Motorola

About: Motorola is a company organization based out in Schaumburg, Illinois, United States. It is known for research contribution in the topics: Signal & Communications system. The organization has 27298 authors who have published 38274 publications receiving 968710 citations. The organization is also known as: Motorola, Inc. & Galvin Manufacturing Corporation.

Optoelectroinc mount including flexible substrate and method for making same

Abstract: A method for interconnecting a waveguide (102), an optoelectronic component 101, and an electronic component (103). A first surface (108) is formed from a portion of cladding region(107) and a second surface (109) is formed from a portion of core region and a portion of the cladding region. A substrate (104) having electrical tracings (212', 213') is attached to the waveguide (102) so that an electronic component receiving area (111') and an optoelectronic component area (112') are attached to the first and second surface (108, 109) of the waveguide (102) respectively. An electronic component (103) and an optoelectronic component (101) are mounted to the electronic component receiving area (111') and the optoelectronic receiving area (112') respectively.

TDM hand-off technique using time differences

Abstract: A subscriber makes its hand-off decision based on time difference measurements between synchronization markers received from adjacent repeaters relative to the synchronization markers received from the subscriber's assigned repeater. The subscriber uses signal quality measurements to identify candidate repeaters with adequate signal level, and the time difference measurements to decide which of these repeaters is geographically closest. Thus, the subscriber unit makes hand-off decisions as its movement closes the distance to an adjacent repeater that can provide an adequate signal level.

Packaging effects on reliability of Cu/low-k interconnects

Abstract: Chip-packaging interaction is becoming a critical reliability issue for Cu/low-k chips during assembly into a plastic flip-chip package. With the traditional TEOS interlevel dielectric being replaced by much weaker low-k dielectrics, packaging induced interfacial delamination in low-k interconnects has been widely observed, raising serious reliability concerns for Cu/low-k chips. In a flip-chip package, the thermal deformation of the package can be directly coupled into the Cu/low-k interconnect structure inducing large local deformation to drive interfacial crack formation. In this paper, we summarize experimental and modeling results from studies performed in our laboratory to investigate the chip-package interaction and its impact on low-k interconnect reliability. We first review the experimental techniques for measuring thermal deformation in a flip-chip package and interfacial fracture energy for low-k interfaces. Then results from three-dimensional finite element analysis (FEA) based on a multilevel submodeling approach in combination with high-resolution moire/spl acute/ interferometry to investigate the chip-package interaction for low-k interconnects are discussed. Packaging induced crack driving forces for relevant interfaces in Cu/low-k structures are deduced and compared with corresponding interfaces in Cu/TEOS and Al/TEOS structures to assess the effect of ILD on packaging reliability. Our results indicate that packaging assembly can significantly impact wafer-level reliability causing interfacial delamination to become a serious reliability concern for Cu/low-k structures.

Low profile vibratory alerting device

Abstract: An electronic device, such as a selective call receiver, includes a housing (302) for the electronic device preferably having a rigid member (304) fixedly integrally attached thereto and extending therefrom, the rigid member constructed to cooperatively connect with a rotatable body (308) and to secure the rotatable body (308) to the housing (302) while allowing the rotatable body (308) to rotate about the rigid member (304), a circuit supporting substrate (301) arranged within the housing (302) coupled thereto, and an alerting device (300) for providing a vibratory alert The alerting device (300) includes coils (320) on the circuit supporting substrate (301) arranged about the rigid member (304), with each coil (322) capable of being selectively energized The alerting device (300) also includes a body (308) including magnetic material, preferably including a wedge-shaped mass (314), the body (308) rotatable about the rigid member (304) in a plane substantially parallel to the circuit supporting substrate (301) for directly generating vibrations in the housing (302) via the rigid member (304) Lastly, a selective energizing device (400) selectively energizes the coils (320) to rotate the body (308), to provide the vibratory alert

Optical noninvasive blood pressure sensor and method

Abstract: A blood pressure sensor (12) includes a source of photo-radiation, such as an array (30) of laser diodes (30A-I). The sensor also includes a two-dimensional, flexible reflective surface (14). The reflective surface is nominally positioned relative to the radiation source such that the radiation travels in a direction normal to the reflective surface. The reflective surface is placed adjacent to the location on the patient where the blood pressure data is to be acquired. Radiation from the source is reflected off of the reflective surface onto a two-dimensional array (17) of photo-detectors (18). Systolic and diastolic blood pressure fluctuations in the patient are translated into deflections of the patient's skin. These deflections cause corresponding deflections in the two dimensional reflective surface. The associated movement of said flexible reflective surface (14) due to blood pulsation causes scattering patterns from said reflective surface to be detected by the two dimensional array (17) of photo-detectors (18). The output from the array of photo-detectors is calibrated to blood pressure in mmHg during a calibration procedure to obtain a set of calibration relationships for one or more of the individual detectors. The calibration relationships are then used during acquisition of blood pressure data to arrive at blood pressure data.