Mitsubishi

About: Mitsubishi is a company organization based out in Tokyo, Japan. It is known for research contribution in the topics: Layer (electronics) & Signal. The organization has 53115 authors who have published 54821 publications receiving 870150 citations. The organization is also known as: Mitsubishi Group of Companies & Mitsubishi Companies.

Obstruction detecting apparatus

Abstract: In the obstruction detection apparatus incorporated in a vehicle (11), ultrasonic wave transmitter/receiver (16 to 19 171) for changing a combination of transmitting of ultrasonic waves and of receiving of reflected ultrasonic waves, a CPU (20) calculates a distance between the vehicle (11) and an obstruction and stores data corresponding to the calculated distance into the distance table (23), and the LC display device (27) displays the obstruction on display bars of a lattice shape corresponding to the data stored in the distance table (23), and a buzzer (26) sounds an alarm for a driver.

Induction of apoptosis by T-2 toxin and other natural toxins in HL-60 human promyelotic leukemia cells.

Abstract: Based on the DNA fragmentation profile in gel electrophoresis and the morphological changes in electron microscopy, the induction of apoptotic nuclear changes by mycotoxins and other microbial products, in total 31 chemicals, was investigated in HL-60 human promyelotic leukemia cells, along with the cytotoxicity tests with 3-[4,5-dimethylthiazol-zyl]-2,5-diphenyltetrazolium bromide (MTT) and trypan blue exclusion. Among the chemicals tested, trichothecenes (T-2 toxin, roridin A, nivalenol, deoxynivalenol), certain anthraquinones (luteoskyrin, skyrin, 2-hydroxyemodin), diketopiperazines (emethallicin A, emestrin), isocoumarins (ochratoxin A, citrinin), lactone (penicillic acid), dihydrobisfuran (aflatoxin B1), potassium ionophore (valinomycin), and an inhibitor of interleukin-2 synthesis (cyclosporin A) were positive for the induction of DNA fragmentation. No DNA fragmentation was observed under the present conditions with fumonisin B1, cyclic peptides (cyclochlorotine, phalloidin, microcystin-LR), certain anthraquinones (emodin, chrysophanol, rugulosin), and others (sterigmatocystin, cytochalasin A, griseofulvin, fusaric acid, kojic acid, rubratoxin B, butenolide, wortmannin, FK506, and sphingosine). The apoptotic changes in the cells exposed to T-2 toxin and luteoskyrin were confirmed by electron microscopic observation. Detailed experiments on dose and time dependencies revealed that T-2 toxin induced the apoptosis at 10 ng/ml (= 4 x 10(-8) M) levels within 2-6 hr without significant cytotoxicity evaluated by the dye exclusion and MTT.

Test analysis apparatus and analysis method for semiconductor wafer using OBIC analysis

Abstract: A test analysis apparatus for OBIC analysis and luminous analysis from a rear surface of a semiconductor wafer. According to the present invention, a semiconductor wafer is mounted on a wafer chuck and a probe card which has metallic needles and which is movable along the X, Y, and Z axes supplies a test pulse signal to respective electrode pads on the front surface of the semiconductor wafer. Then, current generated in the semiconductor wafer is detected at the electrode pads. Optical analysis, such as irradiation with a light beam, detection of reflected light, detection of light generated in the semiconductor wafer and the like, is performed from the rear side of the semiconductor wafer, thereby enabling analysis of a failure or a defect of a defective portion while the semiconductor wafer is in actual operating conditions.

Substrateless resin encapsulated semiconductor device

Abstract: A semiconductor device includes an encapsulating resin encapsulating a semiconductor substrate, a lead pattern or a laminated wiring layers transferred or secured on the lower surface of the encapsulating resin and a plurality of external electrode disposed on the lower surface of the lead pattern. The device may be manufactured by bonding a semiconductor substrate on a transferring substrate to which a lead pattern is formed, resin encapsulating an upper portion of the transferring substrate to cover the semiconductor substrate, and removing only the transferring substrate with the lead pattern left bonded to the encapsulating resin and the semiconductor substrate.