Motorola

About: Motorola is a company organization based out in Schaumburg, Illinois, United States. It is known for research contribution in the topics: Signal & Communications system. The organization has 27298 authors who have published 38274 publications receiving 968710 citations. The organization is also known as: Motorola, Inc. & Galvin Manufacturing Corporation.

Micromachines on the march

Abstract: Miniature electromechanical sensors and actuators can be mass produced on silicon wafers much like ICs. They combine readily with signal-processing circuitry into powerful tools that measure, analyze, and control their environments. The authors describe the fabrication techniques, surface activity, atomic bonds, LIGA and SLIGA, and bury and destroy. The following applications are discussed: pressure sensors, medical equipment, industrial/consumer equipment, avionics, and mechanical applications. >

How software process improvement helped Motorola

Abstract: Many organizations are using or considering the Capability Maturity Model as a vehicle for software process improvement But does the CMM provide real benefits? The authors offer metrics and data that show the results of Motorola's CMM usage

Vector sum excited linear prediction (VSELP) speech coding at 8 kbps

Abstract: The vector sum excited linear prediction speech coder is presented. It utilizes a codebook with a structure that allows for a very efficient search procedure. Other advantages of the VSELP codebook structure are discussed, and a detailed description of an 8-kb/s VSELP coder is given. This coder was selected by the Telecommunications Industry Association (TIA) as the standard for use in North American digital cellular telephone systems. The coder uses two VSELP excitation codebooks, a gain quantizer which is robust to channel errors, and a novel adaptive pre/postfilter arrangement. >

Agile software development in large organizations

Abstract: The need to see compelling evidence before adopting new methods looms greater in large organizations because of their complexity and the need to integrate new technologies and processes with existing ones. To further evaluate agile methods and their underlying software development practices, several Software Experience Center (SEC) member companies initiated a series of activities to discover if agile practices match their organizations' needs. Although each organization evaluated agile methods according to its specific needs, here we attempt to generalize their findings by analyzing some of their common experiences in the particular context of large organizations with well-established structures and processes. We base this analysis on experience collected and shared among four SEC members namely ABB, DaimlerChrysler, Motorola, and Nokia.

Interconnect structure in a semiconductor device and method of formation

Abstract: In one embodiment, a conductive interconnect ( 38 ) is formed in a semiconductor device by depositing a dielectric layer ( 28 ) on a semiconductor substrate ( 10 ). The dielectric layer ( 28 ) is then patterned to form an interconnect opening ( 29 ). A tantalum nitride barrier layer ( 30 ) is then formed within the interconnect opening ( 29 ). A catalytic layer ( 31 ) comprising a palladium-tin colloid is then formed overlying the tantalum nitride barrier layer ( 30 ). A layer of electroless copper ( 32 ) is then deposited on the catalytic layer ( 31 ). A layer of electroplated copper ( 34 ) is then formed on the electroless copper layer ( 32 ), and the electroless copper layer ( 32 ) serves as a seed layer for the electroplated copper layer ( 34 ). Portions of the electroplated copper layer ( 34 ) are then removed to form a copper interconnect ( 38 ) within the interconnect opening ( 29 ).