Motorola

About: Motorola is a company organization based out in Schaumburg, Illinois, United States. It is known for research contribution in the topics: Signal & Communications system. The organization has 27298 authors who have published 38274 publications receiving 968710 citations. The organization is also known as: Motorola, Inc. & Galvin Manufacturing Corporation.

Methods and systems for providing a resource in an electronic network

Abstract: A method of providing a resource in an electronic network (20) which includes receiving a signal associated with machine-readable data (16) read from a network navigation device (10). The network navigation device (10) has a human-viewable image (14). The method further includes identifying the resource based upon the signal, and communicating content of the resource. The method can be performed by a node (24) of the electronic network (20).

Method of operation of mobile wireless communication system with location information

Abstract: Location information is generated for a mobile device using a global positioning system (GPS) receiver ( 17 ) or by other means. A request for receipt of location information is received at the mobile device, over a wireless communications channel from a requesting entity ( 25 ), and a confirmation of permission to receive location information is sent to the requesting entity, over the wireless communication channel. The confirmation includes a digital signature for the requesting entity to use as verifiable proof of confirmation of permission. The requesting entity can use the digital signature to obtain the location information from a location server ( 21 ). The requesting entity and/or the location server are optionally located in the mobile communications device.

Method and apparatus for providing navigational services in a wireless communication device

Abstract: An internet radio for portable applications and uses such as in an automobile enables providing navigational services to be provided to a wireless communication device, and comprises the steps of providing a user interface in said wireless communication device for providing navigational services to a user; downloading updated navigational data from a remote network; and providing navigational services based upon said updated navigational data. Customized information is also communicated to the radio such as stock quotes, travel information, advertising, and e-mail. Onboard global positioning allows for channel updating by location, traffic information, geographic advertising and available similar content.

Method and apparatus for improving vehicle operator performance

Abstract: A method (700) for improving driver performance includes the steps of receiving vehicle operating data from the vehicle (702); monitoring an interior portion of the vehicle and receiving operator activity data from the interior portion of the vehicle (704); receiving vehicle environment data from the environment external to the vehicle (706); monitoring the vehicle operator and receiving operator condition data relating to a condition of the vehicle operator (708); recording an operator performance assessment based on the vehicle operating data, the operator activity data, the vehicle environment data and the operator condition data (710); and reporting the operator performance assessment to the operator (712).

Pb-free solders for flip-chip interconnects

Abstract: A variety of lead-free solder alloys were studied for use as flip-chip interconnects including Sn-3.5Ag, Sn-0.7Cu, Sn-3.8Ag-0.7Cu, and eutectic Sn-37Pb as a baseline. The reaction behavior and reliability of these solders were determined in a flip-chip configuration using a variety of under-bump metallurgies (TiW/Cu, electrolytic nickel, and electroless Ni-P/Au). The solder micro-structure and intermetallic reaction products and kinetics were determined. The Sn-0.7Cu solder has a large grain structure and the Sn-3.5Ag and Sn-3.8Ag-0.7Cu have a fine lamellar two-phase structure of tin and Ag3Sn. The intermetallic compounds were similar for all the lead-free alloys. On Ni, Ni3Sn4 formed and on copper, Cu6Sn5Cu3Sn formed. During reflow, the intermetallic growth rate was faster for the lead-free alloys, compared to eutectic tin-lead. In solidstate aging, however, the interfacial intermetallic compounds grew faster with the tinlead solder than for the lead-free alloys. The reliability tests performed included shear strength and thermomechanical fatigue. The lower strength Sn-0.7Cu alloy also had the best thermomechanical fatigue behavior. Failures occurred near the solder/intermetallic interface for all the alloys except Sn-0.7Cu, which deformed by grain sliding and failed in the center of the joint. Based on this study, the optimal solder alloy for flip-chip applications is identified as eutectic Sn-0.7Cu.