian FMCG company, which despite having centralized control takes replenishment decisions based on local stock information.
Abstract: Managing inventory in distribution systems involves taking decisions on the quantity of inventory to be placed at different stages so that a desired customer service level can be achieved at minimum cost. In this paper, we present the case of the distribution system of an Indian FMCG company, which despite having centralized control takes replenishment decisions based on local stock information. The objective of the study is to develop single period representative models based on installation stock and echelon stock, and show by simulation that had the company taken decisions based on system stock information, it would have saved money in terms of investment in inventory.
5 citations
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TL;DR: A placement strategy to compute a set of ``good'' locations where visual sensing will be most effective, based on a randomized algorithm that solves a variant of the {\em art-gallery problem}.
5 citations
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24 Aug 1991TL;DR: The role that search can play in solving certain types of hard optimization problems that involve the proper sequencing of jobs in one-machine job-sh shops and two-machine flow-shops is examined.
Abstract: Many efficient implementations of Al search algorithms have been realized in recent years. In an effort to widen the area of application of search methods to problems that arise in industry, this paper examines the role that search can play in solving certain types of hard optimization problems that involve the proper sequencing of jobs in one-machine job-shops and two-machine flow-shops. The problems studied here have the following general form: The completion of a job at time f induces a penalty G(f), where G(.) is a given penalty function which can be different for different jobs; the jobs must be so sequenced that the total penalty summed over all jobs is minimized. The objective is to improve upon current methods and to show that problems earlier considered formidable can at least be attempted, if not resolved satisfactorily, using admissible search algorithms. The crucial aspect is the derivation of good admissible heuristics that can direct the search narrowly to a goal. The search graph is not necessarily a tree. Algorithm A* has been run on randomly generated data using the derived heuristic estimates to solve a variety of penalty minimization problems; some indicative experimental results are provided.
5 citations
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01 Dec 2010
TL;DR: In this article, the authors consider the placement of standard cells and gate arrays under thermal considerations and propose an algorithm for placing the gates or cells in the different active layers of a 3D IC to ensure an uniform distribution of temperatures of the modules in each active layers, lowest possible value of the maximum temperatures of each of the active layers and a temperature gradient of the layers in a non-increasing manner from bottom layer to top layer to ensure efficient heat dissipation in the face-to-back bonding structure.
Abstract: Thermal issues are playing a dominant role in today's high performance VLSI design. On-chip power density has become an important parameter during the physical design phase. The consumed power is usually converted into dissipated heat, affecting the performance and reliability of a chip. Moreover, 3D chips have significantly larger power densities than their 2D counterparts. In this paper, we consider the placement of standard cells and gate arrays (modules) under thermal considerations. Our contribution includes a novel algorithm for placement of the gates or cells in the different active layers of a 3D IC to ensure (i) an uniform distribution of temperatures of the modules in each active layers, (ii) lowest possible value of the maximum temperatures of each of the active layers, and (iii) a temperature gradient of the maximum temperatures of the layers in a non-increasing manner from bottom layer to top layer to ensure efficient heat dissipation in the face-to-back bonding structure. Experimental results on randomly generated and standard benchmark instances are quite encouraging.
5 citations
01 Jan 2007
5 citations
Authors
Showing all 426 results
Name | H-index | Papers | Citations |
---|---|---|---|
Russell W. Belk | 76 | 351 | 39909 |
Vishal Gupta | 47 | 387 | 9974 |
Sankaran Venkataraman | 32 | 75 | 19911 |
Subrata Mitra | 32 | 219 | 3332 |
Eiji Oki | 32 | 588 | 5995 |
Indranil Bose | 30 | 97 | 3629 |
Pradip K. Srimani | 30 | 268 | 2889 |
Rahul Mukerjee | 30 | 206 | 3507 |
Ruby Roy Dholakia | 29 | 102 | 5158 |
Per Skålén | 25 | 57 | 2763 |
Somprakash Bandyopadhyay | 23 | 111 | 1764 |
Debashis Saha | 22 | 181 | 2615 |
Haritha Saranga | 19 | 42 | 1523 |
Janat Shah | 19 | 52 | 1767 |
Rohit Varman | 18 | 46 | 1387 |