Institution
Motorola
Company•Schaumburg, Illinois, United States•
About: Motorola is a company organization based out in Schaumburg, Illinois, United States. It is known for research contribution in the topics: Signal & Communications system. The organization has 27298 authors who have published 38274 publications receiving 968710 citations. The organization is also known as: Motorola, Inc. & Galvin Manufacturing Corporation.
Papers published on a yearly basis
Papers
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02 Apr 2005TL;DR: The results suggest that audio-haptics seems to enhance the perception of audio quality, and two techniques, the Haptic Inheritance and Synthesis and Matching methods are discussed, allow simple creation of vibration content, and also allow for compatibility with non-haptic mobile devices.
Abstract: A new breed of mobile phones has been designed to enable concurrent vibration and audio stimulation, or audio-haptics. This paper aims to share techniques for creating and optimizing audio-haptic effects to enhance the user interface.The authors present audio manipulation techniques specific to the multifunction transducer (MFT) technology. In particular two techniques, the Haptic Inheritance and Synthesis and Matching methods are discussed. These two methods of haptic media generation allow simple creation of vibration content, and also allow for compatibility with non-haptic mobile devices.The authors present preliminary results of an evaluation of 42 participants comparing audio-based haptic user interface (UI) feedback with audio-only feedback. The results show that users were receptive to audio-haptic UI feedback. The results also suggest that audio-haptics seems to enhance the perception of audio quality.
145 citations
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TL;DR: This review compares and contrasts the available sources of SNP data, and describes the rationale behind the SNP mapping efforts, from the study of common diseases to unraveling an individual's response to medication.
145 citations
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TL;DR: In this article, the dielectric function of bulk nitrogen-doped 4H and 6H SiC substrates was measured using Fourier transform infrared spectroscopic ellipsometry.
Abstract: We have measured the dielectric function of bulk nitrogen-doped 4H and 6H SiC substrates from 700 to 4000 ${\mathrm{cm}}^{\mathrm{\ensuremath{-}}1}$ using Fourier-transform infrared spectroscopic ellipsometry. Photon absorption by transverse optical phonons produces a strong reststrahlen band between 797 and 1000 ${\mathrm{cm}}^{\mathrm{\ensuremath{-}}1}$ with the effects of phonon anisotropy being observed in the region of the longitudinal phonon energy (960 to 100 ${\mathrm{cm}}^{\mathrm{\ensuremath{-}}1}$). The shape of this band is influenced by plasma oscillations of free electrons, which we describe with a classical Drude equation. For the 6H-SiC samples, we modify the Drude equation to account for the strong effective mass anisotropy. Detailed numerical regression analysis yields the free-electron concentrations, which range from $7\ifmmode\times\else\texttimes\fi{}{10}^{17}$ to ${10}^{19}{\mathrm{cm}}^{\mathrm{\ensuremath{-}}3},$ in good agreement with electrical and secondary ion mass spectrometry measurements. Finally, we observe the Berreman effect near the longitudinal optical phonon energy in $n\ensuremath{-}/n+$ homoepitaxial 4H SiC and hydrogen implanted samples, and we are able to determine the thickness of these surface layers.
144 citations
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02 Nov 1994TL;DR: In this article, a ball-grid array (BGA) semiconductor package (10,60,90) includes a substrate (31,61,91) attached to a support substrate (32,62 92).
Abstract: A ball-grid array (BGA) semiconductor package (10,60,90) includes a substrate (31,61,91) attached to a support substrate (32,62 92). The substrate (31,61,91) has an opening (33) extending from an upper surface to a lower surface. An integrated circuit chip (18) is attached to the support substrate (32,62,92) within the opening (33). Bond pads (22) on the integrated circuit chip (18) are electrically connected to ball pads (42,73,106,108) on the lower surface of the substrate (31,61,91). Conductive solder balls (26) are attached to the ball pads (42,73,106,108). The support substrate (32,62,92) provides a low profile and functions as a standoff that limits the collapse of the conductive solder balls (26) when the BGA semiconductor package (10,60,90) is attached to an application board (46).
144 citations
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01 Mar 1999TL;DR: In this paper, a device for generating energy, utilizing a fuel cell, is presented. But the device is not suitable for use with handheld electric devices, and contains a fuel storage means ( 110 ) for storing a supply of fuel, a fuel delivery means ( 120 ) connected to the fuel storage, and an energy conversion device ( 140 ) connected with the fuel delivery for converting the fuel to electricity.
Abstract: The invention provides a device for generating energy, utilizing a fuel cell. Air is freely guided to the fuel cell, while a fuel gas is provided to the fuel cell from a pressurized fuel supply via a regulator. The portable power supply is most applicable to use with handheld electric devices, and contains a fuel storage means ( 110 ) for storing a supply of fuel, a fuel delivery means ( 120 ) connected to the fuel storage means, an energy conversion device ( 140 ) connected to the fuel delivery means for converting the fuel to electricity. The fuel storage means, the fuel delivery means, and the energy conversion device are all contained in a volume less than 500 cubic centimeters.
144 citations
Authors
Showing all 27298 results
Name | H-index | Papers | Citations |
---|---|---|---|
Georgios B. Giannakis | 137 | 1321 | 73517 |
Yonggang Huang | 136 | 797 | 69290 |
Chenming Hu | 119 | 1296 | 57264 |
Theodore S. Rappaport | 112 | 490 | 68853 |
Chang Ming Li | 97 | 896 | 42888 |
John Kim | 90 | 406 | 41986 |
James W. Hicks | 89 | 406 | 51636 |
David Blaauw | 87 | 750 | 29855 |
Mark Harman | 83 | 506 | 29118 |
Philippe Renaud | 77 | 773 | 26868 |
Aggelos K. Katsaggelos | 76 | 946 | 26196 |
Min Zhao | 71 | 547 | 24549 |
Weidong Shi | 70 | 528 | 16368 |
David Pearce | 70 | 342 | 25680 |
Douglas L. Jones | 70 | 512 | 21596 |