Showing papers by "Motorola published in 1992"

Semiconductor device having a pad array carrier package

Abstract: A semiconductor device (10) having first and second wiring layers (30, 33) on opposite surfaces of a carrier substrate (12) interconnected through vias (32) formed in the carrier substrate (12) electrically coupling an electronic component (18) to a mounting substrate through compliant solder balls (26) displaced away from vias (32), the semiconductor device (10) characterized by a standard size carrier substrate (12) having high performance electrical package interconnections (24) and good heat dissipation. Improved electrical performance is obtained by providing independent wiring layers (30, 33) each having a lead trace layout specifically designed for a particular electronic component (18) and a particular board connection requirement while using a standard size package outline. Assembly costs are reduced by providing a plastic package mold (36) over a standard size carrier substrate (12) capable of supporting a variety of different electronic components (18) themselves having varying dimensions.

Three-dimensional multi-chip pad array carrier

Abstract: A stackable three-dimensional multi-chip module (MCM) is provided whereby each level of chip carrier is interconnected to another level of chip carrier through reflowing of solder balls pre-bumped onto each carrier. Each level of chip carrier, except for the top carrier, has solder balls on both top and bottom surfaces of the substrate. Optional lids can be used to seal each device, and the lid height would serve as a natural positive stand-off between each level of carriers, giving rise to hour glass shaped solder joints which maximizes the fatigue life of the joints. Heat sinks to further enhance heat dissipation of the MCM can be easily accommodated in this stacking approach. Furthermore, each substrate is capable of carrying multiple chips, so the module incorporates planar chip density growth concurrently with the three-dimensional growth giving rise to an ultradense MCM.

Constitutive relations for tin-based-solder joints

Abstract: Extensive data on 62Sn36Pb2Ag, 60Sn40Pb, 96.5Sn3.5Ag, 97.5Pb2.5Sn, and 95Pb5Sn solder are presented. All of the data were collected on soldered assemblies to properly account for the effects of grain size and intermetallic compound distribution. Tensile and shear loading were employed in the strain rate range between 10/sup -8/ and 10/sup -1/ s/sup -1/ and the temperature range between 25 and 135 degrees C. It is remarkable to note that all of the data can be fit to the same general form of constitutive relations; i.e., only the constants depend on the solder alloy. The derived constitutive relations are used to predict solder joint response under thermal cycling. Based on the calculated hysteresis loops, it is apparent that each solder will have a different acceleration factor between field use cycling and accelerated test cycling. >

Wireless motor vehicle diagnostic and software upgrade system

Abstract: A transceiver and additional memory are connected to the microprocessor in a vehicle so that all, or selected portions, of operating data is stored in the memory and periodically transmitted to a remote station. The data is diagnosed at the remote station and, for minor repairs, a fix is transmitted back to the vehicle. The information for a large population of vehicles is used by the manufacturer to determine if a problem is generic to a specific model and to generate repairs and/or model changes.

Health support system

Abstract: A home health and communications support system and method which includes at least one health support unit for monitoring and supporting a patient, at least one monitoring terminal, and a network server coupled between the at least one health support unit and the at least one monitoring terminal for exchanging information between the at least one health support unit and the at least one monitoring terminal. The health support unit comprises a medication controller, communications module for interacting with the patient, central data processor, and external communications interface. The central data processor stores and manipulates patient data generated by the medication controller and by the communications module for patient interaction. The external communications interface allows access to patient data and accepts external data from an external source.

Pad array semiconductor device with thermal conductor and process for making the same

Abstract: A pad array semiconductor device (35) includes a thermal conductor (28) integrated into a circuitized substrate (14). A semiconductor die (12) is mounted on the substrate overlying the thermal conductor to establish a thermal path away from the die. The thermal conductor may also be covered or surrounded by a metallized area (37, 39), which together may serve as a ground plane in the device. Preferably one or more terminals (26) are attached to the thermal conductor for improved thermal and electrical performance. One method of integrating the thermal conductor in the substrate is to position a metal plug into an opening 30 of the substrate. The plug is then compressed or otherwise plastically deformed to fill the opening and create a substantially planar substrate surface.

Energy absorption mechanism by biological bodies in the near field of dipole antennas above 300 MHz

Abstract: The energy absorption mechanism in the close near field of dipole antennas is studied by numerical simulations. All computations are performed and validated applying the three-dimensional multiple multipole software package. The numerical model of the plane phantom is additionally checked by accurate as possible experimental measurements. For the plane phantom, the interaction mechanism can be described well by H-field induced surface currents. The spatial peak specific absorption rate can be approximated within 3 dB by a formula given here based on the incident H-field or antenna current and on the conductivity and permittivity of the tissue. These findings can be generalized to heterogeneous tissues and larger biological bodies of arbitrary shape for frequencies above 300 MHz. The specific absorption rate is mainly proportional to the square of the incident H-field, which implies that in the close near field, the spatial peak specific absorption rate is related to the antenna current and not to the input power. >

Dynamic pricing method and apparatus for communication systems

Abstract: A communication system service billing arrangement is described that adapts to system loading in realtime. As system loading varies, one or more individual subscribers units(ISU) (15,20) of a communication system (8) are provided with realtime information on the current cost of the communication service. The system determines the locations of the ISUs (34) and the current loading there between (31) and calculates a calling rate (32) based at least on the current loading. This calling rate (42) is sent (43) to at least one of the ISUs (15) whose operator can choose to connect or not connect the call between the ISUs based on the current realtime variable rate.

Personal communication system providing supplemental information mode

Abstract: A personal communication system (10) comprises transceiver stations (12, 14, 16, 18) providing communication capability between one or more portable radiotelephones (20, 22, 24) and a telephone network (30). One or more of the transceiver stations (12, 14, 16, 18) is further capable of storing a data base and of transmitting the same in response to a request for such transmission being received from a portable radiotelephone (20, 22, or 24) communicating therewith. The portable radiotelephone (20, 22, or 24) communicating therewith is capable thereafter of receiving the data base and of presenting at least a portion of the same to the radiotelephone subscriber.

Apparatus and method for alternative radiotelephone system selection

Abstract: A dual mode cellular cordless portable radiotelephone preferentially selects the cordless base station over the cellular system when in range of the cordless base station. When the cordless cellular portable is operating in the cellular mode, the radio channel associated with the cordless base station is sampled for a predetermined time. When a signal on the sampled cordless base station channel is detected, the cordless portable moves to the cordless mode and remains in the cordless mode for as long as the signal quality of the signal on the cordless base station channel exceeds a predetermined value.

Mobile unit tracking system

Abstract: A communication network keeps track of the locations of mobile units which utilize the network. On powering up, the mobile units determine their current locations using signals broadcast, for example, by overhead satellites. They then send data communication messages to the network describing their locations. The network saves the locations and returns data messages that describe borders which surround the mobile units' locations. The mobile units repetitively determine their current locations on a regular schedule. When their current locations are outside of their prescribed borders, they send other location data messages to the network to update the location data being maintained by the network and to receive a definition of a new border.

Overmolded semiconductor device having solder ball and edge lead connective structure

Abstract: A low cost manufacturing method is used to fabricate a small multiple chip semiconductor device (10). In one embodiment, a first pattern of conductive traces (14) is formed on one surface of a substrate (12), and a second pattern of traces (16) is formed on a second surface of the substrate (12). A first semiconductor die (20) is interconnected to the first traces (14), and a package body (24) is formed around the first die and a portion of the traces. A second semiconductor die (26) is interconnected to the second traces (16) on the second surface. A second package body (28) is formed around the second die and a portion of the traces (16). Solder balls (32) are coupled to exposed portions of the second traces (16) around the perimeter of the package body (28) to establish external power and ground connections to each die. Edge leads (36) are externally soldered to the traces (14 & 16) around the periphery of the substrate (12) to establish remaining electrical connections.

Leadless semiconductor device and method for making the same

Abstract: A semiconductor device having a thin package profile is leadless, thereby minimizing necessary mounting space on a substrate. In one form, a semiconductor device has a semiconductor die electrically coupled to a plurality of conductive leads. Each lead has a first portion, a second portion, and an intermediate portion which separates the first and second portions. A package body encapsulates the semiconductor die and the first and intermediate portions of the leads. The second portions of the leads are exposed on the bottom surface of the package body and are used to electrically access the semiconductor die.

Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film

Abstract: A low cost manufacturing method is used to fabricate a small multichip semiconductor device (30). In one embodiment, a pattern of conductive traces (13) is formed on a film of transfer material (12). A first semiconductor die (15) is interconnected to the traces and a resin body (20) is formed around the first die and one side of the traces. The film of transfer material forms, at this stage of the process, one side of the first package. The film of transfer material is then peeled from the pattern of conductive traces and the first resin body to expose the other side of the traces. A second semiconductor die (23) is interconnected to the exposed side of the traces. A second resin body (25) is formed around the second die and portions of the exposed traces. Solder balls (26) are coupled to the exposed portions of the traces to establish external electrical connections to each die.

Method and apparatus for reducing interference in a radio communication link of a cellular communication system

Abstract: A method and apparatus is provided for reducing interference in a radio communication link from a central site (230) to a mobile unit (228) in a cellular communication system. The central site (230) includes a first (202) and a second (216) antenna which serve the geographic region (214) in which the mobile unit (228) is located. The radio communication link may be provided by communicating a signal in a first radio communication channel between the first central site antenna (202) and the mobile unit (228). Similarly, the radio communication link may be provided by communicating a signal in a second radio communication channel between the second central site antenna (216) and the mobile unit (228). A measure of interference in the first radio communication channel providing the radio communication link is determined. The radio communication link is switched, in response to the measure of interference being above a predetermined threshold, from the first to the second radio communication channel.

A practical view of software measurement and implementation experiences within Motorola

Abstract: A practical view of software measurement that formed the basis for a companywide software metrics initiative within Motorola is described. A multidimensional view of measurement is provided by identifying different dimensions (e.g., metric usefulness/utility, metric types or categories, metric audiences, etc.) that were considered in this companywide metrics implementation process. The definitions of the common set of Motorola software metrics, as well as the charts used for presenting these metrics, are included. The metrics were derived using the goal/question metric approach to measurement. A distinction is made between the use of metrics for process improvement over time across projects and the use of metrics for in-process project control. Important experiences in implementing the software metrics initiative within Motorola are also included. >

Tamperproof arrangement for an integrated circuit device

Abstract: A tamperproof arrangement for an integrated circuit device. The arrangement includes a package and lid fabricated of heavy metals to prevent X-radiation or infrared detection of circuit operation. Sensors and control circuitry are located on the integrated circuit die itself which detect increased temperature and radiation and clear or zeroize any sensitive information included within the integrated circuit device. Electrode finger grids above and below the integrated circuit die detect physical attempts to penetrate the integrated circuit die. Critical circuit functions are segregated from non-critical functions. Power applied to the integrated circuit device is monitored and separated for critical and non-critical circuit functions.

Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery

Abstract: A composite flip chip semiconductor device (10) permits burn-in testing and rework to be performed on the device while also enhancing electrical, thermal, and mechanical device performance. The device includes a semiconductor die (12) having a plurality of bonding pads (14). Also included in the composite device is an interposer (22) having a first surface with a plurality of traces (26). A plurality of vias (24) extend from the first surface of the interposer (22) to a second surface. The semiconductor die (12) is electrically coupled to the plurality of vias of the interposer which in turn is to be coupled to a substrate.

Remote voice control system

Abstract: A portable communication device (10) is controlled by voice recognition circuitry (20) remote from the portable communication device. The portable communication device includes apparatus for producing and transmitting a parametric representation of voice commands. The remote circuitry (which could possibly be a base station, a mobile repeater, or simply a dedicated box, separate from the portable) produces control signals, responsive to the parametric representation of voice commands, for controlling the portable communication device.

Organization of the Motorola 88110 superscalar RISC microprocessor

Abstract: Motorola's second-generation RISC microprocessor, which uses advanced techniques for exploiting instruction-level parallelism, including superscalar instruction issue, our-of-order instruction completion, speculative execution, dynamic instruction rescheduling, and two parallel, high-bandwidth, on-chip caches, is discussed. The microprocessor was designed to serve as the central processor in low-cost personal computers and workstations, and support demanding graphics and digital signal processing applications. The 88110's instruction set architecture, instruction sequencer, register files, execution units, address translation facilities, caches, and external bus interface are described. >

Stress-induced current in thin silicon dioxide films

Abstract: Low-field current following Fowler-Nordheim stress of thin gate oxides is studied The conduction mechanism is attributed to trap-assisted tunneling of electrons For oxides thicker than 100 AA, this stress-induced current is observed to decay as traps are filled without significant tunneling out of traps In thinner oxides, steady-state current flows when there is an equilibrium between trap filling and emptying processes This model is observed to be consistent with stress-induced current behavior in a wide range of oxide thicknesses (60 AA to 130 AA) and process technologies >

Reduced stress plastic package

Abstract: A plastic package (10) with a heat sink (11, 27, 28, 32) has a stress relief wall (18, 21, 33) formed on its upper surface. A semiconductor die (12) is mounted on the heat sink (11, 27, 28, 32) such that the top of a semiconductor die (12) is below the level of the top of the wall (18, 21, 33), and the wall (18, 21, 33) absorbs stresses which otherwise would be applied to the semiconductor die (12). The package (10) is simple to fabricate and assemble, and provides a mold lock (23, 24, 31) which serves to hold the plastic material (13) tightly to the heat sink (11, 27, 28, 32). Extra die bond material (26) can be used to increase heat flow without compromising other characteristics of the package (10).

Integrated circuit chip carrier

Abstract: An integrated circuit chip carrier assembly, comprising a semiconductor device (10) having interconnection pads (14) disposed on an active surface (12) of the device The device (10) is attached by means of electrically conducting bumps (26) to a circuitry pattern (18) on a first side of a circuit carrying substrate (16) The substrate is typically an aramid reinforced organic resin, such as epoxy The circuitry (18, 20) is electrically connected by conductive through-holes (22) to an array of solder pads on a second side of the substrate Some or all of the through-holes (22) are covered by the device The overall length and width of the circuit carrying substrate (16) are each a maximum of about 015 inches greater than the equivalent dimensions of the device (10), creating a carrier that is only slightly larger than the semiconductor device itself

Method and apparatus for using orthogonal coding in a communication system

Abstract: A method and apparatus is provided for encoding and decoding. In encoding, bits (202) are encoded (204) into symbols (206) such that maximum likelihood decoding is facilitated. Groups of symbols (206) are translated by either interleaving by group each group within a block (208) and subsequently deriving an orthogonal code from each group (212) or deriving an orthogonal code from each group and subsequently interleaving by code each code within a block. In decoding, groups of samples (228, 229) are transformed by either generating metrics and index symbols (242) for each group of samples (232, 234, 236, 238, 240) and subsequently deinterleaving by group each group of metrics within a block (244) or deinterleaving by group each group of samples within a block and subsequently generating metrics and index symbols for each deinterleaved group of samples. Each metric represents the confidence that a group of samples is a particular orthogonal code. Subsequently, maximum likelihood decoding (266) generates an estimated bit (268) from the index symbols and metrics (260).

Leadless integrated circuit package

Abstract: A semiconductor device package comprises an integrated circuit chip (10), a substrate (16), an encapsulant (30), and an organic coupling agent or underfill material (12) disposed between the integrated circuit chip and the first side of the substrate. The chip has a plurality of interconnection pads (14) disposed on an active surface of the chip at some minimum spacing "X." Each of the interconnect pads also has electrically conducting bumps (26) on them. The substrate has a circuit pattern (20) on a first side and an array of solder pads (23) spaced a certain distance apart on an opposite side of the substrate. The distance between these pads is greater than the minimum distance (X) between the interconnect pads on the IC. The circuit pattern is electrically connected to the array of solder pads by plated through holes (22). The length and width of the circuit carrying substrate is substantially greater than the length and width of the integrated circuit chip. The chip is mounted face down to the substrate with the electrically connecting bumps, such that at least some of the plated through holes in the substrate are covered by the chip. The polymeric encapsulant (30) covers the entire chip and substantially all of the first side of the substrate, providing a sealed package.

Location-based adaptive radio control

Abstract: A method (200) and apparatus (100)is provided for a radio having adjustable operating parameters to adjust at least one such adjustable operating parameter based on the current location of the radio. Operating parameters which may be so adjusted include, but are not limited to, the following: transmitting power, operating channel, operating band, modulation type, modulation index, frequency deviation, squelch setting, channel spacing, control channel (for trunked communications), noise blanker characteristic, and receive bandwidth. In another embodiment, transmissions by the radio can be inhibited as a function of the location when it is determined that the location is within a hazard area.

Electronic direction finder

Abstract: An electronic direction finder (10) includes a navigation receiver (28) and a compass (32) to generate a bearing signal that indicates that direction of a desired destination. The bearing signal is received by a display driver (34) which causes an electronic display (14) to generate a visible image of a rotatable pointer that points in the direction of the user's desired destination. Preferably, the display also shows an electronic compass card indicating the direction of north.

Method of forming a three-dimensional printed circuit assembly

Abstract: A three-dimensional printed circuit assembly is formed by first making a substrate (20). A substrate (20) is first formed from a photoactive polymer (14) that is capable of altering its physical state when exposed to a radiant beam (30). At this point, the substrate is only partially cured. A conductive circuit pattern (50) is then formed on the partially cured substrate. The substrate is then molded to create a three-dimensional structure, and then further cured to cause the photoactive polymer to harden.

Waveguide virtual image display

Abstract: A waveguide virtual image display (15) including image generation apparatus (22) providing a real image at an inlet of an optical waveguide (20). The real image being reflected a plurality of times within the optical waveguide (20) by diffractive optical elements (23, 25, 26, 27, 28) that magnify and filter the real image and produce a virtual image at a viewing aperture