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Institution

Motorola

CompanySchaumburg, Illinois, United States
About: Motorola is a company organization based out in Schaumburg, Illinois, United States. It is known for research contribution in the topics: Signal & Communications system. The organization has 27298 authors who have published 38274 publications receiving 968710 citations. The organization is also known as: Motorola, Inc. & Galvin Manufacturing Corporation.


Papers
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Proceedings ArticleDOI
Hector Sanchez1, B. Kuttanna1, T. Olson1, M. Alexander1, Gianfranco Gerosa1, R. Philip1, Jose Alvarez1 
23 Feb 1997
TL;DR: The next-generation PowerPC/sup TM/ microprocessor includes a thermal assist unit (TAU) comprised of an on-chip thermal sensor and associated logic and dynamically adjusts processor operation to provide maximum performance under changing environmental conditions.
Abstract: Thermal management is an important design issue in high-performance, low-power portable computers If the computer system is designed for worst-case processor power dissipation and environmental operating conditions, it carries an area and cost penalty for the system designer The next-generation PowerPC/sup TM/ microprocessor includes a thermal assist unit (TAU) comprised of an on-chip thermal sensor and associated logic The TAU monitors the junction temperature of the processor and dynamically adjusts processor operation to provide maximum performance under changing environmental conditions The TAU is used in conjunction with other low-power features such as dynamic power management, instruction cache throttling and static low-power modes to provide comprehensive power and thermal management This paper describes the implementation of the TAU and presents its characterization and operating data from first silicon

141 citations

Journal ArticleDOI
TL;DR: In this article, the structure of anatase TiO2(0.0.1) surface and its reactivity towards carboxylic acids were studied using in situ scanning tunnelling microscopy (STM), low-energy electron diffraction (LEED), X-ray photoemission spectroscopy (XPS) and temperature-programmed desorption (TPD).

141 citations

Patent
Michael B. McShane1
22 Aug 1985
TL;DR: In this article, a low-cost process for bonding a plurality of integrated circuit die to a variety of die support frames using existing, readily available equipment is proposed, where the process permits placing balls on the bonding pads of the die by a wire bonder, cutting off the wire, planarizing the balls, coating the planarized region with a conductive epoxy, and then registering and bonding the die to corresponding conductive patterns on the support frames.
Abstract: A low cost process for bonding a plurality of integrated circuit die to a variety of die support frames using existing, readily available equipment. Tape automatic bonding (TAB) processes offer a number of new possibilities in the assembly and packaging of integrated circuits. However, the investigation of TAB techniques or the use of TAB techniques on low volume parts is prohibited by the high cost of "bumping" or putting interconnection balls on the chip or the tape leads. The process permits placing balls on the bonding pads of a plurality of die by a wire bonder, cutting off the wire, planarizing the balls, coating the planarized region with a conductive epoxy and then registering and bonding the die to corresponding conductive patterns on die support frames.

141 citations

Journal ArticleDOI
TL;DR: In this paper, a segmented, linear array of microdischarges, fabricated in a ceramic multilayer structure and having an active length of ~1?cm and a clear aperture of 80? 360m2, exhibits evidence of gain on the 460.3 nm transition of Xe+, making it the first example of a microdischarge-driven optical amplifier.
Abstract: Recent advances in the development of microplasma devices fabricated in a variety of materials systems (Si, ceramic multilayers, and metal/polymer structures) and configurations are reviewed. Arrays of microplasma emitters, having inverted pyramidal Si electrodes or produced in ceramic multilayer sandwiches with integrated ballasting for each pixel, have been demonstrated and arrays as large as 30 ? 30 pixels are described. A new class of photodetectors, hybrid semiconductor/microplasma devices, is shown to exhibit photoresponsivities in the visible and near-infrared that are more than an order of magnitude larger than those typical of semiconductor avalanche photodiodes. Microdischarge devices having refractory or piezoelectric dielectric films such as Al2O3 or BN have extended lifetimes (~86% of initial radiant output after 100?h with an Al2O3 dielectric) and controllable electrical characteristics. A segmented, linear array of microdischarges, fabricated in a ceramic multilayer structure and having an active length of ~1?cm and a clear aperture of 80 ? 360??m2, exhibits evidence of gain on the 460.3 nm transition of Xe+, making it the first example of a microdischarge-driven optical amplifier.

141 citations

Patent
Thomas Michael Fox1
27 Dec 1993
TL;DR: In this paper, the antenna preamplifier node is coupled to collection nodes which are in turn coupled to a central computer, and a personal detector unit attached to a user is inserted into an enclosure of the antenna node, which is electrically isolated by RF attenuation material.
Abstract: A personal identification system includes a number of antenna preamplifier nodes coupled to collection nodes which are in turn coupled to a central computer. A personal detector unit attached to a user is inserted into an enclosure of the antenna preamplifier node. The antenna preamplifier node is electrically isolated by RF attenuation material. An antenna of the antenna preamplifier node is a low gain antenna. The antenna preamplifier node reads a coded radio frequency signal of a personal detector unit inserted into an enclosure and rejects signals of other various personal detector units in the vicinity.

140 citations


Authors

Showing all 27298 results

NameH-indexPapersCitations
Georgios B. Giannakis137132173517
Yonggang Huang13679769290
Chenming Hu119129657264
Theodore S. Rappaport11249068853
Chang Ming Li9789642888
John Kim9040641986
James W. Hicks8940651636
David Blaauw8775029855
Mark Harman8350629118
Philippe Renaud7777326868
Aggelos K. Katsaggelos7694626196
Min Zhao7154724549
Weidong Shi7052816368
David Pearce7034225680
Douglas L. Jones7051221596
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Performance
Metrics
No. of papers from the Institution in previous years
YearPapers
20232
20229
202129
2020131
2019134
2018144