Motorola

About: Motorola is a company organization based out in Schaumburg, Illinois, United States. It is known for research contribution in the topics: Signal & Communications system. The organization has 27298 authors who have published 38274 publications receiving 968710 citations. The organization is also known as: Motorola, Inc. & Galvin Manufacturing Corporation.

Integrated circuit package having a face-to-face IC chip arrangement

Abstract: An integrated circuit package includes a stacked integrated circuit chip arrangement (140) placed on a circuit substrate. The stacked IC chip arrangement includes a first IC chip (110) and a second IC chip (120), each having an array of terminals (116, 126) and being positioned in a face-to-face manner. An interposed substrate (130) is positioned between the first IC chip (110) and the second IC chip (120) such that circuitry disposed on the interposed substrate (130) provides electrical connection among the arrays of terminals of the first IC chip (110) and the second IC chip (120) and external circuitry.

Electronic book having highlighting feature

Abstract: An electronic book includes a book-shaped housing having a first housing member pivotably connected to a second housing member to open and close in a book-like manner. A touchscreen displays a page of the text represented by the machine-readable data. A user-initiated event selecting a portion of the text is received by the touchscreen. The touchscreen displays the portion of the text in a highlighted form. The processor stores an indicator of the portion of the text to be highlighted in the removable machine-readable storage medium to remain with the text when the removable machine-readable storage medium is removed from the electronic book.

Error control schemes for networks: an overview

Abstract: In this paper, we investigate the issue of error control in wireless communication networks. We review the alternative error control schemes available for providing reliable end-to-end communication in wireless environments. Through case studies, the performance and tradeoffs of these schemes are shown. Based on the application environments and QoS requirements, the design issues of error control are discussed to achieve the best solution.

A fully distributed location registration strategy for universal personal communication systems

Abstract: The universal personal communication system (UPCS) is a system that enables anyone to communicate instantly with anyone else anywhere in the world. One of the crucial problems of such a system is locating hundreds of millions of moving portables in an efficient manner. The location registration strategy described is able to locate active portables automatically in the system with a small overhead in a distributed fashion. The system knows the exact position of an active portable in its service areas. The connection is set up by the system directly to its destination using the direct (shortest) path. The system capacity, efficiency, and inquiry time delay have been improved greatly compared to the leading existing techniques. It is shown that in the proposed system, the maximum database size is 0.51% and the database updating cost is 6.86% of that needed by a central database system under a specified scenario. >

Process for underfilling a flip-chip semiconductor device

Abstract: A flip-chip semiconductor device (70) is formed by mounting a semiconductor die (20) to a wiring substrate (30). The wiring substrate includes a hole (39). An underfill encapsulation material (52) is dispensed around an entire perimeter of the semiconductor die. The underfill encapsulation material then flows toward the center of the die, expelling any trapped air through hole (39) of the wiring substrate to avoid voiding. By providing a method which utilizes an entire perimeter dispense, manufacturing time of the underfilling step is significantly reduced. At the same time, a uniform fillet is formed and the formation of voids in the underfill encapsulation material is avoided due to the presence of hole (39) in the wiring substrate. Multiple die (100) can also be underfilled using a single dispensing operation in accordance with the invention.