Motorola

About: Motorola is a company organization based out in Schaumburg, Illinois, United States. It is known for research contribution in the topics: Signal & Communications system. The organization has 27298 authors who have published 38274 publications receiving 968710 citations. The organization is also known as: Motorola, Inc. & Galvin Manufacturing Corporation.

Temperature compensated automatic output control circuitry for RF signal power amplifiers with wide dynamic range

Abstract: Improved temperature compensated, automatic output control (AOC) circuitry for RF signal power amplifiers is described that maintains the output power within one-half dB of a selected one of eight power levels varying from nine milliwatts to five watts, a dynamic range of twenty-eight dB. The amplification of the RF signal amplifier is proportional to a drive current signal provided by a current amplifier. A half-wave rectifier is coupled to the output of final amplifiers for generating an output power signal that has a magnitude proportional to the output power. The half-wave rectifier is temperature compensated for and biased by a diode coupled to the rectifier by one resistor and coupled to supply voltage by another resistor. The output power voltage is further coupled to an amplifier having an amplification factor selected by level control signals. The amplified output power signal is coupled to a comparator which varies the drive current provided by the current amplifier in response to the voltage difference between the amplified output power signal and a reference voltage.

On-board vehicle parking space finder service

Abstract: An on-board vehicle navigation system parking space finder that offers a driver a competitive edge in finding available on-street parking. Drivers not familiar with an area are able to locate available metered parking spaces with ease. Drivers may be informed, on demand, of what type of currency they need for parking meters in certain areas, so they can stop for change, if necessary. Drivers will have information about maximum time limits for different parking meters, and can use this information to select meters with longer time limits, if necessary. Metered parking information specific to a vehicles current location, as well as metered parking information specific to a requested location, are made optionally available to drivers from within their vehicles.

Systems and method for use in a dual mode satellite communications system

Abstract: A communications network is capable of using time division multiple access (TDMA) techniques, code division multiple access (CDMA) techniques, or a combination of both. A subscriber unit (30) makes a request for a traffic channel over a CDMA pilot channel or a TDMA broadcast channel. A satellite (20) or a base station (40) receives the request and determines whether to assign a TDMA or CDMA traffic channel. The downlink and uplink can have the same access scheme (e.g., TDMA) or different access schemes (e.g., TDMA on the uplink and CDMA on the downlink).

Dynamic modeling of a three-way catalyst for SI engine exhaust emission control

Abstract: Automotive emissions are severely regulated. Since 1980, a three-way catalyst (TWC) has been used to convert harmful emissions of hydrocarbons, carbon monoxide, and oxides of nitrogen into less harmful gases in order to meet these regulations. The TWC's efficiency of conversion of these gases is primarily dependent on the mass ratio of air to fuel (A/F) in the mixture leaving the exhaust manifold and entering the catalyst, the velocity of the exhaust mass, and the temperature of the catalyst. The goal of the paper is to develop a dynamic control-oriented model of a TWC. First, the measurement capabilities are described. Then, a simplified, dynamic catalyst model that can be determined on the basis of medium bandwidth A/F measurements and low bandwidth temperature and emission measurements is developed and validated.

High performance overmolded electronic package

Abstract: A package for containing high performance electronic components, such as high speed integrated circuits (ICs). The package bears a substrate of multiple layers having a cavity therein. Leads may be placed within holes in the substrate and soldered or otherwise electrically connected to conductive patterns or layers in the substrate. A thermally conductive insert is attached to one side of the substate. The insert has a pedestal which protrudes through the cavity in the substrate. An electronic component, such as an IC may then be mounted on the pedestal and electrically connected to a conductive metal pattern on one of the layers of the substrate. This assembly may then be coated with a dielectric material to form the package body, leaving the distal ends of the leads and the back side of the insert exposed. Since the IC chip or other component is directly mounted on the insert, waste heat generated by the chip may be directly channeled outside the package through the insert which effectively forms one wall of the package. The exposed leads may be formed into the desired configuration, including shapes suitable for surface mount technology. The use of a multiple layer substate permits the inclusion of ground and power planes for high performance circuits, such as emitter coupled logic (ECL) gate arrays, within the package itself.